Laser DC Reverse Voltage 7 2 V
Laser DC Forward Current 7 225 mA
Operating Case Temperature Range 75 75 ”C
Storage Case Temperature Range‘ 710 85 ”C
Photodiode dc Reverse Voltage 7 10 V
Photodiode dc Forward Current 7 2 mA
Thermistor Temperature 7 100 ”C
Thermoelectric Cooter in Heattng ModeJ 7 0.5 A
4For additional information and latest specifications, see our website: www.cyoptics.com
Wavelength-Selected, High-Power Data Sheet
D2547P-Type Isolated DFB Laser Modules March 2006
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are abso-
lute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess
of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended
periods can adversely affect device reliability.
1. Does not apply to shipping container.
2. Maximum 2000 hrs. at extreme conditions.
3. To prevent package over-temperature conditions.
Parameter Symbol Min Max Unit
Laser DC Reverse Voltage VRLMAX —2 V
Laser DC Forward Current IFLMAX — 225 mA
Operating Case Temperature Range TC–5 75 °C
Storage Case Temperature Range 1Tstg –40 85 2°C
Photodiode dc Reverse Voltage VRPDMAX —10 V
Photodiode dc Forward Current IFPDMAX —2 mA
Thermistor Temperature 3— — 100 °C
Thermoelectric Cooler in Heating Mode3ITEC —0.5 A
Handling Precautions
Power Sequencing
To avoid the possibility of damage to the laser module
from power supply switching transients, follow this
turn-on sequence:
1. All ground connections
2. Most negative supply
3. Most positive supply
4. All remaining connections
Reverse the order for the proper turn-off sequence.
Electrostatic Discharge
CAUTION: This device is susceptible to damage as
a result of electrostatic discharge. Take
proper precautions during both han-
dling and testing. Follow guidelines
such as JEDEC Publication No. 108-A
(Dec. 1988).
CyOptics employs a human-body model (HBM) for
ESD-susceptibility testing and protection-design evalu-
ation. ESD voltage thresholds are dependent on the
critical parameters used to define the model. A stan-
dard HBM (resistance = 1.5 kΩ, capacitance = 100 pF)
is widely used and, therefore, can be used for compari-
son purposes.
Mounting Instructions
The minimum fiber bend radius is 1.0 in. (25.4 mm).
To avoid degradation in performance, mount the mod-
ule on the board as follows:
1. Place the bottom flange of the module on a flat heat
sink at least 0.5 in. x 1.180 in. (12.7 mm x 30 mm) in
size. The surface finish of the heat sink should be
better than 32 µin. (0.8 µm), and the surface flatness
must be better than 0.001 in. (25.4 µm). Using ther-
mal conductive grease is optional; however, thermal
performance can be improved by up to 5% if conduc-
tive grease is applied between the bottom flange and
the heat sink.
2. Mount four #2-56 screws with Fillister heads
(M2-3 mm) at the four screw hole locations (see Out-
line Diagram). The Fillister head diameter must not
exceed 0.140 in. (3.55 mm). Do not apply more than
1 in.-lb. of torque to the screws.
Note: Dimensions are in inches and (millimeters).
Figure 3. Fillister Head Screw
0.118
(3.00)
0.062 (1.58)
0.140
(3.56)
0.031 (0.79)
0.129 (3.28) R
0.086
(2.18)
0.041 (1.04)
1-532(C)