IBM0418A81ELAB-3N
vs
IBM0418A81QLAA-3
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Contact Manufacturer
End Of Life
Ihs Manufacturer
IBM MICROELECTRONICS
IBM MICROELECTRONICS
Part Package Code
BGA
BGA
Package Description
BGA, BGA119,7X17,50
BGA, BGA119,7X17,50
Pin Count
119
119
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
1.8 ns
1.7 ns
Clock Frequency-Max (fCLK)
270 MHz
I/O Type
COMMON
COMMON
JESD-30 Code
R-PBGA-B119
R-PBGA-B119
JESD-609 Code
e0
e0
Length
22 mm
22 mm
Memory Density
9437184 bit
9437184 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
18
18
Number of Functions
1
1
Number of Terminals
119
119
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
512KX18
512KX18
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA119,7X17,50
BGA119,7X17,50
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.679 mm
2.679 mm
Standby Current-Max
0.1 A
0.065 A
Standby Voltage-Min
3.14 V
3.14 V
Supply Current-Max
0.415 mA
0.45 mA
Supply Voltage-Max (Vsup)
3.63 V
3.63 V
Supply Voltage-Min (Vsup)
3.135 V
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
14 mm
14 mm
Base Number Matches
1
1
Compare IBM0418A81ELAB-3N with alternatives
Compare IBM0418A81QLAA-3 with alternatives