79RC32355 Datasheet by Renesas Electronics Corporation

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Features List

◆RC32300 32-bit Microprocessor

– Enhanced MIPS-II ISA

– Enhanced MIPS-IV cache prefetch instruction

– DSP Instructions

– MMU with 16-entry TLB

– 8KB Instruction Cache, 2-way set associative

– 2KB Data Cache, 2-way set associative

– Per line cache locking

– Write-through and write-back cache management

– Debug interface through the EJTAG port

– Big or Little endian support

◆Interrupt Controller

– Allows status of each interrupt to be read and masked

◆I2C

– Flexible I2C standard serial interface to connect to a variety of

peripherals

– Standard and fast mode timing support

– Configurable 7 or 10-bit addressable slave

◆UARTs

– Two 16550 Compatible UARTs

– Baud rate support up to 1.5 Mb/s

◆Counter/Timers

– Three general purpose 32-bit counter/timers

◆General Purpose I/O Pins (GPIOP)

– 36 individually programmable pins

– Each pin programmable as input, output, or alternate function

– Input can be an interrupt or NMI source

– Input can also be active high or active low

◆SDRAM Controller

– 2 memory banks, non-interleaved, 512 MB total

– 32-bit wide data path

– Supports 4-bit, 8-bit, and 16-bit wide SDRAM chips

– SODIMM support

– Stays on page between transfers

– Automatic refresh generation

◆Peripheral Device Controller

– 26-bit address bus

– 32-bit data bus with variable width support of 8-,16-, or 32-bits

– 8-bit boot ROM support

– 6 banks available, up to 64MB per bank

– Supports Flash ROM, PROM, SRAM, dual-port memory, and

peripheral devices

– Supports external wait-state generation, Intel or Motorola style

– Write protect capability

– Direct control of optional external data transceivers

◆System Integrity

– Programmable system watchdog timer resets system on time-

out

– Programmable bus transaction times memory and peripheral

transactions and generates a warm reset on time-out

◆DMA

– 16 DMA channels

– Services on-chip and external peripherals

– Supports memory-to-memory, memory-to-I/O, and I/O-to-I/O

transfers

– Supports flexible descriptor based operation and chaining via

linked lists of records (scatter / gather capability)

– Supports unaligned transfers

– Supports burst transfers

Block Diagram

Figure 1 RC32355 Internal Block Diagram

EJTAG MMU

D. Cache I. Cache

RC32300

CPU Core

ICE

Interrupt

Controller

3 Counter

Timers

Watchdog

Timer

10/100

Ethernet

Interface

USB

Interface

16 Channel

DMA

Controller

Arbiter

Ext. Bus

Master

SDRAM &

Device

Controller

2 UARTS

(16550)

GPIO

Interface

ATM

Interface

Memory &

Peripheral Bus

Ch. 1 Ch. 2

Serial Channels

GPIO Pins Utopia 1 / 2

Interface

Controller

TDM

TDM Bus

C Bus

79RC32355

IDTTM InterpriseTM Integrated

Communications Processor

2 of 47 May 25, 2004

IDT 79RC32355

◆USB

– Revision 1.1 compliant

– USB slave device controller

– Supports a 6th USB endpoint

– Full speed operation at 12 Mb/s

– Supports control, interrupt, bulk and isochronous endpoints

– Supports USB remote wakeup

– Integrated USB transceiver

◆TDM

– Serial Time Division Multiplexed (TDM) voice and data inter-

face

– Provides interface to telephone CODECs and DSPs

– Interface to high quality audio A/Ds and D/As with external

glue logic

– Support 1 to 128 8-bit time slots

– Compatible with Lucent CHI, GCI, Mitel ST-bus, K2 and SLD

busses

– Supports data rates of up to 8.192 Mb/s

– Supports internal or external frame generation

– Supports multiple non-contiguous active input and output time

slots

◆EJTAG

– Run-time Mode provides a standard JTAG interface

– Real-Time Mode provides additional pins for real-time trace

information

◆Ethernet

– Full duplex support for 10 and 100 Mb/s Ethernet

– IEEE 802.3u compatible Media Independent Interface (MII)

with serial management interface

– IEEE 802.3u auto-negotiation for automatic speed selection

– Flexible address filtering modes

– 64-entry hash table based multicast address filtering

◆ATM SAR

– Can be configured as one UTOPIA level 1 interface or 1

UTOPIA level 2 interface with 2 address lines (3 PHYs max)

– Supports 25Mb/s and faster ATM

– Supports UTOPIA data path interface operation at speeds up

to 33 MHz

– Supports standard 53-byte ATM cells

– Performs HEC generation and checking

– Cell processing discards short cells and clips long cells

– 16 cells worth of buffering

– UTOPIA modes: 8 cell input buffer and 8 cell output buffer

– Hardware support for CRC-32 generation and checking for

AAL5

– Hardware support for CRC-10 generation and checking

– Virtual caching receive mechanism supports reception of any

length packet without CPU intervention on up to eight simulta-

neously active receive channels

– Frame Mode transmit mechanism supports transmission of

any length packet without CPU intervention

◆System Features

– JTAG Interface (IEEE Std. 1149.1 compatible)

– 208 pin PQFP package

– 2.5V core supply and 3.3V I/O supply

– Up to 180 MHz pipeline frequency and up to 75 MHz bus

frequency

Figure 2 Example of xDSL Residential Gateway Using RC32355

SLIC

Codec

Echo

POTS telephone

RJ11

Ethernet Transceiver

MII I/F

DMA

Channels

USB

TDM

Timers

UART

Interrupt Ctl

RC32300 CPU Core

Data Buffers

SDRAM Ctl

Memory &

I/O Controller

ATM I / F

Ethernet MAC

Ethernet to PC

Clock

SDRAM

Memory & I/O

Transmission

Convergence

Data Pump

AFE

USB to PC

Debug port

32-bit Data Bus

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IDT 79RC32355

Device Overview

The RC32355 is a “System on a Chip” which contains a high perfor-

mance 32-bit microprocessor. The microprocessor core is used exten-

sively at the heart of the device to implement the most needed

functionalities in software with minimal hardware support. The high

performance microprocessor handles diverse general computing tasks

and specific application tasks that would have required dedicated hard-

ware. Specific application tasks implemented in software can include

routing functions, fire wall functions, modem emulation, ATM SAR

emulation, and others.

The RC32355 meets the requirements of various embedded commu-

nications and digital consumer applications. It is a single chip solution

that incorporates most of the generic system functionalities and applica-

tion specific interfaces that enable rapid time to market, very low cost

systems, simplified designs, and reduced board real estate.

CPU Execution Core

The RC32355 is built around the RC32300 32-bit high performance

microprocessor core. The RC32300 implements the enhanced MIPS-II

ISA and helps meet the real-time goals and maximize throughput of

communications and consumer systems by providing capabilities such

as a prefetch instruction, multiple DSP instructions, and cache locking.

The DSP instructions enable the RC32300 to implement 33.6 and

56kbps modem functionality in software, removing the need for external

dedicated hardware. Cache locking guarantees real-time performance

by holding critical DSP code and parameters in the cache for immediate

availability. The microprocessor also implements an on-chip MMU with a

TLB, making the it fully compliant with the requirements of real time

operating systems.

