BD242BFP

Description:	Trans GP BJT PNP 80V 3A 3-Pin(3+Tab) TO-220FP
Manufacturer:	STMicroelectronics
Country of Origin:	China
Introduction date:	Apr 16, 1998
Last Updated Date: +90
See moreGP BJT by STMicroelectronics

Online version: https://www.datasheets.com/part-details/bd242bfp-stmicroelectronics-16608952

Overview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCycle

Premium

EU RoHS

Yes with Exemption

RoHS Version

2011/65/EU

ECCN

EAR99

Automotive

Supplier Cage Code

SCR76

Schedule B

8541290080

PPAP

Category Path
Semiconductor > Diodes, Transistors and Thyristors > Bipolar Transistors > GP BJT

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Datasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

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Revision date:

Datasheet Preview

Package

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

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Basic Package Type

Package Family Name

Supplier Package

Package Description

Lead Shape

Pin Count

PCB

Tab

Package Length (mm)

Package Width (mm)

Package Height (mm)

Seated Plane Height (mm)

Pin Pitch (mm)

Package Diameter (mm)

Package Weight (g)

Package Material

Mounting

Package Outline

Package Overall Height (mm)

Package Overall Width (mm)

Package Overall Length (mm)

Manufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

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MSL

Maximum Reflow Temperature (°C)

Reflow Solder Time (Sec)

Maximum Wave Temperature (°C)

Wave Solder Time (Sec)

Wave Temp. Source

Lead Finish(Plating)

Under Plating Material

Terminal Base Material

Parametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

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Product Line

Typical Input Capacitance

Typical Output Capacitance

Maximum Collector Cut-Off Current

Maximum Emitter Cut-Off Current

Maximum Junction Ambient Thermal Resistance

Maximum Junction Case Thermal Resistance

Minimum Storage Temperature

Maximum Storage Temperature

Maximum Noise Figure

Maximum Delay Time

Maximum Rise Time

Maximum Turn-On Time

Maximum Storage Time

Maximum Fall Time

Maximum Turn-Off Time

Maximum Base Current

Operating Junction Temperature

Output Power

Maximum Collector-Emitter Saturation Voltage

Maximum Base Emitter Saturation Voltage

Supplier Temperature Grade

Maximum Diode Forward Voltage

Maximum Pulsed Collector Current

Process Technology

Minimum Transition Frequency

Typical Transition Frequency

Collector Current for VCE Saturation

Maximum Offset Voltage

Type

Configuration

Number of Elements per Chip

Maximum Collector Base Voltage

Maximum Emitter Base Voltage

Maximum Collector-Emitter Voltage

Maximum DC Collector Current

Maximum Power Dissipation

Material

Minimum DC Current Gain

Maximum Transition Frequency

BD242BFP

Manufacturer:STMicroelectronics

Tools/Calculators

BD242BFP

Description:

Trans GP BJT PNP 80V 3A 3-Pin(3+Tab) TO-220FP

Manufacturer:

STMicroelectronics

Country of Origin:

China

Introduction date:

Overview

Datasheet

Datasheet Preview

Package

Manufacturing

Parametric

BD242BFP