Two-Wire I�C Serial Interface Supports 400kHz Protocol Single Supply Voltage: to 5.5V for to 5.5V for M24Cxx-R Write Control Input BYTE and PAGE WRITE (up to 16 Bytes) RANDOM and SEQUENTIAL READ Modes Self-Timed Programming Cycle Automatic Address Incrementing Enhanced ESD/Latch-Up Protection More than 1 Million Erase/Write Cycles More than 40-Year Data Retention Packages � ECOPACK� (RoHS compliant)

Reference M24C01-R UFDFPN8 (MB) 2x3mm� (MLP) TSSOP8 (DS) 3x3mm� body size (MSOP) TSSOP8 (DW) 169 mil width Part Number M24C16-W

FEATURES SUMMARY. 1 Table 1. Product List. 1 Figure 1. Packages. 1 SUMMARY DESCRIPTION. 4 Figure 2. Logic Diagram. 4 Table 2. Signal Names. 4 Figure 3. 8-Pin Package Connections (Top View). 4 SIGNAL DESCRIPTION. 5 Serial Clock (SCL). 5 Serial Data (SDA). 5 Chip Enable E2). 5 Figure 4. Device Select Code. 5 Write Control (WC). 5 Supply voltage (VCC). 5 Operating supply voltage VCC. 5 Internal Device Reset. 5 Power-down. 5 Figure 5. Maximum RP Value versus Bus Parasitic Capacitance (C) for an I�C Bus. 6 Figure 6. I�C Bus Protocol. 6 Table 3. Device Select Code. 7 DEVICE OPERATION. 8 Start Condition. 8 Stop Condition. 8 Acknowledge Bit (ACK). 8 Data Input. 8 Memory Addressing. 8 Table 4. Operating Modes. 9 Figure 7. Write Mode Sequences with WC=1 (data write inhibited). 9 Write Operations. 10 Byte Write. 10 Page Write. 10 Figure 8. Write Mode Sequences with WC=0 (data write enabled). 11 Figure 9. Write Cycle Polling Flowchart using ACK. 12 Minimizing System Delays by Polling On ACK. 12 Figure 10.Read Mode Sequences. 13 Read Operations. 13 Random Address Read. 13 Current Address Read. 13 Sequential Read. 14 Acknowledge in Read Mode. 14

INITIAL DELIVERY STATE. 14 MAXIMUM RATING. 15 Table 5. Absolute Maximum Ratings. 15 DC and AC PARAMETERS. 16 Table 6. Operating Conditions (M24Cxx-W). 16 Table 7. Operating Conditions (M24Cxx-R). 16 Table 8. DC Characteristics (M24Cxx-W, Device Grade 6). 16 Table 9. DC Characteristics (M24Cxx-W, Device Grade 3). 17 Table 10. DC Characteristics (M24Cxx-R). 17 Table 11. AC Measurement Conditions. 17 Figure 11.AC Measurement I/O Waveform. 18 Table 12. Input Parameters. 18 Table 13. AC Characteristics (M24Cxx-W). 19 Table 14. AC Characteristics (M24Cxx-R). 19 Figure 12.AC Waveforms. 20 PACKAGE MECHANICAL. 21 Figure � 8 pin Plastic DIP, 0.25mm lead frame, Package Outline. 21 Table � 8 pin Plastic DIP, 0.25mm lead frame, Package Mechanical Data. 21 Figure 14.SO8 narrow � 8 lead Plastic Small Outline, 150 mils body width, Package Outline. 22 Table 16. SO8 narrow � 8 lead Plastic Small Outline, 150 mils body width, Package Mechanical Data. 22 Figure (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2x3mm�, Outline. 23 Table (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2x3mm�, Data. 23 Figure � 8 lead Thin Shrink Small Outline, Package Outline. 24 Table � 8 lead Thin Shrink Small Outline, Package Mechanical Data. 24 Figure � 8 lead Thin Shrink Small Outline, 3x3mm� body size, Package Outline. 25 Table � 8 lead Thin Shrink Small Outline, 3x3mm� body size, Mechanical Data. 25 PART NUMBERING. 26 Table 20. Ordering Information Scheme. 26 REVISION HISTORY. 27 Table 21. Document Revision History. 27