台灣積體電路製造股份有限公司(台積電)台積電

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=4213&source=1111&tags=2024DomesticCampus_1111 Description: 因為期待無限可能，所以選擇台積。 台積致力於營造具挑戰性、可以持續學習而又有樂趣的工作環境，提供同業平均水準以上的薪酬與福利。 加入台積，您將與世界一流的優秀夥伴共事，透過最先進的製程技術，成就改變世界的大事，所有突破與創新，都有一份我們的努力。 歡迎「志同道合」的你，透過〝線上應徵〝事先註冊履歷，符合資格者，將享有優先面試的機會唷！ 如您對台積電校園徵才感興趣， 我們替各位準備了三場次線上說明會(3/22、3/29、4/2)。 報名連結：請點我 (採線上報名，報名成功後將由台積電招募團隊審核後由系統發送e-mail通知，可重複報名不同場次) 歡迎同學們報名參加，以掌握台積趨勢、組織概況與求職撇步！ ▋歡迎志同道合的夥伴，一起加入台積 ▋世界上的每一個夢，都由我們來圓夢 TSMC offers a wide variety of fulfilling careers and opportunities across our organization in many different locations. By joining TSMC, you will work with the best team in the industry and achieve your full potential through a comprehensive and systemized learning program here. We are devoted to achieving technology advancement, pursuing manufacturing excellence, and optimizing customer service. If you are interested in joining TSMC, don’t miss our 〝TSMC Campus Recruitment Online Briefing Session〝, which will include the introduction of our company, industry trend, career opportunities, and life at TSMC. The sessions will be held on Mar 22, Mar 29, and Apr 2. Registration link: click here *TSMC Talent Acquisition Team will send a notification email to eligible applicants who have successfully registered to the event. 2024 TSMC 校園熱門職缺 Campus Recruitment Job : R&D (研究與發展組織專區) 1-1 【2024 Campus Recruitment】TSMC R&D Engineer 1-2 【2024 Campus Recruitment】TSMC DTP Engineer 1-3 【2024 Campus Recruitment】TSMC MtM RD Engineer 1-4 【2024 Campus Recruitment】TSMC IIP Engineer 1-5 【2024 Campus Recruitment】TSMC Pathfinding for System Integration Engineer Operations (營運組織專區) 2-1 【2024 Campus Recruitment】TSMC Process Integration Engineer 2-2 【2024 Campus Recruitment】TSMC Process Engineer 2-3 【2024 Campus Recruitment】TSMC Equipment Engineer 2-4 【2023 Campus Recruitment】TSMC Intelligent Manufacturing Engineer 2-5 【2024 Campus Recruitment】TSMC Facility Engineer 2-6 【2024 Campus Recruitment】TSMC Product Engineer 2-7 【2024 Campus Recruitment】TSMC Advanced Packaging & Testing Engineer 2-8 【2024 Campus Recruitment】TSMC Module Associate Engineer 2-9【2024 Campus Recruitment】TSMC Technician Strategy & Supporting (策略暨支援組織專區) 3-1 【2024 Campus Recruitment】TSMC IT Engineer 3-2 【2024 Campus Recruitment】TSMC Quality & Reliability Engineer 3-3 【2024 Campus Recruitment】TSMC Corporate Planning Organization 3-4 【2024 Campus Recruitment】TSMC Materials Management & Risk Management Engineer 3-5 【2024 Campus Recruitment】TSMC Human Resources Specialist 3-6 【2024 Campus Recruitment】TSMC Finance & Accounting Specialist Qualifications: 上述職缺歡迎2024年學碩博應屆畢業生或可於2024年底到職者，主修電機、電子、光電、電信、物理、材料、化學、化工、機械、資工、資管、工工、環工、財會、管理、人資、勞工關係、心理等相關科系者尤佳。 【履歷填寫重點提醒】 1. 投遞履歷，請務必優先填寫完成：「畢業學校、科系、畢業年份」，系統資料送出後，收到面試邀請前，內文可以持續更新 2. 務必詳細填寫履歷資料，包含學歷、專業關鍵字與自傳等資訊，若您非外籍人士，除專業關鍵字外，其他欄位請以全中文填寫。 3. 自傳與專業關鍵字欄位有字數限制 (1000字)，請確認填寫字數，以免造成網頁無法成功送出。 4. 若履歷欄位型式為下拉式選單，請勿自行輸入資料，以免資料無法正確送出。 更多2024校園徵才招募活動資訊，請密切關注台積電FB粉絲專頁 @加入台積 共創奇蹟 【Notes】 1. Please prioritize completing the 〝Graduation School, major, and graduation year〝 sections when submitting your resume. You can continue to update the content before receiving an interview invitation after the system data has been submitted. 2. Please click “Apply” and provide detailed resume information, including your education level, profession (with keywords that best describe your domain expertise) and autobiography, etc. If you are not a foreigner, please fill out the form (except for the keywords) in Mandarin. 3. Please make sure that the total work counts of your autobiography and keywords (domain description) are within a maximum of 1,000 characters respectively to prevent technical issues. For more information about the 2024 campus recruitment activities, please search TSMC FB fan page @加入台積 共創奇蹟

