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IST TSIC 206 APPLICATION NOTE Pdf Download | ManualsLib
Application Note Temperature Sensor IC 1. TSic 206/203/201/306/316/303/301 The TSic series of temperature sensor ICs are specifically designed as a low-power solution for temperature mea- surement in building automation, medical/pharma tech- nologies, industrial and mobile applications. The TSic pro- vides a simple temperature measurement and achieves outstanding accuracy combined with long term stability.
Lower temperature limit [= -50 °C] Supply voltage [V] Higher temperature limit [= +150 °C] Sig[V]: Analog/ratiometric output signal [V] 2. TSic 506F/503F/516/501F The TSic series of temperature sensor ICs are specifically designed as a low-power solution for temperature measurement in building auto- mation, medical / pharma technologies, indust- rial and mobile applications.
The TSic has a high precision bandgap reference with a PTAT (proportional-to-absolute-temperature) output, a low-po- wer and high-precision ADC and an on-chip DSP core with an EEPROM for the precisely calibrated output signal. The IST AG TSic sensor is fully tested and calibrated to ensure the guaranteed accuracy. Output Examples Temperature Range: -10 °C to +60 °C...
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5.2 Temperature Transmission Packet from a TSic The TSic transmits 1-byte packets. These packets consist of a start bit, 8 data bits, and a parity bit. The nominal baud rate is 8 kHz (125 µsec bit window). The signal is normally high. When a transmission occurs, the start bit occurs first followed by the data bits (MSB first, LSB last).
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4 different settings: 250 Hz, 10 Hz, 1 Hz, and 0.1 Hz. This is done during calibration of the sensor on IST AG side. The standard update rate is 10 Hz (TSic 206, TSic 306, TSic 506) or 1 Hz (TSic 716). For other update rates please contact IST AG.
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5.7 Solutions if Real Time System Cannot Tolerate the TSic Interrupting the µController Some real time systems cannot tolerate the TSic interrupting the µController. The µController must initiate the tempe- rature read. This can be accomplished by using another pin of the µController to supply V to the TSic.
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STRB: INCF TSTROBE,1 ;; INCREMENT TSTROBE BTFSC STATUS,Z ;; IF TSTROBE OVERFLOWED TO ZERO THEN GOTO ;; SOMETHING WRONG AND RETURN FROM INTERRUPT BTFSS PORTB,0 ;; LOOK FOR RISE ON ZAC WIRE GOTO STRB ;; IF RISE HAS NOT YET HAPPENED INCREMENT TSTROBE CLRF BIT_CNT ;;...
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NEXT_BYTE: INCF FSR,1 ;; INCREMENT THE INDF POINTER MOVLW LAST_LOC SUBWF FSR,0 ;; COMPARE FSR TO LAST_LOC BTFSS STATUS,Z ;; IF EQUAL THEN DONE GOTO WAIT_TLOW ;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;; ;; IF HERE YOU ARE DONE READING THE ZAC WIRE AND HAVE THE DATA ;; ;;...
6. Die and Package Specifications 6.1 SOP-8 The following dimensional drawings are for the TSic Series SOP-8 (SOIC Narrow, 0.150) package. See Table 1.1 and Table 1.2 on the next page for the dimensions labeled in these diagrams. Unless specified otherwise, dimensions are in inches.
6.3.1 Bare Die Pin Assignment Name Description Supply Voltage (3 V to 5.5 V) Signal Temperature Output Signal Gnd (V Ground Die Thickness: 390 µm Pad size: 68 µm x 68 µm The analog and digital power and ground of the chip are wired to same substrate or Flex-Pad: V and V are wired to V...
Innovative Sensor Technology IST AG, Stegrütistrasse 14, 9642 Ebnat-Kappel, Switzerland Phone: +41 71 992 01 00 | Fax: +41 71 992 01 99 | Email: info@ist-ag.com | www.ist-ag.com All mechanical dimensions are valid at 25 °C ambient temperature, if not differently indicated • All data except the mechanical dimensions only have information purposes and are not to be understood as assured characteristics • Technical changes without previous announcement as well as mistakes reserved •...