GSI Technology | GS73024AB-10I - Datasheet PDF & Tech Specs
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GS73024AB-10I

GS73024AB-10IGSI Technology


Description:

SRAM Chip Async Single 3.3V 3M-bit 128K x 24-bit 10ns 119-Pin FBGA Tray

Country of Origin:

Taiwan

Introduction date:

Jun 13, 1999

Updated: 29-AUG-2023


See moreSRAM Chip by GSI Technology

Online version: https://www.datasheets.com/part-details/gs73024ab-10i-gsi-technology-17204692

overviewOverview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCycleinfo
EU RoHS
noNo
RoHS Version
2011/65/EU, 2015/863
ECCNinfo
3A991.b.2.b
Automotive
noNo
Supplier Cage Codeinfo
3BKC7
HTSUSAinfo
8542320041
Schedule Binfo
8542320040
PPAP
noNo
AEC Qualified
noNo
Category Path
Semiconductor > Memory > Memory Chips > SRAM Chip

pdfDatasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

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packagePackage

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Basic Package Type
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Package Family Name
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Supplier Package
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Package Description
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Lead Shape
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Pin Count
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PCB
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Tabinfo
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Package Length (mm)info
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Package Width (mm)info
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Package Height (mm)info
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Seated Plane Height (mm)info
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Pin Pitch (mm)info
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Package Diameter (mm)
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Package Weight (g)
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Package Material
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Mounting
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Package Outline
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Package Overall Height (mm)
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Package Overall Width (mm)
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Package Overall Length (mm)
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Jedec
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manufacturingManufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

MSLinfo
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Maximum Reflow Temperature (°C)info
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Reflow Solder Time (Sec)info
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Reflow Temp. Source
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Maximum Wave Temperature (°C)info
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Wave Solder Time (Sec)info
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Wave Temp. Source
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Lead Finish(Plating)info
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Under Plating Materialinfo
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Terminal Base Materialinfo
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parametricParametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line
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Maximum Storage Temperature
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Minimum Storage Temperature
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Supplier Temperature Grade
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Process Technology
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I/O Mode
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Maximum Cycle Time
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Number of I/O Lines
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Read Latency
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Burst Length
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Function
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Density
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Timing Type
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Architecture
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Data Rate Architecture
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Maximum Clock Rate
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Maximum Access Time
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Number of Ports
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Number of Words
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Number of Bits per Word
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Typical Operating Supply Voltage
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Minimum Operating Supply Voltage
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Maximum Operating Supply Voltage
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Maximum Operating Current
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Address Bus Width
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Density in Bits
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Minimum Operating Temperature
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Maximum Operating Temperature
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GS73024AB-10I

GS73024AB-10IBy GSI Technology