台灣積體電路製造股份有限公司(台積電)台積電

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=4213&source=1111&tags=2024DomesticCampus_1111 Description: 因為期待無限可能，所以選擇台積。 台積致力於營造具挑戰性、可以持續學習而又有樂趣的工作環境，提供同業平均水準以上的薪酬與福利。 加入台積，您將與世界一流的優秀夥伴共事，透過最先進的製程技術，成就改變世界的大事，所有突破與創新，都有一份我們的努力。 歡迎「志同道合」的你，透過〝線上應徵〝事先註冊履歷，符合資格者，將享有優先面試的機會唷！ 如您對台積電校園徵才感興趣， 我們替各位準備了三場次線上說明會(3/22、3/29、4/2)。 報名連結：請點我 (採線上報名，報名成功後將由台積電招募團隊審核後由系統發送e-mail通知，可重複報名不同場次) 歡迎同學們報名參加，以掌握台積趨勢、組織概況與求職撇步！ ▋歡迎志同道合的夥伴，一起加入台積 ▋世界上的每一個夢，都由我們來圓夢 TSMC offers a wide variety of fulfilling careers and opportunities across our organization in many different locations. By joining TSMC, you will work with the best team in the industry and achieve your full potential through a comprehensive and systemized learning program here. We are devoted to achieving technology advancement, pursuing manufacturing excellence, and optimizing customer service. If you are interested in joining TSMC, don’t miss our 〝TSMC Campus Recruitment Online Briefing Session〝, which will include the introduction of our company, industry trend, career opportunities, and life at TSMC. The sessions will be held on Mar 22, Mar 29, and Apr 2. Registration link: click here *TSMC Talent Acquisition Team will send a notification email to eligible applicants who have successfully registered to the event. 2024 TSMC 校園熱門職缺 Campus Recruitment Job : R&D (研究與發展組織專區) 1-1 【2024 Campus Recruitment】TSMC R&D Engineer 1-2 【2024 Campus Recruitment】TSMC DTP Engineer 1-3 【2024 Campus Recruitment】TSMC MtM RD Engineer 1-4 【2024 Campus Recruitment】TSMC IIP Engineer 1-5 【2024 Campus Recruitment】TSMC Pathfinding for System Integration Engineer Operations (營運組織專區) 2-1 【2024 Campus Recruitment】TSMC Process Integration Engineer 2-2 【2024 Campus Recruitment】TSMC Process Engineer 2-3 【2024 Campus Recruitment】TSMC Equipment Engineer 2-4 【2023 Campus Recruitment】TSMC Intelligent Manufacturing Engineer 2-5 【2024 Campus Recruitment】TSMC Facility Engineer 2-6 【2024 Campus Recruitment】TSMC Product Engineer 2-7 【2024 Campus Recruitment】TSMC Advanced Packaging & Testing Engineer 2-8 【2024 Campus Recruitment】TSMC Module Associate Engineer 2-9【2024 Campus Recruitment】TSMC Technician Strategy & Supporting (策略暨支援組織專區) 3-1 【2024 Campus Recruitment】TSMC IT Engineer 3-2 【2024 Campus Recruitment】TSMC Quality & Reliability Engineer 3-3 【2024 Campus Recruitment】TSMC Corporate Planning Organization 3-4 【2024 Campus Recruitment】TSMC Materials Management & Risk Management Engineer 3-5 【2024 Campus Recruitment】TSMC Human Resources Specialist 3-6 【2024 Campus Recruitment】TSMC Finance & Accounting Specialist Qualifications: 上述職缺歡迎2024年學碩博應屆畢業生或可於2024年底到職者，主修電機、電子、光電、電信、物理、材料、化學、化工、機械、資工、資管、工工、環工、財會、管理、人資、勞工關係、心理等相關科系者尤佳。 【履歷填寫重點提醒】 1. 投遞履歷，請務必優先填寫完成：「畢業學校、科系、畢業年份」，系統資料送出後，收到面試邀請前，內文可以持續更新 2. 務必詳細填寫履歷資料，包含學歷、專業關鍵字與自傳等資訊，若您非外籍人士，除專業關鍵字外，其他欄位請以全中文填寫。 3. 自傳與專業關鍵字欄位有字數限制 (1000字)，請確認填寫字數，以免造成網頁無法成功送出。 4. 若履歷欄位型式為下拉式選單，請勿自行輸入資料，以免資料無法正確送出。 更多2024校園徵才招募活動資訊，請密切關注台積電FB粉絲專頁 @加入台積 共創奇蹟 【Notes】 1. Please prioritize completing the 〝Graduation School, major, and graduation year〝 sections when submitting your resume. You can continue to update the content before receiving an interview invitation after the system data has been submitted. 2. Please click “Apply” and provide detailed resume information, including your education level, profession (with keywords that best describe your domain expertise) and autobiography, etc. If you are not a foreigner, please fill out the form (except for the keywords) in Mandarin. 3. Please make sure that the total work counts of your autobiography and keywords (domain description) are within a maximum of 1,000 characters respectively to prevent technical issues. For more information about the 2024 campus recruitment activities, please search TSMC FB fan page @加入台積 共創奇蹟

