E28F400CVT60

Description:	Flash Parallel 3.3V/5V 4M-bit 512K x 8/256K x 16 60ns 48-Pin TSOP
Manufacturer:	Intel
Introduction date:	Jul 1, 1997
Last Updated Date: +90
See moreFlash by Intel

Online version: https://www.datasheets.com/en/part-details/e28f400cvt60-intel-21064546

Overview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCycle

Premium

EU RoHS

RoHS Version

2011/65/EU, 2015/863

ECCN

EAR99

Automotive

Supplier Cage Code

4BA62

HTSUSA

8542320071

Schedule B

8542320070

Taxonomy Path
Semiconductor > Memory > Memory Chips > Flash

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Datasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

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Datasheet Preview

Package

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

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Basic Package Type

Package Family Name

Supplier Package

Package Description

Lead Shape

Pin Count

PCB

Tab

Package Length (mm)

Package Width (mm)

Package Height (mm)

Seated Plane Height (mm)

Pin Pitch (mm)

Package Diameter (mm)

Package Material

Mounting

Package Outline

Jedec

Manufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

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MSL

Maximum Reflow Temperature (°C)

Reflow Solder Time (Sec)

Reflow Temp. Source

Maximum Wave Temperature (°C)

Wave Solder Time (Sec)

Wave Temp. Source

Lead Finish(Plating)

Under Plating Material

Terminal Base Material

Parametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

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Product Line

Process Technology

Maximum Cycle Time

I/O Mode

Maximum Storage Temperature

Minimum Endurance

Minimum Storage Temperature

MMC Version

Supplier Temperature Grade

Simultaneous Read/Write Support

Erase Suspend/Resume Modes Support

ECC Support

Programmability

OE Access Time

Page Read Current

Program Current

Page Size

Command Compatible

Bank Size

Number of Banks

Support of Page Mode

Maximum Page Access Time

Support of Common Flash Interface

Density in Bits

Sector Size

Tradename

Density

Cell Type

Interface Type

Timing Type

Number of Words

Number of Bits per Word

Maximum Operating Frequency

Maximum Access Time

Maximum Erase Time

Maximum Programming Time

Typical Operating Supply Voltage

Minimum Operating Supply Voltage

Maximum Operating Supply Voltage

Architecture

Programming Voltage

Boot Block

Location of Boot Block

Maximum Operating Current

Block Organization

Address Bus Width

Minimum Operating Temperature

Maximum Operating Temperature

Crosses

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E28F400CVT60

Description:

Flash Parallel 3.3V/5V 4M-bit 512K x 8/256K x 16 60ns 48-Pin TSOP

Manufacturer:

Intel

Introduction date:

Overview

Datasheet

Datasheet Preview

Package

Manufacturing

Parametric

Crosses