Memory and I/O Controller

The RC32355 incorporates a flexible memory and peripheral device

controller providing support for SDRAM, Flash ROM, SRAM, dual-port

memory, and other I/O devices. It can interface directly to 8-bit boot

ROM for a very low cost system implementation. It enables access to

very high bandwidth external memory (380 MB/sec peak) at very low

system costs. It also offers various trade-offs in cost / performance for

the main memory architecture. The timers implemented on the RC32355

satisfy the requirements of most RTOS.

DMA Controller

The DMA controller off-loads the CPU core from moving data among

the on-chip interfaces, external peripherals, and memory. The DMA

controller supports scatter / gather DMA with no alignment restrictions,

appropriate for communications and graphics systems.

TDM Bus Interface

The RC32355 incorporates an industry standard TDM bus interface

to directly access external devices such as telephone CODECs and

quality audio A/Ds and D/As. This feature is critical for applications, such

as cable modems and xDSL modems, that need to carry voice along

with data to support Voice Over IP capability.

Ethernet Interface

The RC32355 contains an on-chip Ethernet MAC capable of 10 and

100 Mbps line interface with an MII interface. It supports up to 4 MAC

addresses. In a SOHO router, the high performance RC32300 CPU core

routes the data between the Ethernet and the ATM interface. In other

applications, such as high speed modems, the Ethernet interface can be

used to connect to the PC.

USB Device Interface

The RC32355 includes the industry standard USB device interface to

enable consumer appliances to directly connect to the PC.

ATM SAR

The RC32355 includes a configurable ATM SAR that supports a

UTOPIA level 1 or a UTOPIA level 2 interface. The ATM SAR is imple-

mented as a hybrid between software and hardware. A hardware block

provides the necessary low level blocks (like CRC generation and

checking and cell buffering) while the software is used for higher level

SARing functions. In xDSL modem applications, the UTOPIA port inter-

faces directly to an xDSL chip set. In SOHO routers or in a line card for a

Layer 3 switch, it provides access to an ATM network.

Enhanced JTAG Interface for ICE

For low-cost In-Circuit Emulation (ICE), the RC32300 CPU core

includes an Enhanced JTAG (EJTAG) interface. This interface consists

of two operation modes: Run-Time Mode and Real-Time Mode.

The Run-Time Mode provides a standard JTAG interface for on-chip

debugging, and the Real-Time Mode provides additional status pins—

PCST[2:0]—which are used in conjunction with the JTAG pins for real-

time trace information at the processor internal clock or any division of

the pipeline clock.

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IDT 79RC32355

Thermal Considerations

The RC32355 consumes less than 2.5 W peak power. It is guaran-

teed in a ambient temperature range of 0° to +70° C for commercial

temperature devices and - 40° to +85° for industrial temperature

devices.

Revision History

March 29, 2001: Initial publication.

September 24, 2001: Removed references to DPI interface.

Removed references to “edge-triggered interrupt input” for GPIO pins.

Changed 208-pin package designation from DP to DH.

October 10, 2001: Revised AC timing characteristics in Tables 5, 6,

7, 8, 10, 12, and 15. Revised values in Table 18, “DC Electrical Charac-

teristics”; Table 20, “RC32355 Power Consumption”; and Figure 23,

“Typical Power Usage.” Changed data sheet from Preliminary to Final.

October 23, 2001: Revised Figure 23, “Typical Power Usage.”

November 1, 2001: Added Input Voltage Undershoot parameter and

a footnote to Table 21.

January 30, 2002: In Table 6, changed values from 1.5 to 1.2 for the

following signals: MDATA Tdo1, MADDR Tdo2, CASN Tdo3, CKENP

Tdo4, BDIRN Tdo5, BOEN Tdo6.

May 20, 2002: Changed values in Table 20, Power Consumption.

September 19, 2002: Added COLDRSTN Trise1 parameter to Table

5, Reset and System AC Timing Characteristics.

December 6, 2002: In Features section, changed UART speed from

115 Kb/s to 1.5 Mb/s.

December 17, 2002: Added VOH parameter to Table 18, DC Elec-

trical Characteristics.

January 27, 2004: Added 180MHz speed grade.

May 25, 2004: In Table 7, signals MIIRXCLK and MIITXCLK, the Min

and Max values for 10 Mbps Thigh1/Tlow1 were changed to 140 and

260 respectively and the Min and Max values for 100 Mbps Thigh1/

Tlow1 were changed to 14.0 and 26.0 respectively.

pe ] Low n5 BOENH]

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IDT 79RC32355

Pin Description Table

The following table lists the functions of the pins provided on the RC32355. Some of the functions listed may be multiplexed onto the same pin.

To define the active polarity of a signal, a suffix will be used. Signals ending with an “N” should be interpreted as being active, or asserted, when at

a logic zero (low) level. All other signals (including clocks, buses and select lines) will be interpreted as being active, or asserted when at a logic one

(high) level.

Note: The input pads of the RC32355 do not contain internal pull-ups or pull-downs. Unused inputs should be tied off to appropriate levels.

This is especially critical for unused control signal inputs (such as BRN) which, if left floating, could adversely affect the RC32355’s opera-

tion. Also, any input pin left floating can cause a slight increase in power consumption.

Name Type I/O Type Description

System

CLKP I Input System Clock input. This is the system master clock input. The RISCore 32300 pipeline frequency is a multiple (x2, x3, or

x4) of this clock frequency. All other logic runs at this frequency or less.

COLDRSTN I STI1Cold Reset. The assertion of this signal low initiates a cold reset. This causes the RC32355 state to be initialized, boot

configuration to be loaded, and the internal processor PLL to lock onto the system clock (CLKP).

RSTN I/O Low Drive

with STI

Reset. This bidirectional signal is either driven low or tri-stated, an external pull-up is required to supply the high state. The

RC32355 drives RSTN low during a reset (to inform the external system that a reset is taking place) and then tri-states it.

The external system can drive RSTN low to initiate a warm reset, and then should tri-state it.

SYSCLKP O High Drive System clock output. This is a buffered and delayed version of the system clock input (CLKP). All SDRAM transactions

are synchronous to this clock. This pin should be externally connected to the SDRAMs and to the RC32355 SDCLKINP pin

(SDRAM clock input).

Memory and Peripheral Bus

MADDR[25:0] O [21:0] High

Drive

[25:22] Low

Drive with

STI

Memory Address Bus. 26-bit address bus for memory and peripheral accesses. MADDR[20:17] are used for the

SODIMM data mask enables if SODIMM mode is selected.

MADDR[22] Primary function: General Purpose I/O, GPIOP[27].

MADDR[23] Primary function: General Purpose I/O, GPIOP[28].

MADDR[24] Primary function: General Purpose I/O, GPIOP[29].

MADDR[25] Primary function: General Purpose I/O, GPIOP[30].

MDATA[31:0] I/O High Drive Memory Data Bus. 32-bit data bus for memory and peripheral accesses.

BDIRN O High Drive External Buffer Direction. External transceiver direction control for the memory and peripheral data bus, MDATA[31:0]. It

is asserted low during any read transaction, and remains high during write transactions.

