WCSS0418V1P-133AC datasheet(4/17 Pages) WEIDA | 256K x 18 Synchronous-Pipelined Cache RAM
Electronic Components Datasheet Search
  English  ▼

Delete All
ON OFF
ALLDATASHEET.COM

X  

WCSS0418V1P-133AC Datasheet(PDF) 4 Page - Weida Semiconductor, Inc.

Part # WCSS0418V1P-133AC
Description  256K x 18 Synchronous-Pipelined Cache RAM
Download  17 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  WEIDA [Weida Semiconductor, Inc.]
Direct Link  http://www.weida.com.my/website/
Logo WEIDA - Weida Semiconductor, Inc.

WCSS0418V1P-133AC Datasheet(HTML) 4 Page - Weida Semiconductor, Inc.

  WCSS0418V1P-133AC Datasheet HTML 1Page - Weida Semiconductor, Inc. WCSS0418V1P-133AC Datasheet HTML 2Page - Weida Semiconductor, Inc. WCSS0418V1P-133AC Datasheet HTML 3Page - Weida Semiconductor, Inc. WCSS0418V1P-133AC Datasheet HTML 4Page - Weida Semiconductor, Inc. WCSS0418V1P-133AC Datasheet HTML 5Page - Weida Semiconductor, Inc. WCSS0418V1P-133AC Datasheet HTML 6Page - Weida Semiconductor, Inc. WCSS0418V1P-133AC Datasheet HTML 7Page - Weida Semiconductor, Inc. WCSS0418V1P-133AC Datasheet HTML 8Page - Weida Semiconductor, Inc. WCSS0418V1P-133AC Datasheet HTML 9Page - Weida Semiconductor, Inc. Next Button
Zoom Inzoom in Zoom Outzoom out
 4 / 17 page
background image
WCSS0418V1P
Document #: 38-05247
Page 4 of 17
Introduction
Functional Overview
All synchronous inputs pass through input registers controlled
by the rising edge of the clock. All data outputs pass through
output registers controlled by the rising edge of the clock. Max-
imum access delay from the clock rise (tCO) is 3.5 ns (166-MHz
device).
The WCSS0418V1P supports secondary cache in systems
utilizing either a linear or interleaved burst sequence. The in-
terleaved burst order supports Pentium and i486 processors.
The linear burst sequence is suited for processors that utilize
a linear burst sequence. The burst order is user selectable,
and is determined by sampling the MODE input. Accesses can
be initiated with either the Processor Address Strobe (ADSP)
or the Controller Address Strobe (ADSC). Address advance-
ment through the burst sequence is controlled by the ADV in-
put. A two-bit on-chip wraparound burst counter captures the
first address in a burst sequence and automatically increments
the address for the rest of the burst access.
Byte write operations are qualified with the Byte Write Enable
(BWE) and Byte Write Select (BW[1:0]) inputs. A Global Write
Enable (GW) overrides all byte write inputs and writes data to
all four bytes. All writes are simplified with on-chip synchro-
nous self-timed write circuitry.
Three synchronous Chip Selects (CE1, CE2, CE3) and an
asynchronous Output Enable (OE) provide for easy bank se-
lection and output three-state control. ADSP is ignored if CE1
is HIGH.
Single Read Accesses
This access is initiated when the following conditions are sat-
isfied at clock rise: (1) ADSP or ADSC is asserted LOW, (2)
CE1, CE2, CE3 are all asserted active, and (3) the write signals
(GW, BWE) are all deasserted HIGH. ADSP is ignored if CE1
is HIGH. The address presented to the address inputs (A[17:0])
is stored into the address advancement logic and the Address
Register while being presented to the memory core. The cor-
responding data is allowed to propagate to the input of the
Output Registers. At the rising edge of the next clock the data
is allowed to propagate through the output register and onto
the data bus within 3.5 ns (166-MHz device) if OE is active
LOW. The only exception occurs when the SRAM is emerging
from a deselected state to a selected state, its outputs are
always three-stated during the first cycle of the access. After
the first cycle of the access, the outputs are controlled by the
OE signal. Consecutive single read cycles are supported.
Once the SRAM is deselected at clock rise by the chip select
and either ADSP or ADSC signals, its output will three-state
immediately.
Single Write Accesses Initiated by ADSP
This access is initiated when both of the following conditions
are satisfied at clock rise: (1) ADSP is asserted LOW, and (2)
CE1, CE2, CE3 are all asserted active. The address presented
to A[17:0] is loaded into the address register and the address
advancement logic while being delivered to the RAM core. The
write signals (GW, BWE, and BW[1:0]) and ADV inputs are ig-
nored during this first cycle.
ADSP-triggered write accesses require two clock cycles to
complete. If GW is asserted LOW on the second clock rise, the
data presented to the DQ[15:0] and DP[1:0] inputs is written into
the corresponding address location in the RAM core. If GW is
HIGH, then the write operation is controlled by BWE and
BW[1:0] signals. The WCSS0418V1P provides byte write ca-
pability that is described in the Write Cycle Description table.
Asserting the Byte Write Enable input (BWE) with the selected
Byte Write (BW[1:0]) input will selectively write to only the de-
sired bytes. Bytes not selected during a byte write operation
will remain unaltered. A synchronous self-timed write mecha-
nism has been provided to simplify the write operations.
ADSC
Input-
Synchronous
Address Strobe from Controller, sampled on the rising edge of CLK. When asserted LOW, A[17:0] is
captured in the address registers. A[1:0] are also loaded into the burst counter. When ADSP and
ADSC are both asserted, only ADSP is recognized.
ZZ
Input-
Asynchronous
ZZ “sleep” Input. This active HIGH input places the device in a non-time critical “sleep” condition
with data integrity preserved. Leaving ZZ floating or NC will default the device into an active state.
ZZ pin has an internal pull-down.
DQ[15:0]
DP[1:0]
I/O-
Synchronous
Bidirectional Data I/O lines. As inputs, they feed into an on-chip data register that is triggered by the
rising edge of CLK. As outputs, they deliver the data contained in the memory location specified by
A[17:0] during the previous clock rise of the read cycle. The direction of the pins is controlled by OE.
When OE is asserted LOW, the pins behave as outputs. When HIGH, DQ[15:0] and DP[1:0] are placed
in a three-state condition.
VDD
Power Supply
Power Supply inputs to the core of the device. Should be connected to 3.3V power supply.
VSS
Ground
Ground for the core of the device. Should be connected to ground of the system.
VDDQ
I/O Power
Supply
Power Supply for the I/O circuitry. Should be connected to a 3.3V or 2.5V power supply.
VSSQ
I/O Ground
Ground for the I/O circuitry. Should be connected to ground of the system.
MODE
Input-
Static
Selects Burst Order. When tied to GND selects linear burst sequence. When tied to VDDQ or left
floating selects interleaved burst sequence. This is a strap pin and should remain static during device
operation. When left floating or NC, defaults to interleaved burst order. Mode pin has an internal
pull-up.
NC
No Connects.
Pin Definitions (continued)
Name
I/O
Description


