Part | BTA06-700C |
Category | Discrete => Thyristors => Thyristors |
Title | 700 V, 6 A, SNUBBERLESS TRIAC, TO-220AB |
Description | |
Company | ST Microelectronics, Inc. |
Datasheet | Download BTA06-700C Datasheet |
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Specifications | |
Thyristor Type | Triac |
Pin Count | 3 |
VDRM | 700 volts |
IT(RMS) | 6 amps |
Standards and Certifications | RoHS |
Features, Applications |
FEATURES HIGH COMMUTATION : (dI/dt)c > 5A/ms without snubber HIGH SURGE CURRENT : ITSM = 60A VDRM TO 800V BTA Family : INSULATING VOLTAGE = 2500V(RMS) (UL RECOGNIZED : E81734) DESCRIPTION The BTA/BTB06 BW/CW triac family are high performance glass passivated chips technology. The SNUBBERLESSTM concept offer suppression of RC network and it is suitable for application such as phase control and static switching on inductive or resistive load. ABSOLUTE RATINGS (limiting values) Symbol IT(RMS) RMS on-state current (360� conduction angle) Non repetitive surge peak on-state current ( Tj initial ) I2t value Critical rate of rise of on-state current Gate supply = 500mA diG/dt = 1A/�s Parameter BTA BTB Storage and operating junction temperature range Maximum lead temperature for soldering during 4.5 mm from case Parameter 400 Symbol Rth (j-a) Junction to ambient BTA BTB Rth (j-c) AC Junction to case for 360� conduction angle F= 50 Hz) BTA BTB Parameter Value �C/W Unit �C/W Symbol Test Conditions Quadrant Suffix BW IGT VD=12V (DC) =33 Tj=25�C I-II-III MIN MAX VGT VGD tgt IL VD=12V (DC) Tj=125�C Tj=25�C I-II-III I-III II I-III IH * VTM * IDRM IRRM dV/dt * IT= 500mA gate open ITM= 8.5A tp= 380�s VDRM VRRM Rated Tj=25�C Tj=125�C MAX MIN TYP MAX MIN TYP Tj=125�C MIN TYP * For either polarity of electrode A2 voltage with reference to electrode A1.Linear slope VD =67%VDRM gate open Without snubber Package IT(RMS) A BTA (Insulated) 6 VDRM / VRRM V BTB (Uninsulated) Sensitivity Specification BW CW Fig.1 : Maximum RMS power dissipation versus RMS on-state current (F=50Hz). (Curves are cut off by (dI/dt)c limitation) Fig.2 : Correlation between maximum RMS power dissipation and maximum allowable temperatures (Tamb and Tcase) for different thermal resistances heatsink + contact (BTA). Fig.3 : Correlation between maximum RMS power dissipation and maximum allowable temperatures (Tamb and Tcase) for different thermal resistances heatsink + contact (BTB). |
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