BOEN[1:0] O High Drive External Buffer Output Enable. These signals provide two output enable controls for external data bus transceivers on

the memory and peripheral data bus, MDATA. BOEN[0] is asserted low during external device read transactions. BOEN[1]

is asserted low during SDRAM read transactions.

BRN I STI External Bus Request. This signal is asserted low by an external master device to request ownership of the memory and

peripheral bus.

BGN O Low Drive External Bus Grant. This signal is asserted low by RC32355 to indicate that RC32355 has relinquished ownership of the

local memory and peripheral bus to an external master.

WAITACKN I STI Wait or Transfer Acknowledge. When configured as wait, this signal is asserted low during a memory and peripheral

device bus transaction to extend the bus cycle. When configured as transfer acknowledge, this signal is asserted low dur-

ing a memory and peripheral device bus transaction to signal the completion of the transaction.

CSN[5:0] O [3:0]

High Drive

[5:4]

Low Drive

Device Chip Select. These signals are used to select an external device on the memory and peripheral bus during device

transactions. Each bit is asserted low during an access to the selected external device.

CSN[4] Primary function: General purpose I/O, GPIOP[16].

CSN[5] Primary function: General purpose I/O, GPIOP[17].

Table 1 Pin Descriptions (Part 1 of 8)

pe 32355

6 of 47 May 25, 2004

IDT 79RC32355

RWN O High Drive Read or Write. This signal indicates if the transaction on the memory and peripheral bus is a read transaction or a write

transaction. A high level indicates a read from an external device, a low level indicates a write to an external device.

OEN O High Drive Output Enable. This signal is asserted low when data should be driven by an external device during device read transac-

tions on the memory and peripheral bus.

BWEN[3:0] O High Drive SDRAM Byte Enable Mask or Memory and I/O Byte Write Enables. These signals are used as data input/output masks

during SDRAM transactions and as byte write enable signals during device controller transactions on the memory and

peripheral bus. They are active low.

BWEN[0] corresponds to byte lane MDATA[7:0].

BWEN[1] corresponds to byte lane MDATA[15:8].

BWEN[2] corresponds to byte lane MDATA[23:16].

BWEN[3] corresponds to byte lane MDATA[31:24].

SDCSN[1:0] O High Drive SDRAM Chip Select. These signals are used to select the SDRAM device on the memory and peripheral bus. Each bit is

asserted low during an access to the selected SDRAM.

RASN O High Drive SDRAM Row Address Strobe. The row address strobe asserted low during memory and peripheral bus SDRAM transac-

tions.

CASN O High Drive SDRAM Column Address Strobe. The column address strobe asserted low during memory and peripheral bus SDRAM

transactions.

SDWEN O High Drive SDRAM Write Enable. Asserted low during memory and peripheral bus SDRAM write transactions.

CKENP O Low Drive SDRAM Clock Enable. Asserted high during active SDRAM clock cycles.

Primary function: General Purpose I/O, GPIOP[21].

SDCLKINP I STI SDRAM Clock Input. This clock input is a delayed version of SYSCLKP. SDRAM read data is sampled into the RC32355

on the rising edge of this clock.

ATM Interface

ATMINP[11:0] I STI ATM PHY Inputs. These pins are the inputs for the ATM interface.

ATMIOP[1:0] I/O Low Drive

with STI

ATM PHY Bidirectional Signals. These pins are the bidirectional pins for the ATM interface.

ATMOUTP[9:0] O Low Drive ATM PHY Outputs. These pins are the outputs for the ATM interface.

TXADDR[1:0] O Low Drive ATM Transmit Address [1:0]. 2-bit address bus used for transmission in Utopia-2 mode.

TXADDR[0] Primary function: General purpose I/O, GPIOP[22].

TXADDR[1] Primary function: General purpose I/O, GPIOP[23].

RXADDR[1:0] O Low Drive ATM Receive Address [1:0]. 2-bit address bus for receiving in Utopia-2 mode.

RXADDR[0] Primary function: General purpose I/O, GPIOP[24].

RXADDR[1] Primary function: General purpose I/O, GPIOP[25].

TDM Bus

TDMDOP O High Drive TDM Serial Data Output. Serial data is driven by the RC32355 on this signal during an active output time slot. During inac-

tive time slots this signal is tri-stated.

Primary function: General purpose I/O, GPIOP[32].

TDMDIP I STI TDM Serial Data Input. Serial data is received by the RC32355 on this signal during active input time slots.

Primary function: General purpose I/O, GPIOP[33].

TDMFP I/O High Drive TDM Frame Signal. A transition on this signal, the active polarity of which is programmable, delineates the start of a new

TDM bus frame. TDMFP is driven if the RC32355 is a master, and is received if it is a slave.

Primary function: General purpose I/O, GPIOP[34].

TDMCLKP I STI TDM Clock. This input clock controls the rate at which data is sent and received on the TDM bus.

Primary function: General purpose I/O, GPIOP[35].

Name Type I/O Type Description

Table 1 Pin Descriptions (Part 2 of 8)

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IDT 79RC32355

TDMTEN O Low Drive TDM External Buffer Enable. This signal controls an external tri-state buffer output enable connected to the TDM output

data, TDMDOP. It is asserted low when the RC32355 is driving data on TDMDOP.

Primary function: General Purpose I/O, GPIOP[26]

General Purpose Input/Output

GPIOP[0] I/O Low Drive

with STI

General Purpose I/O. This pin can be configured as a general purpose I/O pin.

Alternate function: UART channel 0 serial output, U0SOUTP.

GPIOP[1] I/O Low Drive

with STI

General Purpose I/O. This pin can be configured as a general purpose I/O pin.

Alternate function: UART channel 0 serial input, U0SINP.

GPIOP[2] I/O Low Drive

with STI

General Purpose I/O. This pin can be configured as a general purpose I/O pin.

1st Alternate function: UART channel 0 ring indicator, U0RIN.

2nd Alternate function: JTAG boundary scan tap controller reset, JTAG_TRST_N.

GPIOP[3] I/O Low Drive

with STI

General Purpose I/O. This pin can be configured as a general purpose I/O pin.

Alternate function: UART channel 0 data carrier detect, U0DCRN.

GPIOP[4] I/O Low Drive

with STI

General Purpose I/O. This pin can be configured as a general purpose I/O pin.

1st Alternate function: UART channel 0 data terminal ready, U0DTRN.

2nd Alternate function: CPU or DMA transaction indicator, CPUP.

GPIOP[5] I/O Low Drive

with STI

General Purpose I/O. This pin can be configured as a general purpose I/O pin.

Alternate function: UART channel 0 data set ready, U0DSRN.

GPIOP[6] I/O Low Drive

with STI

General Purpose I/O. This pin can be configured as a general purpose I/O pin.

Alternate function: UART channel 0 request to send, U0RTSN.

GPIOP[7] I/O Low Drive

with STI

General Purpose I/O.

This pin can be configured as a general purpose I/O pin.

Alternate function: UART channel 0 clear to send, U0CTSN.

GPIOP[8] I/O Low Drive

with STI

General Purpose I/O. This pin can be configured as a general purpose I/O pin.