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=4274&source=1111&tags=2024DomesticCampus_1111 Description: R&D Engineers will be part of a grand joint-force working on advanced technologies, including but not limited to exploratory research in advanced device architecture, market-oriented design IP enablement, device and process integration for manufacturability, package-level interconnect solutions, and novel material/equipment/process evaluations. 1. Research & Pathfinding (1) New material and new process pathfinding to enable new device architecture with integration (2) New tool pathfinding for new materials to enable the next nodes (3) Design, execute and analyze experiments to meet R&D engineering specifications (4) Process stability & manufacturability improvement for yield and reliability qualification (5) Process/tool transfer to development R&D or volume manufacturing (Fab) (6) Highly motivated individuals with a strong technical background and teamwork skills 2. Integration (1) Technology definition: design rules, design-technology co-optimization, logic/memory IP evaluations, etc. (2) Technology development infrastructure: productivity enhancement, product inspection methodology, mask-making, and test flow, etc. (3) New test vehicle establishment and validation: improvement of device yield and reliability (learning cycles). Improve yield and reduce defects by quantifying defect attributes using programming skills and developing effective detection methodologies. (4) Customer design enablement: SPICE Modeling and IP qualifications. 3. Module (1) Develop advanced processes, materials, tools, models, and computational methodologies for leading edge technologies. (2) Deliver manufacturable, stable, cost-effective technologies with device performance improvement for yield and reliability qualification. (3) Transfer process and tool to high volume manufacturing fab. 4. R&D Process Center (1) PE: Advanced module process development and baseline sustaining. (2) EE: Handle advanced equipment at R&D stage. Install, warm up, sustain and troubleshooting solve with new technology equipment. (3) MFG: Oversee the daily operations of IC foundry to ensure that all profiling operations, workflow, and customer reports are consistent with agreed upon service operations. Qualifications: 1. Passionate about the development of world-leading technologies. 2. Master‘s degree or above in an engineering or scientific field such as Materials Science Engineering, Electrical Engineering, Chemical Engineering, Mechanical Engineering, Physics, Chemistry or Optics. 3. Solid technical understanding of IC processing equipment, integrated flow, chemistry, and physics. 4. Exhibit good and open communication skills and be able to work within cross-functional teams, including internal and external partners. 5. Fluent in English. 6. Skills in AI and programming are preferred. 7. Strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles. Having knowledge of machine learning or artificial intelligence is an added advantage. 8. Flexibility in changing priorities and responsibilities to support business needs. 9. Hands-on participation on process or hardware and a strong sense of ownership. 10. Willing to make frequent fab presence. 11. Strong technical problem-solving and analytical skills, based upon fundamental, rather than empirical models is required. 12. Excellent written and spoken communication skills are required.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=4281&source=1111&tags=2024DomesticCampus_1111 Description: 1. Master Nano Diffusion, Thin Film, Lithography, Etching, or Metrology equipment 2. Sustain and troubleshoot issues with high-tech equipment 3. Improve and enhance the efficiency and productivity of equipment 4. Plan and execute the analysis or defect detection projects 5. Communicate with cross-functional engineers or vendors 機台是工廠穩定運作的基礎，我們在生產線上，負責高端精密、高單價半導體設備的維護、保養並判斷、解決機台發生的問題；如此可減少機台當機的時間與提升機台可運轉的時間，進而降低生產成本並提升公司的獲利能力。 Qualifications: 1. Bachelor‘s degree or above in Electronics, Electrical Engineering, Mechanical and Automation Engineering related fields 2. No experience required. However, experience in equipment maintenance or improvement is a plus. 3. Have basic mechanical-related knowledge. Having the semiconductor processes knowledge is a plus 4. Good problem-solving skills, communication ability, team spirit, active learning attitude and is fluent in English 在這個領域發光發熱，要具備：電機、電子、機械與自動化工程等知識，還需要有良好的溝通能力、團隊合作精神、創新的問題解決能力