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=4274&source=1111&tags=2024DomesticCampus_1111 Description: R&D Engineers will be part of a grand joint-force working on advanced technologies, including but not limited to exploratory research in advanced device architecture, market-oriented design IP enablement, device and process integration for manufacturability, package-level interconnect solutions, and novel material/equipment/process evaluations. 1. Research & Pathfinding (1) New material and new process pathfinding to enable new device architecture with integration (2) New tool pathfinding for new materials to enable the next nodes (3) Design, execute and analyze experiments to meet R&D engineering specifications (4) Process stability & manufacturability improvement for yield and reliability qualification (5) Process/tool transfer to development R&D or volume manufacturing (Fab) (6) Highly motivated individuals with a strong technical background and teamwork skills 2. Integration (1) Technology definition: design rules, design-technology co-optimization, logic/memory IP evaluations, etc. (2) Technology development infrastructure: productivity enhancement, product inspection methodology, mask-making, and test flow, etc. (3) New test vehicle establishment and validation: improvement of device yield and reliability (learning cycles). Improve yield and reduce defects by quantifying defect attributes using programming skills and developing effective detection methodologies. (4) Customer design enablement: SPICE Modeling and IP qualifications. 3. Module (1) Develop advanced processes, materials, tools, models, and computational methodologies for leading edge technologies. (2) Deliver manufacturable, stable, cost-effective technologies with device performance improvement for yield and reliability qualification. (3) Transfer process and tool to high volume manufacturing fab. 4. R&D Process Center (1) PE: Advanced module process development and baseline sustaining. (2) EE: Handle advanced equipment at R&D stage. Install, warm up, sustain and troubleshooting solve with new technology equipment. (3) MFG: Oversee the daily operations of IC foundry to ensure that all profiling operations, workflow, and customer reports are consistent with agreed upon service operations. Qualifications: 1. Passionate about the development of world-leading technologies. 2. Master‘s degree or above in an engineering or scientific field such as Materials Science Engineering, Electrical Engineering, Chemical Engineering, Mechanical Engineering, Physics, Chemistry or Optics. 3. Solid technical understanding of IC processing equipment, integrated flow, chemistry, and physics. 4. Exhibit good and open communication skills and be able to work within cross-functional teams, including internal and external partners. 5. Fluent in English. 6. Skills in AI and programming are preferred. 7. Strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles. Having knowledge of machine learning or artificial intelligence is an added advantage. 8. Flexibility in changing priorities and responsibilities to support business needs. 9. Hands-on participation on process or hardware and a strong sense of ownership. 10. Willing to make frequent fab presence. 11. Strong technical problem-solving and analytical skills, based upon fundamental, rather than empirical models is required. 12. Excellent written and spoken communication skills are required.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=4281&source=1111&tags=2024DomesticCampus_1111 Description: 1. Master Nano Diffusion, Thin Film, Lithography, Etching, or Metrology equipment 2. Sustain and troubleshoot issues with high-tech equipment 3. Improve and enhance the efficiency and productivity of equipment 4. Plan and execute the analysis or defect detection projects 5. Communicate with cross-functional engineers or vendors 機台是工廠穩定運作的基礎，我們在生產線上，負責高端精密、高單價半導體設備的維護、保養並判斷、解決機台發生的問題；如此可減少機台當機的時間與提升機台可運轉的時間，進而降低生產成本並提升公司的獲利能力。 Qualifications: 1. Bachelor‘s degree or above in Electronics, Electrical Engineering, Mechanical and Automation Engineering related fields 2. No experience required. However, experience in equipment maintenance or improvement is a plus. 3. Have basic mechanical-related knowledge. Having the semiconductor processes knowledge is a plus 4. Good problem-solving skills, communication ability, team spirit, active learning attitude and is fluent in English 在這個領域發光發熱，要具備：電機、電子、機械與自動化工程等知識，還需要有良好的溝通能力、團隊合作精神、創新的問題解決能力