1st Alternate function: UART channel 1 serial output, U1SOUTP.

2nd Alternate function: Active DMA channel code, DMAP[3].

GPIOP[9] I/O Low Drive

with STI

General Purpose I/O. This pin can be configured as a general purpose I/O pin.

1st Alternate function: UART channel 1 serial input, U1SINP.

2nd Alternate function: Active DMA channel code, DMAP[2].

GPIOP[10] I/O Low Drive

with STI

General Purpose I/O. This pin can be configured as a general purpose I/O pin.

1st Alternate function: UART channel 1 data terminal ready, U1DTRN.

2nd Alternate function: ICE PC trace status, EJTAG_PCST[0].

GPIOP[11] I/O Low Drive

with STI

General Purpose I/O. This pin can be configured as a general purpose I/O pin.

1st Alternate function: UART channel 1 data set ready, U1DSRN.

2nd Alternate function: ICE PC trace status, EJTAG_PCST[1].

GPIOP[12] I/O Low Drive

with STI

General Purpose I/O. This pin can be configured as a general purpose I/O pin.

1st Alternate function: UART channel 1 request to send, U1RTSN.

2nd Alternate function: ICE PC trace status, EJTAG_PCST[2].

GPIOP[13] I/O Low Drive

with STI

General Purpose I/O. This pin can be configured as a general purpose I/O pin.

1st Alternate function: UART channel 1 clear to send, U1CTSN.

2nd Alternate function: ICE PC trace clock, EJTAG_DCLK.

GPIOP[14] I/O Low Drive

with STI

General Purpose I/O. This pin can be configured as a general purpose I/O pin.

Alternate function: I2C interface data, SDAP.

GPIOP[15] I/O Low Drive

with STI

General Purpose I/O. This pin can be configured as a general purpose I/O pin.

Alternate function: I2C interface clock, SCLP.

GPIOP[16] I/O High Drive General Purpose I/O. This pin can be configured as a general purpose I/O pin.

Alternate function: Memory and peripheral bus chip select, CSN[4].

Name Type I/O Type Description

Table 1 Pin Descriptions (Part 3 of 8)

8 of 47 May 25, 2004

IDT 79RC32355

GPIOP[17] I/O High Drive General Purpose I/O. This pin can be configured as a general purpose I/O pin.

Alternate function: Memory and peripheral bus chip select, CSN[5].

GPIOP[18] I/O Low Drive

with STI

General Purpose I/O. This pin can be configured as a general purpose I/O pin.

Alternate function: External DMA device request, DMAREQN.

GPIOP[19] I/O Low Drive

with STI

General Purpose I/O. This pin can be configured as a general purpose I/O pin.

Alternate function: External DMA device done, DMADONEN.

GPIOP[20] I/O Low Drive

with STI

General Purpose I/O. This pin can be configured as a general purpose I/O pin.

Alternate function: USB start of frame, USBSOF.

GPIOP[21] I/O Low Drive

with STI

General Purpose I/O. This pin can be configured as a general purpose I/O pin.

Alternate function: SDRAM clock enable CKENP.

GPIOP[22] I/O Low Drive

with STI

General Purpose I/O. This pin can be configured as a general purpose I/O pin.

Alternate function: ATM transmit PHY address, TXADDR[0].

GPIOP[23] I/O Low Drive

with STI

General Purpose I/O. This pin can be configured as a general purpose I/O pin.

1st Alternate function: ATM transmit PHY address, TXADDR[1].

2nd Alternate function: Active DMA channel code, DMAP[0].

GPIOP[24] I/O Low Drive

with STI

General Purpose I/O. This pin can be configured as a general purpose I/O pin.

Alternate function: ATM receive PHY address, RXADDR[0].

GPIOP[25] I/O Low Drive

with STI

General Purpose I/O. This pin can be configured as a general purpose I/O pin.

1st Alternate function: ATM receive PHY address, RXADDR[1].

2nd Alternate function: Active DMA channel code, DMAP[1].

GPIOP[26] I/O Low Drive

with STI

General Purpose I/O. This pin can be configured as a general purpose I/O pin.

Alternate function: TDM external buffer enable, TDMTEN.

GPIOP[27] I/O Low Drive

with STI

General Purpose I/O. This pin can be configured as a general purpose I/O pin.

Alternate function: Memory and peripheral bus address, MADDR[22].

GPIOP[28] I/O Low Drive

with STI

General Purpose I/O. This pin can be configured as a general purpose I/O pin.

Alternate function: Memory and peripheral bus address, MADDR[23].

GPIOP[29] I/O Low Drive

with STI

General Purpose I/O. This pin can be configured as a general purpose I/O pin.

Alternate function: Memory and peripheral bus address, MADDR[24].

GPIOP[30] I/O Low Drive

with STI

General Purpose I/O. This pin can be configured as a general purpose I/O pin.

Alternate function: Memory and peripheral bus address, MADDR[25].

GPIOP[31] I/O Low Drive

with STI

General Purpose I/O. This pin can be configured as a general purpose I/O pin.

1ST Alternate function: DMA finished, DMAFIN.

2nd Alternate function: EJTAG/ICE reset, EJTAG_TRST_N.

GPIOP[32] I/O High Drive General Purpose I/O. This pin can be configured as a general purpose I/O pin.

Alternate function: TDM interface data output, TDMDOP. At reset, this pin defaults to the primary function, GPIOP[32].

GPIOP[33] I/O Low Drive

with STI

General Purpose I/O. This pin can be configured as a general purpose I/O pin.

Alternate function: TDM interface data input, TDMDIP. At reset, this pin defaults to the primary function, GPIOP[33].

GPIOP[34] I/O High Drive General Purpose I/O. This pin can be configured as a general purpose I/O pin.

Alternate function: TDM interface frame signal, TDMFP. At reset, this pin defaults to the primary function, GPIOP[34].

GPIOP[35] I/O Low Drive

with STI

General Purpose I/O. This pin can be configured as a general purpose I/O pin.

Alternate function: TDM interface clock, TDMCLKP. At reset, this pin defaults to the primary function, GPIOP[35].

DMA

DMAFIN O Low External DMA finished. This signal is asserted low by the RC32355 when the number of bytes specified in the DMA

descriptor have been transferred to or from an external device.

Primary function: General Purpose I/O, GPIOP[31]. At reset, this pin defaults to primary function GPIOP[31].

2nd Alternate function: EJTAG_TRST_N.

Name Type I/O Type Description

Table 1 Pin Descriptions (Part 4 of 8)

9 of 47 May 25, 2004

IDT 79RC32355

DMAREQN I STI External DMA Device Request. The external DMA device asserts this pin low to request DMA service.

Primary function: General purpose I/O, GPIOP[18]. At reset, this pin defaults to primary function GPIOP[18].

DMADONEN I STI External DMA Device Done. The external DMA device asserts this signal low to inform the RC32355 that it is done with

the current DMA transaction.

Primary function: General purpose I/O, GPIOP[19]. At reset, this pin defaults to primary function GPIOP[19].

USB

USBCLKP I STI USB Clock. 48 MHz clock input used as time base for the USB interface.