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=4289&source=1111&tags=2024DomesticCampus_1111 Description: 1. Development and integration of Factory Automation Systems, or 2. Development and integration of Advanced Technology, or 3. Development and integration of Office Automation Systems, or 4. Development and integration of Cloud Computing, Kubernates or BigData Analytics Systems, or 5. Build/Development Scalable Platform for managing container applications. Qualifications: 1. Major in IT, Computer Engineering, Software Engineering, Computer Science or related fields. 2. Familiar with development of C/C++ or JAVA Programming, or 3. Familiar with Microservices Architecture Pattern, DevOps or 4. Familiar with Web Applications for PC and Mobiles, or 5. Familiar with Hadoop, Spark and Parallel Computing. 6. The ones with multiple above skill sets and experience is a plus. 7. Experience in large-scale system integration, cloud computing, social networking for factory automation is a plus. 8. Self-motivated, integrity, and result-oriented personality.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=4973&source=1111 Description: 1. Implement benefits plan that align with company goals and objectives. 2. Develop and maintain policies and procedures related to compensation and benefits programs that comply with legal and regulatory requirements. 3. Collaborate with Legal, Finance and other teams to provide input for corporate governance related disclosure. 4. Develop and maintain positive relationships with internal and external vendors, such as insurance providers. 5. Support to prepare reports and presentations on compensation and benefits programs for corporate governance events. Qualifications: 1. Bachelor‘s degree in Human Resources, Business Administration, or related field. 2. 5 to 10 years of working experience in HR, including experiences in compensation & benefit is preferred. 3. Excellent written and verbal communication skills in English. 4. Strong analytical and presentation skills and attention to details. 5. Knowledge of regulations related to compensation and benefits. 6. Ability to work independently and collaboratively with others.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=4972&source=1111 Description: 1. Collect and analyze global data from various sources and systems related to Compensation and Benefits. 2. Collaborate with cross-functional teams to understand data needs and provide solutions. 3. Design and develop interactive dashboards and reports using Tableau and other relevant tools and technologies. 4. Identify and recommend process improvements to streamline data collection and analysis. 5. Develop and maintain data quality checks and ensure data integrity. Qualifications: 1. Master‘s degree in Computer Science, Information Management, or related field. 2. Minimum of 10 years of experience in global data analysis and reporting, with a preference for experience in HR compensation and benefits consulting. 3. Proficiency in Tableau, Excel, SQL, and data visualization tools. 4. Strong analytical skills with experience in statistical analysis, data visualization, and reporting. 5. Ability to translate business problems into data-driven solutions. 6. Strong presentation skills to effectively communicate data analysis insights to audiences with different backgrounds. 7. Excellent verbal and written communication skills in English.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=4971&source=1111 Description: 1. Manage project plans and timelines for engagement projects. 2. Collaborate with cross-functional teams to ensure project goals are met. 3. Manage project risks, issues, and changes. 4. Develop and maintain strong relationships with stakeholders and project sponsors. 5. Monitor project progress and provide regular updates to stakeholders. 6. Ensure project documentation is up to date and accurate. 7. Ensure compliance with company policies and procedures. 