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M24C04-RMB3TP Datasheet(PDF) 26 Page - STMicroelectronics |
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M24C04-RMB3TP Datasheet(HTML) 26 Page - STMicroelectronics |
26 / 29 page M24C16, M24C08, M24C04, M24C02, M24C01 26/29 PART NUMBERING Table 23. Ordering Information Scheme Note: 1. ST strongly recommends the use of the Automotive Grade devices for use in an automotive environment. The High Reliability Cer- tified Flow (HRCF) is described in the quality note QNEE9801. Please ask your nearest ST sales office for a copy. 2. 2.5 to 5.5V devices bearing the process letter “W” or “G” in the package marking (on the top side of the package, on the right side, see Table 24.), guarantee a maximum write time of 5ms, instead of the standard 10ms. For more information about these devices, and their device identification, please ask your ST Sales Office for Process Change Notices PCN MPG/EE/0061 and 0062 (PCEE0061 and PCEE0062). 3. Used only for Device Grade 3 4. This range is Not for New Design, and will soon be replaced by the M24Cxx-W range. Example: M24C08 – W DW 6 T P /W Device Type M24 = I2C serial access EEPROM Device Function 16 = 16 Kbit (2048 x 8) 08 = 8 Kbit (1024 x 8) 04 = 4 Kbit (512 x 8) 02 = 2 Kbit (256 x 8) 01 = 1 Kbit (128 x 8) Operating Voltage blank 4 = VCC = 4.5 to 5.5V (400kHz) W 2 = VCC = 2.5 to 5.5V (400kHz) R = VCC = 1.8 to 5.5V (400kHz) Package BN = PDIP8 MN = SO8 (150 mil width) MB = UDFDFPN8 (MLP8) DW = TSSOP8 (169 mil width) DS = TSSOP8 (3x3mm² body size, MSOP8) Device Grade 6 = Industrial: device tested with standard test flow over –40 to 85 °C 3 = Automotive: device tested with High Reliability Certified Flow1 over –40 to 125 °C Option T = Tape & Reel Packing Plating Technology blank = Standard SnPb plating P = Lead-Free and RoHS compliant G = Lead-Free, RoHS compliant, Sb2O3-free and TBBA-free Process3 blank = F6SP20% /W = F6SP36% /G = F6SP36% |
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