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MediaTek has launched the Dimensity 8250 chipset, a slightly improved version of its Dimensity 8200. It’s aimed at so-called flagship-killers and premium mid-range devices. As its name suggests, it’s a step down from the Dimensity 8300 launched last year. This could be Mediatek’s answer to the powerful Snapdragon 7+ Gen 3, or even the 8s Gen 3 (pending benchmarks).
Dimensity 8250 shares CPU and GPU configuration with the 8200
The MediaTek Dimensity 8250 has multiple similarities compared to the 8200. It uses the same TSMC 4nm manufacturing process, ensuring efficiency. It also appears to have the same CPU and GPU configuration. There is 1x Cortex-A78 core clocked at 3,1GHz, another 3x Cortex-A78 cores clocked at 3,0 GHz, and 4x Cortex-A55 cores clocked at 2,0 GHz.
As for the GPU, it retains the same Mali-G610 MC6 (6-core) with MediaTek HyperEngine support. While the configuration is the same as the Dimensity 8200 launched in late 2022, it still offers very capable performance in its range. The chipset supports quad-channel LPDDR5 RAM (up to 6,400Mbps) and UFS 3.1 storage.
Supports camera sensors up to 320MP and native AV1 decoding
Regarding support for camera technologies, the integrated ISP supports 14-bit HDR processing. It is capable of handling one sensor of up to 320MP, or three 32MP + 32MP + 32MP sensors working simultaneously. Additionally, it enables 4K/60fps recording and AV1 decoding at the hardware level.
The MediaTek Dimensity 8250 allows manufacturers to mount WHQD+ (120Hz) or Full HD+ (180Hz) displays on their mobile devices. It also enables real-time image enhancement technologies. For example, there is HDR10+ Adaptive and AI-powered conversion of SDR content to HDR.
More efficient AI processing
Speaking of AI, these tasks are handled by the MediaTek 580 APU. The company claims that it has made optimizations to its APU to reduce power consumption. Of course, there is a 5G modem, which can reach theoretical download speeds of up to 4,7Gbps. The wireless connectivity section also includes Bluetooth 5.3 and Wi-Fi 6E support.
Lastly, the OPPO Reno 12 is expected to be the first device powered by the Dimensity 8250 chipset. OPPO will officially announce it on May 25 along with a Pro version.