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=4289&source=1111&tags=2024DomesticCampus_1111 Description: 1. Development and integration of Factory Automation Systems, or 2. Development and integration of Advanced Technology, or 3. Development and integration of Office Automation Systems, or 4. Development and integration of Cloud Computing, Kubernates or BigData Analytics Systems, or 5. Build/Development Scalable Platform for managing container applications. Qualifications: 1. Major in IT, Computer Engineering, Software Engineering, Computer Science or related fields. 2. Familiar with development of C/C++ or JAVA Programming, or 3. Familiar with Microservices Architecture Pattern, DevOps or 4. Familiar with Web Applications for PC and Mobiles, or 5. Familiar with Hadoop, Spark and Parallel Computing. 6. The ones with multiple above skill sets and experience is a plus. 7. Experience in large-scale system integration, cloud computing, social networking for factory automation is a plus. 8. Self-motivated, integrity, and result-oriented personality.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=4672&source=1111 Description 1. Define advanced testing hardware technology architecture. 2. Create world-class method and role model tech structured problem solving. 3. Conduct advanced electrical/mechanical/thermal analysis and PI/SI improvement. 4. Be a focal contact between customer and tsmc testing for test validation and release to production. 5. Exhibit good and open communication skills, be able to work within cross-functional teams. Qualifications 1. Master‘s degree or above in Electrical/Electronic engineering. 2. Experience in power management or High speed/RF circuit design including schematic/layout/testing will be a plus. 3. Familiar with measurement equipments and simulation tools (HFSS, SIWave, Designer). 4. Familiar with PCB manufacture process and material knowledge. 5. Knowledge for high speed/frequency waveform (e.g., Eyemask/TDR/S11/S21) and power integrity (e.g., PDN/IR-Drop). 6. A valid Taiwan disability certificate.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=4673&source=1111 Description 1. Be responsible for test program development of logic SOC device, mixed-signal, RF/5G mmWave, PMIC. (digital & analogy) 2. Be a focal contact between customer and tsmc testing for test validation and release to production. 3. Collaboration for test optimization and test efficiency improvement. 4. Test yield improvement with process engineers to solve the yield related problems by process optimization. 5. Leading edge test technology development. 6. Test program development and project management from NPI phase to MP phase. Qualifications 1. Master‘s degree or above in Electrical/Electronic engineering, Computer engineering, Communication, Optical electronics or related field. 2. Exhibit good and open communication skills, be able to work within cross-functional teams. 3. Semiconductor testing concept and experience. 4. A valid Taiwan disability certificate.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址： https://careers.tsmc.com/careers/JobDetail?jobId=4670&source=1111 【Job Responsibilities】 1. 在製程部門，協助工程師處理線上事務，包含產品異常處置與機台異常復歸(與設備工程師協調合作)，追蹤與執行工程師交接事項 2. 在量測部門，協助工程師維護量測程式，量測資料異常確認，量測機台異常復歸(與設備工程師協調合作)，追蹤與執行工程師交接事項 3. 在檢測部門，操作電子顯微鏡拍照並針對拍攝的缺陷照片進行分類，檢測機台異常復歸(與設備工程師協調合作)，追蹤與執行工程師交接事項 4. 採四班二輪制：工作兩天，休息兩天 5. 須輪班：依部門而異，3~5個月夜班、3~5個月日班 6. 班別工作區間(含休息時間)：日班-7:20AM~7:20PM；夜班-7:20PM~翌日7:20AM 7. 日班總月薪約32,000 元；夜班總月薪約 43,000 元；另享有分紅獎金，平均年薪達70 萬元以上 【Job Qualifications】 1. 高中(職)以上畢業，不限科系 2. 細心、團隊溝通能力、自我學習能力、邏輯思考能力 3. 基本英文能力(機台介面)、Office 基本操作 4. 無經驗可，有相關經驗者尤佳 5. 自報到日起於竹科訓練3至9個月，期滿後回歸高雄廠區 6. 關於高雄廠地理位置：Google地圖[南部科學園區高雄第三園區] (1) 捷運站前第一排上下班超方便，15分鐘抵高雄最熱鬧巨蛋商圈 (2) 10分鐘抵左營高鐵站，盡享台灣一日生活圈， 40分鐘抵小港國際機場，世界任我行