USBDN I/O USB USB D- Data Line. This is the negative differential USB data signal.

USBDP I/O USB USB D+ Data Line. This is the positive differential USB data signal.

USBSOF O Low Drive USB start of frame.

Primary function: General Purpose I/O, GPIOP[20]. At reset, this pin defaults to primary function GPIOP[20].

Ethernet

MIICOLP I STI MII Collision Detected. This signal is asserted by the ethernet PHY when a collision is detected.

MIICRSP I STI MII Carrier Sense. This signal is asserted by the ethernet PHY when either the transmit or receive medium is not idle.

MIIMDCP O Low Drive MII Management Data Clock. This signal is used as a timing reference for transmission of data on the management inter-

face.

MIIMDIOP I/O Low Drive

with STI

MII Management Data. This bidirectional signal is used to transfer data between the station management entity and the

ethernet PHY.

MIIRXCLKP I STI MII Receive Clock. This clock is a continuous clock that provides a timing reference for the reception of data.

MIIRXDP[3:0] I STI MII Receive Data. This nibble wide data bus contains the data received by the ethernet PHY.

MIIRXDVP I STI MII Receive Data Valid. The assertion of this signal indicates that valid receive data is in the MII receive data bus.

MIIRXERP I STI MII Receive Error. The assertion of this signal indicates that an error was detected somewhere in the ethernet frame cur-

rently being sent in the MII receive data bus.

MIITXCLKP I STI MII Transmit Clock. This clock is a continuous clock that provides a timing reference for the transfer of transmit data.

MIITXDP[3:0] O Low Drive MII Transmit Data. This nibble wide data bus contains the data to be transmitted.

MIITXENP O Low Drive MII Transmit Enable. The assertion of this signal indicates that data is present on the MII for transmission.

MIITXERP O Low Drive MII Transmit Coding Error. When this signal is asserted together with MIITXENP, the ethernet PHY will transmit symbols

which are not valid data or delimiters.

I2C

SCLP I/O Low Drive

with STI

I2C Interface Clock. An external pull-up is required on SCLP, see the I2C spec.2

Primary function: General purpose I/O, GPIOP[15]. At reset, this pin defaults to primary function GPIOP[15].

SDAP I/O Low Drive

with STI

I2C Interface Data Pin. An external pull-up is required on SDAP, see the I2C spec.2

Primary function: General purpose I/O, GPIOP[14]. At reset, this pin defaults to primary function GPIOP[14].

EJTAG

JTAG_TCK I STI JTAG Clock. This is an input test clock, used to shift data into or out of the boundary scan logic. This signal requires an

external resistor, listed in Table 16.

JTAG_TDI I STI JTAG Data Input. This is the serial data shifted into the boundary scan logic. This signal requires an external resistor,

listed in Table 16. This is also used to input EJTAG_DINTN during EJTAG/ICE mode. EJTAG_DINTN is an interrupt to

switch the PC trace mode off.

JTAG_TDO O Low Drive JTAG Data Output. This is the serial data shifted out from the boundary scan logic. When no data is being shifted out, this

signal is tri-stated. This signal requires an external resistor, listed in Table 16. This is also used to output the EJTAG_TPC

during EJTAG/ICE mode. EJTAG_TPC is the non-sequential program counter output.

Name Type I/O Type Description

Table 1 Pin Descriptions (Part 5 of 8)

pe led

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IDT 79RC32355

JTAG_TMS I STI JTAG Mode Select. This input signal is decoded by the tap controller to control test operation. This signal requires an

external resistor, listed in Table 16.

EJTAG_PCST[0] O Low Drive PC trace status. This bus gives the PC trace status information during EJTAG/ICE mode. EJTAG/ICE enable is selected

during reset using the boot configuration and overrides the selection of the Primary and Alternate functions. This signal

requires an external resistor, listed in Table 16.

Primary function: General Purpose I/O, GPIOP[10].

1st Alternate function: UART channel 1 data terminal ready, U1DTRN.

EJTAG_PCST[1] O Low Drive PC trace status. This bus gives the PC trace status information during EJTAG/ICE mode. EJTAG/ICE enable is selected

during reset using the boot configuration and overrides the selection of the Primary and Alternate functions. This signal

requires an external resistor, listed in Table 16.

Primary function: General Purpose I/O, GPIOP[11]. At reset, this pin defaults to primary function GPIOP[11].

1st Alternate function: UART channel 1 data set ready, U1DSRN.

EJTAG_PCST[2] O Low Drive PC trace status. This bus gives the PC trace status information during EJTAG/ICE mode. EJTAG/ICE enable is selected

during reset using the boot configuration and overrides the selection of the Primary and Alternate functions. This signal

requires an external resistor, listed in Table 16.

Primary function: General Purpose I/O, GPIOP[12].

1st Alternate function: UART channel 1 request to send, U1RTSN.

EJTAG_DCLK O Low Drive PC trace clock. This is used to capture address and data during EJTAG/ICE mode. EJTAG/ICE enable is selected during

reset using the boot configuration and overrides the selection of the Primary and Alternate functions. This signal requires

an external resistor, listed in Table 16.

Primary function: General Purpose I/O, GPIOP[13].

1st Alternate function: UART channel 1 clear to send, U1CTSN.

EJTAG_TRST_N I STI EJTAG Test Reset. EJTAG_TRST_N is an active-low signal for asynchronous reset of only the EJTAG/ICE controller.

EJTAG_TRST_N requires an external pull-up on the board. EJTAG/ICE enable is selected during reset using the boot con-

figuration and overrides the selection of the Primary and Alternate functions. This signal requires an external resistor, listed

in Table 16.

Primary: General Purpose I/O, GPIOP[31]

1st Alternate function: DMA finished output, DMAFIN.

JTAG_TRST_N I STI JTAG Test Reset. JTAG_TRST_N is an active-low signal for asynchronous reset of only the JTAG boundary scan control-

ler. JTAG_TRST_N requires an external pull-down on the board that will hold the JTAG boundary scan controller in reset

when not in use if selected. JTAG reset enable is selected during reset using the boot configuration and overrides the

selection of the Primary and Alternate functions.

Primary function: General Purpose I/O, GPIOP[2].

1st Alternate function: UART channel 0 ring indicator, U0RIN.

Debug

INSTP O Low Drive Instruction or Data Indicator. This signal is driven high during CPU instruction fetches and low during CPU data transac-

tions on the memory and peripheral bus.

CPUP O Low Drive CPU or DMA Transaction Indicator. This signal is driven high during CPU transactions and low during DMA transactions

on the memory and peripheral bus if CPU/DMA Transaction Indicator Enable is enabled. CPU/DMA Status mode enable is

selected during reset using the boot configuration and overrides the selection of the Primary and Alternate functions.

Primary function: General Purpose I/O, GPIOP[4].

1st Alternate function: UART channel 0 data terminal ready U0DTRN.

DMAP[0] O Low Drive Active DMA channel code. DMA debug enable is selected during reset using the boot configuration and overrides the

selection of the Primary and Alternate functions.

Primary function: General Purpose I/O, GPIOP[23].

1st Alternate function: TXADDR[1].

