Five Considerations to Prepare Data Centers for High-Density Computing

The recent surge in artificial intelligence and machine learning has intensified demand for high-density data centers with complex power and cooling requirements. To meet this demand, operators can upgrade their legacy data centers but only after careful assessment of the requirements, including five considerations:

1. Infrastructure Assessment
   A comprehensive assessment of your current infrastructure is crucial before installing high-density computing. Check if your current power and cooling systems can support increased density and demand. You will need to upgrade your cooling infrastructure to manage the higher thermal loads associated with the high-density computing hardware. Various options are currently available to support this upgrade:

   Direct-to-Chip Cooling: Direct-to-chip cooling is a method for cooling computer chips such as CPUs or GPUs. It works by directly transferring heat from the chip to a cooling system. This process involves a specialized cooling mechanism, usually a liquid or a refrigerant, which directly contacts the chip’s surface. This leads to efficient heat transfer and dissipation, as the cooling medium quickly absorbs and removes the heat produced by the chip.

   Immersion Cooling: Immersion cooling is a process where components are submerged in a non-conductive liquid coolant, such as mineral oil or fluorocarbon-based fluids. This coolant rapidly absorbs heat from the immersed components, effectively keeping their low temperatures. Immersion cooling can significantly lower energy use and increase overall efficiency because it removes the need for traditional air-cooling systems.

   Active Rear Door Cooling: Active rear door cooling can efficiently lower the temperature of computer equipment. It involves installing a fan unit on the rear door of server cabinets. The fan draws in cool air from outside and directs it into the cabinet through a cooling coil. The air passes through the equipment, absorbing heat, then pushes through the cabinet’s front. This cooling technique prevents hot and cold air from mixing by introducing cool air from the rear, optimizing cooling efficiency and reducing energy use.

   Modifications will also be necessary to allow for increased power consumption at the rack and server levels. Structural assessments are needed to confirm that the existing weight load capacity of the asset can support the new equipment loads within the smaller footprint.

2. Compatibility and Integration
   Ensure the supplemental cooling technology you select is compatible with your current or new hardware and infrastructure. Look out for potential integration challenges or limitations that may affect the successful implementation of high-density computing in your legacy data center.
3. Scalability and Future-Proofing
   Consider the scalability and long-term sustainability of the solution. Determine if the new cooling technology can support future growth and expansion plans. It is essential to have a solution that can accommodate increasing computing demands as your business evolves and your requirements change.
4. Energy Efficiency
   These new cooling technologies can offer enhanced energy efficiency compared with traditional cooling methods. Evaluate the energy efficiency of various cooling solutions and consider potential cost savings in a Total Cost of Ownership model, which can be achieved through less power consumption. The selection of the cooling technology should aim to optimize power usage and maximize cooling performance.
5. Maintenance and Support
   Consider the maintenance requirements and availability of support services. Ensure you have access to reliable technical support and maintenance for your cooling solution. This is vital for maintaining the reliability and performance of your high-density computing environment.

These five considerations can ensure that your decision-making is thorough and meets the necessary requirements for deploying high-density computing in your legacy data center assets.