Findchips: IBM0418A81XLAB-3F by IBM
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IBM0418A81XLAB-3F by: IBM

Standard SRAM, 512KX18, 1.8ns, CMOS, PBGA119, BGA-119

Part Details for IBM0418A81XLAB-3F by IBM

Overview of IBM0418A81XLAB-3F by IBM

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Part Details for IBM0418A81XLAB-3F

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IBM0418A81XLAB-3F Part Data Attributes

IBM0418A81XLAB-3F IBM
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IBM0418A81XLAB-3F IBM Standard SRAM, 512KX18, 1.8ns, CMOS, PBGA119, BGA-119
Pbfree Code No
Rohs Code No
Part Life Cycle Code Contact Manufacturer
Ihs Manufacturer IBM MICROELECTRONICS
Part Package Code BGA
Package Description BGA, BGA119,7X17,50
Pin Count 119
Reach Compliance Code unknown
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 1.8 ns
I/O Type COMMON
JESD-30 Code R-PBGA-B119
JESD-609 Code e0
Length 22 mm
Memory Density 9437184 bit
Memory IC Type STANDARD SRAM
Memory Width 18
Number of Functions 1
Number of Terminals 119
Number of Words 524288 words
Number of Words Code 512000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 512KX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA119,7X17,50
Package Shape RECTANGULAR
Package Style GRID ARRAY
Parallel/Serial PARALLEL
Power Supplies 1.5,2.5 V
Qualification Status Not Qualified
Seated Height-Max 2.679 mm
Standby Current-Max 0.1 A
Standby Voltage-Min 2.38 V
Supply Current-Max 0.43 mA
Supply Voltage-Max (Vsup) 2.75 V
Supply Voltage-Min (Vsup) 2.375 V
Supply Voltage-Nom (Vsup) 2.5 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 14 mm

Alternate Parts for IBM0418A81XLAB-3F

This table gives cross-reference parts and alternative options found for IBM0418A81XLAB-3F. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IBM0418A81XLAB-3F, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
CY7C1366C-250AXI Cache SRAM, 256KX36, 2.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, PLASTIC, MS-026, TQFP-100 Cypress Semiconductor IBM0418A81XLAB-3F vs CY7C1366C-250AXI
IBM0418A86SQKA-8F Standard SRAM, 512KX18, 4.5ns, CMOS, PQFP100, TQFP-100 IBM IBM0418A81XLAB-3F vs IBM0418A86SQKA-8F
K7B803625A-HC100 Cache SRAM, 256KX36, 10ns, CMOS, PBGA119, BGA-119 Samsung Semiconductor IBM0418A81XLAB-3F vs K7B803625A-HC100
CY7C1378C-250AXC ZBT SRAM, 256KX32, 2.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, PLASTIC, MS-026, TQFP-100 Cypress Semiconductor IBM0418A81XLAB-3F vs CY7C1378C-250AXC
CY7C1356BV25-250AC ZBT SRAM, 512KX18, 2.6ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 Cypress Semiconductor IBM0418A81XLAB-3F vs CY7C1356BV25-250AC
71V67803Z133BGG Cache SRAM, 512KX18, 4.2ns, CMOS, PBGA119, 14 X 22 MM, ROHS COMPLIANT, PLASTIC, MS-028AA, BGA-119 Integrated Device Technology Inc IBM0418A81XLAB-3F vs 71V67803Z133BGG
KM736V849T-50 ZBT SRAM, 256KX36, 3.2ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 Samsung Semiconductor IBM0418A81XLAB-3F vs KM736V849T-50
IS61NLP25636-100B ZBT SRAM, 256KX36, 5ns, CMOS, PBGA119, PLASTIC, BGA-119 Integrated Silicon Solution Inc IBM0418A81XLAB-3F vs IS61NLP25636-100B
UPD4382362GF-A75 Cache SRAM, 256KX36, 4ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, LQFP-100 NEC Electronics Group IBM0418A81XLAB-3F vs UPD4382362GF-A75
71V67803166BGG Cache SRAM, 512KX18, 3.5ns, CMOS, PBGA119, 14 X 22 MM, ROHS COMPLIANT, PLASTIC, MS-028AA, BGA-119 Integrated Device Technology Inc IBM0418A81XLAB-3F vs 71V67803166BGG

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