8. Other duties as assigned. Qualifications: 1. Master’s degree in a relevant field such as Human Resource Management, Psychology, Organization Studies, or social science. 2. 6+ years of HR experience, including 3+ years of experience in human resources roles in the corporate. 3. Analytical skills and ability to interpret and communicate results accurately. 4. Excellent project management, communication and interpersonal skills. 5. Ability to work independently and collaboratively in a fast-paced environment. 6. Proficient in Excel, Word, and PowerPoint. 7. Proficient in Chinese and English. 8. Knowledge of survey design and administration is preferred. 9. Proficiency in project management tools and software is preferred.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=4970&source=1111 Description: 1. Analyze global business processes and identify opportunities for improvement. 2. Design and implement global process integration solutions and optimize system integration. 3. Develop and creating system documentation, including system specifications, process flow diagrams, gap analysis. 4. Work collaboratively with developers, project managers, and business stakeholders to design and implement system solutions. 5. Create, maintain, and monitor system security roles and functionality used by the organization. Qualifications: 1. Master’s degree in computer science, Information Management, or related field. 2. 5~10 years of experience in business process analysis and digital systems. 3. 5+ years working experience in C&B, or HRIS field. 4. Experience with global resources across multiple geographic locations is a plus. 5. Knowledge of business process modeling languages (e.g., BPMN) and digital HR systems. 6. Strong conceptual thinking and project management skill. 7. Strong communication skills. 8. English communication skills, verbal and written.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=4968&source=1111 Job Description 1. Manage company‘s treasury cash and construct the overall asset allocation strategy. 2. Manage asset managers and mandate portfolios. Closely work with external managers to build investment portfolios, maintain constant dialog, monitor portfolio performance, and make necessary rebalance based on the market conditions. 3. Identify fixed income investment opportunities that align with company‘s return/risk profile and provide recommendations to senior management. 4. Conduct thorough research and analysis of global economy and fixed income securities. Develop interest rate view and implement it into company‘s investment strategy. 5. Work with risk management/accounting/legal/internal audit to ensure all practices complies with relevant policies, regulation, and accounting treatment. Job Qualifications 1. 5-10 years of experience in fixed income investment or research. 2. BA degree in finance/investment related field, MBA preferred. 3. Proficiency in financial modeling, financial analysis, and accounting. 4. Strong quantitative skills are a plus. 5. Team oriented with good presentation and communication skills. 6. Fluent in English.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=4964&source=1111 開發與整合半導體製造設備軟體，跨部門以及相關設備廠商合作，確保設備控制解決方案在整個製造流程中可良好整合與擴充。 Description 1. Design and Deliver: 開發高品質與高容錯的半導體製造設備，於開發過程中優先考慮控制精確度與實際生產力。 2. Collaborate for Integration: 與設備/製程工程團隊、設備供應廠商和IT團隊合作。使用 SEMI 標準（SECS/GEM、EDA）設計介面和資料傳輸解決方案。 3. Optimize and Troubleshoot: 分析資料和日誌以找出問題、最佳化自動化開發流程，並最大限度地減少停機時間。 為操作人員和工程師提供技術支援。 Team Development: 指導設備軟體工程師團隊，設定明確的工作期望與目標，促進知識共享，並積極提升團隊成長。 4. Drive Innovation: 分析現有設備控制與自動化解決方案，提出創新的概念以增進整體效率和品質。 Qualifications 必須具備經驗: 1. 學歷: 資訊工程、機械、電機或相關專業領域學士學位。 2. 兩年以上設備軟體開發經驗。 3. 熟悉C/++。 4. 具備設備控制與韌體開發相關知識與經驗，熟悉SCADA與設備相關協定(SECS/GEM, Modbus, OPC-UA, etc.)。 期望技能: 1. 具有半導體製造與設備的相關經驗。 2. 熟悉半導體領域的軟體工具與框架。 3. 具有sensors, drivers, controllers等等通訊協定的開發經驗。 個人特質: 1. 具有彈性的思維並具有針對複雜問題排除問題的能力。 2. 優秀的溝通和團隊合作能力。 3. 獨立性強，可靈活面對各種問題。 其他資訊: 1. On-call 需求: 每2~3個月須要remote值班一週 2. 招募流程: (1) 主管面談 (2) Hackerrank程式測驗 (3) 廠區適性和英文測驗 (多益或托福成績可以替代英文測驗) (4) HR面談 (5) 主管二面 (視情況) (6) 技術面試 (視情況)