Similar Part No. - WCSS0418V1P-133AC

ManufacturerPart #DatasheetDescription
logo
Weida Semiconductor, In...
WCSS0418V1F WEIDA-WCSS0418V1F Datasheet
647Kb / 18P
   256K x 18 Synchronous 3.3V Cache RAM
WCSS0418V1F-100AC WEIDA-WCSS0418V1F-100AC Datasheet
647Kb / 18P
   256K x 18 Synchronous 3.3V Cache RAM
WCSS0418V1F-100AC WEIDA-WCSS0418V1F-100AC Datasheet
647Kb / 18P
   256K x 18 Synchronous 3.3V Cache RAM
WCSS0418V1F-100AI WEIDA-WCSS0418V1F-100AI Datasheet
647Kb / 18P
   256K x 18 Synchronous 3.3V Cache RAM
WCSS0418V1F-100AI WEIDA-WCSS0418V1F-100AI Datasheet
647Kb / 18P
   256K x 18 Synchronous 3.3V Cache RAM
More results

Similar Description - WCSS0418V1P-133AC

ManufacturerPart #DatasheetDescription
logo
Cypress Semiconductor
CY7C1327B CYPRESS-CY7C1327B Datasheet
596Kb / 17P
   256K x 18 Synchronous-Pipelined Cache RAM
CY7C1359A CYPRESS-CY7C1359A Datasheet
237Kb / 24P
   256K x 18 Synchronous-Pipelined Cache Tag RAM
CY7C1325B CYPRESS-CY7C1325B Datasheet
339Kb / 17P
   256K x 18 Synchronous 3.3V Cache RAM
logo
Weida Semiconductor, In...
WCSS0418V1F WEIDA-WCSS0418V1F Datasheet
647Kb / 18P
   256K x 18 Synchronous 3.3V Cache RAM
logo
Cypress Semiconductor
CY7C1325 CYPRESS-CY7C1325 Datasheet
270Kb / 16P
   256K x 18 Synchronous 3.3V Cache RAM
logo
Weida Semiconductor, In...
WCSS0436V1P WEIDA-WCSS0436V1P Datasheet
647Kb / 18P
   256K x 18 Synchronous 3.3V Cache RAM
logo
Integrated Silicon Solu...
IS61SP25616 ISSI-IS61SP25616 Datasheet
120Kb / 15P
   256K x 16, 256K x 18 SYNCHRONOUS PIPELINED STATIC RAM
logo
Motorola, Inc
MCM69T618 MOTOROLA-MCM69T618 Datasheet
177Kb / 10P
   64K x 18 Bit Synchronous Pipelined Cache Tag RAM
logo
Cypress Semiconductor
CY7C1339B CYPRESS-CY7C1339B Datasheet
529Kb / 17P
   128K x 32 Synchronous Pipelined Cache RAM
CY7C1329 CYPRESS-CY7C1329_04 Datasheet
352Kb / 15P
   64K x 32 Synchronous-Pipelined Cache RAM
More results


Html Pages

1  2  3  4  5  6  7  8  9  10  11  12  13  14  15  16  17 


Datasheet Download

Go To PDF Page


Link URL




Privacy Policy
ALLDATASHEET.COM
Does ALLDATASHEET help your business so far?  [ DONATE ] 

About Alldatasheet   |   Advertisement   |   Datasheet Upload   |   Contact us   |   Privacy Policy   |   Link Exchange   |   Manufacturer List
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com