DMAP[1] O Low Drive Active DMA channel code. DMA debug enable is selected during reset using the boot configuration and overrides the

selection of the Primary and Alternate functions.

Primary function: General Purpose I/O, GPIOP[25].

1st Alternate function: RXADDR[1].

Name Type I/O Type Description

Table 1 Pin Descriptions (Part 6 of 8)

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IDT 79RC32355

DMAP[2] O Low Drive Active DMA channel code. DMA debug enable is selected during reset using the boot configuration and overrides the

selection of the Primary and Alternate functions.

Primary function: General Purpose I/O, GPIOP[9].

1st Alternate function: U1SINP.

DMAP[3] O Low Drive Active DMA channel code. DMA debug enable is selected during reset using the boot configuration and overrides the

selection of the Primary and Alternate functions.

Primary function: General Purpose I/O, GPIOP[8].

1st Alternate function: U1SOUTP.

UART

U0SOUTP I STI UART channel 0 serial transmit.

Primary function: General Purpose I/O, GPIOP[0]. At reset, this pin defaults to primary function GPIOP[0].

U0SINP I STI UART channel 0 serial receive.

Primary function: General Purpose I/O, GPIOP[1]. At reset, this pin defaults to primary function GPIOP[1].

U0RIN I STI UART channel 0 ring indicator.

Primary function: General Purpose I/O, GPIOP[2]. At reset, this pin defaults to primary function GPIOP[2] if JTAG reset

enable is not selected during reset using the boot configuration.

2nd Alternate function: JTAG boundary scan reset, JTAG_TRST_N.

U0DCRN I STI UART channel 0 data carrier detect.

Primary function: General Purpose I/O, GPIOP[3]. At reset, this pin defaults to primary function GPIOP[3].

U0DTRN O Low Drive UART channel 0 data terminal ready.

Primary function: General Purpose I/O, GPIOP[4]. At reset, this pin defaults to primary function GPIOP[4] if CPU/DMA Sta-

tus Mode enable is not selected during reset using the boot configuration.

2nd Alternate function: CPU or DMA transaction indicator, CPUP.

U0DSRN I STI UART channel 0 data set ready.

Primary function: General Purpose I/O, GPIOP[5]. At reset, this pin defaults to primary function GPIOP[5].

U0RTSN O Low Drive UART channel 0 request to send.

Primary function: General Purpose I/O, GPIOP[6]. At reset, this pin defaults to primary function GPIOP[6].

U0CTSN I STI UART channel 0 clear to send.

Primary function: General Purpose I/O, GPIOP[7]. At reset, this pin defaults to primary function GPIOP[7].

U0SOUTP O Low Drive UART channel 1 serial transmit.

Primary function: General Purpose I/O, GPIOP[8]. At reset, this pin defaults to primary function GPIOP[8] if DMA Debug

enable is not selected during reset using the boot configuration.

2nd Alternate function: DMA channel, DMAP[3].

U1SINP I STI UART channel 1 serial receive.

Primary function: General Purpose I/O, GPIOP[9]. At reset, this pin defaults to primary function GPIOP[9] if DMA Debug

enable is not selected during reset using the boot configuration.

2nd Alternate function: DMA channel, DMAP[2].

U1DTRN O Low Drive UART channel 1 data terminal ready.

Primary function: General Purpose I/O, GPIOP[10]. At reset, this pin defaults to primary function GPIOP[10] if ICE Interface

enable is not selected during reset using the boot configuration.

Alternate function: PC trace status bit 0, EJTAG_PCST[0].

U1DSRN I STI UART channel 1 data set ready.

Primary function: General Purpose I/O, GPIOP[11]. At reset, this pin defaults to primary function GPIOP[11] if ICE Interface

enable is not selected during reset using the boot configuration.

2nd Alternate function: PC trace status bit 1, EJTAG_PCST[1].

U1RTSN O Low Drive UART channel 1 request to send.

Primary function: General Purpose I/O, GPIOP[12]. At reset, this pin defaults to primary function GPIOP[12] if ICE Interface

enable is not selected during reset using the boot configuration.

2nd Alternate function: PC trace status bit 2, EJTAG_PCST[2].

Name Type I/O Type Description

Table 1 Pin Descriptions (Part 7 of 8)

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Boot Configuration Vector

The boot configuration vector is read into the RC32355 during cold reset. The vector defines parameters in the RC32355 that are essential to oper-

ation when cold reset is complete.

The encoding of boot configuration vector is described in Table 2, and the vector input is illustrated in Figure 6.

U1CTSN I STI UART channel 1 clear to send.

Primary function: General Purpose I/O, GPIOP[13]. At reset, this pin defaults to primary function GPIOP[13] if ICE Interface

enable is not selected during reset using the boot configuration.

2nd Alternate function: PC trace clock, EJTAG_DCLK.

1. Schmitt Trigger Input.

2. 2I2C - Bus Specification by Philips Semiconductors.

Signal Name/Description

MDATA[2:0] Clock Multiplier. This field specifies the value by which the system clock (CLKP) is multiplied internally to generate the CPU pipeline clock.

0x0 - multiply by 2

0x1 - multiply by 3

0x2 - multiply by 4

0x3 - reserved

0x4 - reserved

0x5 - reserved

0x6 - reserved

0x7 - reserved

MDATA[3] Endian. This bit specifies the endianness of RC32355.

0x0 - little endian

0x1 - big endian

MDATA[4] Reserved. Must be set to 0.

MDATA[5] Debug Boot Mode. When this bit is set, the RC32355 begins executing from address 0xFF20_0200 rather than 0xBFC0_0000 following a reset.

0x0 - regular mode (processor begins executing at 0xBFC0_0000)

0x1 - debug boot mode (processor begins executing at 0xFF20_0200)

MDATA[7:6] Boot Device Width. This field specifies the width of the boot device.

0x0 - 8-bit boot device width

0x1 - 16-bit boot device width

0x2 - 32-bit boot device width

0x3 - reserved

MDATA[8] EJTAG/ICE Interface Enable. When this bit is set, Alternate 2 pin functions EJTAG_PCST[2:0], EJTAG_DCLK, and EJTAG_TRST_N are

selected.

0x0 - GPIOP[31, 13:10] pins behaves as GPIOP

0x1 - GPIOP[31] pin behaves as EJTAG_TRST_N,

GPIOP[12:10] pins behave as EJTAG_PCST[2:0], and

GPIOP[13] pin behaves as EJTAG_DCLK

MDATA[9] Fast Reset. When this bit is set, RC32355 drives RSTN for 64 clock cycles, used during test only. Clear this bit for normal operation.

0x0 - Normal reset: RC32355 drives RSTN for minimum of 4096 clock cycles

0x1 - Fast Reset: RC32355 drives RSTN for 64 clock cycles (test only)

MDATA[10] DMA Debug Enable. When this bit is set, Alternate 2 pin function, DMAP is selected. DMAP provides the DMA channel number during memory

and peripheral bus DMA transactions.