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=4663&source=1111 The role is responsible for leading and managing the team to deliver excellent customer service and achieve high customer satisfaction levels. Description 1. Develop and implement customer service strategies, policies, and procedures that align with the company‘s goals and objectives. 2. Understand customer‘s business goal, lead and manage the team to track the execution, and take the initiative to work out a solution with the team should an issue occurs. 3. Collaborate with other departments to ensure that customer service is integrated into all aspects of the business. 4. Develop and maintain relationships with key customers and stakeholders. 5. Lead the communication with customer on abnormal events. Qualifications 1. Strong leadership and management skills. 2. Excellent communication and interpersonal skills. 3. Proven capabilities in program management and cross-team collaboration is required. 4. More than 15 years of experience in semiconductor industries is required. Experience in process integration, device, product engineering, circuit design or advanced packaging is preferred. 5. Experience in customer-related management is preferred.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=4665&source=1111 Description 1. Manage the process for collecting, analyzing, and interpreting people data and turn data into insights. 2. Conduct reports with specific analytic initiatives to articulate internal people questions and support HR strategy, operations, and projects. 3. As a partner to empower BPs to analyze and interpret people data independently. 4. Continuously search for new data sources relevant to advanced analytics models of the people in TSMC for business purposes. 5. Continuously improve the efficiency and effectiveness of the process for collecting, analyzing, and interpreting people data. 6. Other duties as assigned. Qualifications 1. Bachelor‘s degree in a relevant field such as statistics, data analytics, or social science. 2. 6+ years of HR experience, including at least 2 years of experience in a data analysis role within a corporate HR setting. 3. Knowledge of project management methodologies. 4. Strong analytical skills and ability to interpret and communicate results accurately and efficiently. 5. Excellent communication skills. 6. Ability to work independently and collaboratively in a fast-paced environment. 7. Knowledge of survey design is preferred. 8. Proficient in Excel, Word, and PowerPoint. 9. Proficient in English.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=4664&source=1111 Description This role is based in Employee Communications and Relations (ECR) Division within Human Resources with a focus on internal communications, content creation and management, and project-based assignments, including: 1. Work closely with various stakeholders on developing and executing communications plans for corporate initiatives. 2. Develop compelling story-telling through crafting articles, graphics, images, and videos which resonate with internal audiences globally 3. Assist in communication of messages from senior leadership. 4. Manage internal events. 5. Support various employee communications projects and campaigns. Qualifications 1. Experience (1) Bachelor‘s degree or above majoring in Communications, Marketing, Public Relations, Journalism, HR, Business Management, Graphic Design, or other related background (2) At least 5-10 years of working experience in communications, marketing, website design and management, public relations, and project management (3) Proven track record of project management from project initiation to completion (4) Experience in digital communications, preferably in global intranet design and development, including content and management. 2. Hard skills (1) Excellent writing, editing, and proofreading skills in both English and Chinese (2) Proficient in written communication with the ability to express ideas clearly. (3) Good knowledge of Microsoft Office, including Excel, Words, and PowerPoint (4) Knowledge of HTML a plus 3. Soft skills (1) Good communications and interpersonal skills with strong multitasking capabilities (2) Result-driven and detail-oriented (3) Good sense of judgement and aesthetics (4) Able to work under pressure and independently. (5) High motivation with can-do attitude and willingness to learn. (6) Must be proactive and a good team player.