0x0 - GPIOP[8, 9, 25, 23] pins behave as GPIOP

0x1 - GPIOP[8, 9, 25, 23] pins behave as DMAP[3:0]

Table 2 Boot Configuration Vector Encoding (Part 1 of 2)

Name Type I/O Type Description

Table 1 Pin Descriptions (Part 8 of 8)

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IDT 79RC32355

MDATA[11] Hold SYSCLKP Constant. For systems that do not require a SYSCLKP output and can instead use CLKP, setting this bit to a one causes the

SYSCLKP output to be held at a constant level. This may be used to reduce EMI.

0x0 - Allow SYSCLKP to toggle

0x1 - Hold SYSCLKP constant

MDATA[12] JTAG Boundary Scan Reset Enable. When this bit is set, Alternate 2 pin function, JTAG_TRST_N is selected.

0x0 - GPIOP[2] pin behaves as GPIOP

0x1 - GPIOP[2] pin behaves as JTAG_TRST_N

MDATA[13] CPU / DMA Transaction Indicator Enable. When this bit is set, Alternate 2 pin function, CPUP is selected.

0x0 - GPIOP[4] pin behaves as GPIOP

0x1 - GPIOP[4] pin behaves as CPUP

MDATA[15:14] Reserved. These pins must be driven low during boot configuration.

Signal Name/Description

Table 2 Boot Configuration Vector Encoding (Part 2 of 2)

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Logic Diagram

The following Logic Diagram shows the primary pin functions of the RC32355.

Figure 3 Logic Diagram

MADDR[21:0]

MDATA[31:0]

BWEN[3:0]

OEN

RWN

CSN[3:0]

WAITACKN

BRN

BGN

RASN

CASN

SDWEN

SDCSN[1:0]

BOEN[1:0]

BDIRN

ATMINP[11:0]

ATMIOP[1:0]

ATMOUTP[9:0]

GPIOP[31:0]

USBDP

USBDN

USBCLKP

MIIRXDP[3:0]

MIIRXDVP

MIIRXERP

MIIRXCLKP

MIICRSP

MIICOLP

MIITXDP[3:0]

MIITXENP

MIITXERP

MIITXCLKP

MIIMDCP

MIIMDIOP

JTAG_TCK

JTAG_TMS

JTAG_TDI

JTAG_TDO

CLKP

SYSCLKP

COLDRSTN

RC32355

Miscellaneous

Signals

USB

Interface

Ethernet

Interface

JTAG

General Purpose

Input/Output

ATM

Interface

Memory and

RSTN

SDCLKINP

Debug

Logic

Diagram

Peripheral Bus

VccCore

VccI/O

Vss

Power/Ground

VccP (PLL)

VssP (PLL)

(Primary

Functions)

INSTP

GPIOP[35:32]

TDM

Input/Output

General Purpose

Ar? ,7, a} H

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IDT 79RC32355

Clock Parameters

(Ta = 0°C to +70°C Commercial, Ta = -40°C to +85°C Industrial, Vcc I/O = +3.3V±5%,Vcc Core and VccP = +2.5V±5%)

Figure 4 Clock Parameters Waveform

Parameter Symbol

Reference

Edge

133MHz 150MHz 180MHz

Units

Timing

Diagram

Reference

Min Max Min Max Min Max

Internal CPU pipeline clock1Frequency none 100 133 100 150 100 180 MHz Figure 4

CLKP2,3,4 Frequency none 25 67 25 75 25 90 MHz

Tperiod1 15 40 13.3 40 11.1 40 ns

Thigh1 6 — 5.4 — 5.4 — ns

Tlow1 6 — 5.4 — 5.4 — ns

Trise1 — 3 — 2.5 — 2.5 ns

Tfall1 — 3 — 2.5 — 2.5 ns

Tjitter — ±250 — ±200 — ±200 ps

1 The CPU pipeline clock speed is selected during cold reset by the boot configuration vector (see Table 2).

2 Ethernet clock (MIIRXCLKP and MIITXCLKP) frequency must be equal to or less than 1/2 CLKP frequency.

3 USB clock (USBCLKP) frequency must be less than CLKP frequency.

4 ATM Utopia clock (RXCLKP and TXCLKP) frequency must be equal to or less than 1/2 CLKP frequency.

Table 3 Clock Parameters

Tlow1

Thigh1

Tperiod1

CLKP

Trise1 Tfall1

Tjitter Tjitter

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AC Timing Definitions

Below are examples of the AC timing characteristics used throughout this document.

Figure 5 AC Timing Definitions Waveform

Symbol Definition

Tperiod Clock period.

Tlow Clock low. Amount of time the clock is low in one clock period.

Thigh Clock high. Amount of time the clock is high in one clock period.

Trise Rise time. Low to high transition time.

Tfall Fall time. High to low transition time.

Tjitter Jitter. Amount of time the reference clock (or signal) edge can vary on either the rising or falling edges.

Tdo Data out. Amount of time after the reference clock edge that the output will become valid. The minimum time represents the data output hold.

The maximum time represents the earliest time the designer can use the data.

Tzd Z state to data valid. Amount of time after the reference clock edge that the tri-stated output takes to become valid.

Tdz Data valid to Z state. Amount of time after the reference clock edge that the valid output takes to become tri-stated.

Tsu Input set-up. Amount of time before the reference clock edge that the input must be valid.

Thld Input hold. Amount of time after the reference clock edge that the input must remain valid.

Tpw Pulse width. Amount of time the input or output is active.

Table 4 AC Timing Definitions

TdzTzd

Tdo

TpwTpw

ThldTsu

Tlow

ThighThigh

Tperiod

clock

Output signal 1

Output signal 2

Input Signal 1

Signal

Tjitter Trise Tfall

Tdo

ence EN2

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AC Timing Characteristics

(Ta = 0°C to +70°C Commercial, Ta = -40°C to +85°C Industrial, Vcc I/O = +3.3V±5%,Vcc Core = +2.5V±5%, VccP = +2.5V±5%)

Signal Symbol Reference

Edge

133MHz 150MHz 180MHz

Unit Conditions

Timing

Diagram

Reference

Min Max Min Max Min Max

Reset and System

COLDRSTN Tpw1 none 110 — 110 — 110 — ms Figure 6

Figure 7

Trise1 none — 5.0 — 5.0 — 5.0 ns

RSTN1Tdo2 CLKP rising 4.0 10.7 4.0 10.7 4.0 10.7 ns

MDATA[15:0]

Boot Configuration

Vector

Thld3 COLDRSTN

rising

3—3—3—ns

INSTP Tdo CLKP rising 5.0 8.0 5.0 8.0 5.0 8.0 ns

CPUP Tdo CLKP rising 3.5 7.0 3.5 7.0 3.5 7.0 ns

DMAP Tdo CLKP rising 3.5 6.6 3.5 6.6 3.5 6.6 ns

DMAREQN2Tpw none (CLKP+7) — (CLKP+7) — (CLKP+7) — ns

DMADONEN2Tpw none (CLKP+7) — (CLKP+7) — (CLKP+7) — ns

DMAFIN Tdo CLKP rising 3.5 5.9 3.5 5.9 3.5 5.9 ns

BRN Tsu CLKP rising 1.6 — 1.6 — 1.6 — ns

Thld 0—0—0—ns

BGN Tdo CLKP rising 3.3 5.8 3.3 5.8 3.3 5.8 ns

1 RSTN is a bidirectional signal. It is treated as an asynchronous input.

2 DMAREQN and DMADONEN minimum pulse width equals the CLKP period plus 7ns.

Table 5 Reset and System AC Timing Characteristics

E ”r

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Figure 6 Cold Reset AC Timing Waveform

Figure 7 Warm Reset AC Timing Waveform

BOOT VECT

SYSCLKP

COLDRSTN

RSTN

MDATA[31:0]

BDIRN

BOEN[0]

>= 100 ms >=10ms >= 4096 CLKP clock cycles

>= 64 CLKP clock cycles

>= 4096 CLKP clock cycles

>= 64 CLKP clock cycles

Selection of 4096 or 64 cycles is selected by the boot configuration vector (fast reset).

Tpw1

Tdo2

CLKP

FFFF_FFFF

Thld3

1. COLDRSTN asserted by external logic.

2. The RC32355 asserts RSTN, asserts BOEN[0] low, drives BDIRN low, and tri-states the data bus in response.

3. External logic begins driving valid boot configuration vector on the data bus, and the RC32355 starts sampling it.

4. External logic negates COLDRSTN and tri-states the boot configuration vector on MDATA[15:0]. The boot configuration vector must not be tri-stated before COLDRSTN is deas-

serted. The RC32355 stops sampling the boot configuration vector.

5. The RC32355 starts driving the data bus, MDATA[31:0], deasserts BOEN[0] high, and drives BDIRN high.

6. SYSCLKP may be held constant after this point if Hold SYSCLKP Constant is selected in the boot configuration vector.

7. RSTN negated by RC32355.

8. CPU begins executing by taking MIPS reset exception, and the RC32355 starts sampling RSTN as a warm reset input.

234 56 7 8

Trise1

Active Deasserted Active

CLKP

COLDRSTN

RSTN

MDATA[31:0]

Mem Control Signals

>= 4096 CLKP clock cycles

>= 64 CLKP clock cycles

>= 4096 CLKP clock cycles

>= 64 CLKP clock cycles

(RSTN ignored during this period

to allow pull-up to drive signal high)

Selection of 4096 or 64 cycles is selected by the boot configuration vector (fast reset).

1. Warm reset condition caused by either RSTN asserted, write to reset register, or bus transaction timer time-out. The RC32355 asserts RSTN output low in response.

2. The RC32355 tri-states the data bus, MDATA[31:0], and deasserts all memory control signals, such as RASN, CASN, RWN, OEN, etc.

3. The RC32355 deasserts RSTN.

4. The RC32355 starts driving the data bus, MDATA[31:0], again, but does not sample the RSTN input.

5. CPU begins executing by taking a MIPS soft reset exception and also starts sampling the RSTN input again.

FFFF_FFFF

12 34 5

ence

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Signal Symbol Reference

Edge

133MHz 150MHz 180MHz

Unit Conditions

Timing

Diagram

Reference

Min Max Min Max Min Max

Memory and Peripheral Bus - SDRAM Access

MDATA[31:0] Tsu1 SDCLKINP

rising

2.5 — 2.5 — 2.5 — ns Figure 8

Figure 9

Figure 10

Thld1 1.5 — 1.5 — 1.5 — ns

Tdo1 SYSCLKP

rising

1.2 5.8 1.2 5.8 1.2 5.8 ns

Tdz1 —5.0—5.0—5.0 ns

Tzd1 1.0 — 1.0 — 1.0 — ns

MADDR[20:2],

BWEN[3:0]

Tdo2 SYSCLKP

rising

1.2 5.3 1.2 5.3 1.2 5.3 ns

CASN, RASN,

SDCSN[1:0], SDWEN

Tdo3 SYSCLKP

rising

1.2 5.3 1.2 5.3 1.2 5.3 ns

CKENP Tdo4 SYSCLKP

rising

1.2 5.3 1.2 5.3 1.2 5.3 ns

BDIRN Tdo5 SYSCLKP

rising

1.2 5.3 1.2 5.3 1.2 5.3 ns

BOEN[1:0] Tdo6 SYSCLKP

rising

1.2 5.3 1.2 5.3 1.2 5.3 ns

SYSCLKP rising Tdo7 CLKP rising 0.5 5.0 0.5 5.0 0.5 5.0 ns

SDCLKINP Tperiod8 none 15 50 13.3 50 13.3 50 ns

Thigh8,Tlow8 6.0 — 5.4 — 5.4 — ns

Trise8,Tfall8 — 3.0 — 2.5 — 2.5 ns

Tdelay8 SYSCLKP

rising

04.804.804.8 ns

Table 6 Memory and Peripheral Bus AC Timing Characteristics (Part 1 of 2)

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Note: The RC32355 provides bus turnaround cycles to prevent bus contention when going from a read to write, write to read, and during

external bus ownership. For example, there are no cycles where an external device and the RC32355 are both driving. See the chapters

“Device Controller,” “Synchronous DRAM Controller,” and “Bus Arbitration” in the RC32355 User Reference Manual.

Memory and Peripheral Bus - Device Access

MDATA[31:0] Tsu1 CLKP rising 2.5 — 2.5 — 2.5 — ns Figure 11

Figure 12

Thld1 1.5 — 1.5 — 1.5 — ns

Tdo1 2.0 6.5 2.0 6.5 2.0 6.5 ns

Tdz1 —9.0—9.0—9.0 ns

Tzd1 2.0 — 2.0 — 2.0 — ns

WAITACKN, BRN Tsu CLKP rising 2.5 — 2.5 — 2.5 — ns

Thld 1.5 — 1.5 — 1.5 — ns

MADDR[21:0] Tdo2 CLKP rising 2.0 6.0 2.0 6.0 2.0 6.0 ns

Tdz2 —9.0—9.0—9.0 ns

Tzd2 2.0 — 2.0 — 2.0 — ns

MADDR[25:22] Tdo3 CLKP rising 2.5 6.5 2.5 6.5 2.5 6.5 ns

Tdz3 —9.0—9.0—9.0 ns

Tzd3 2.0 — 2.0 — 2.0 — ns

BDIRN, BOEN[0] Tdo4 CLKP rising 2.0 6.0 2.0 6.0 2.0 6.0 ns

Tdz4 —9.0—9.0—9.0 ns

Tzd4 2.0 — 2.0 — 2.0 — ns

BGN, BWEN[3:0], OEN,

RWN

Tdo5 CLKP rising 2.0 6.0 2.0 6.0 2.0 6.0 ns

Tdz5 —9.0—9.0—9.0 ns

Tzd5 2.0 — 2.0 — 2.0 — ns

CSN[3:0] Tdo6 CLKP rising 1.7 5.0 1.7 5.0 1.7 5.0 ns

Tdz6 —9.0—9.0—9.0 ns

Tzd6 2.0 — 2.0 — 2.0 — ns

CSN[5:4] Tdo7 CLKP rising 2.5 6.0 2.5 6.0 2.5 6.0 ns

Tdz7 —9.0—9.0—9.0 ns

Tzd7 2.0 — 2.0 — 2.0 — ns

Signal Symbol Reference

Edge

133MHz 150MHz 180MHz

Unit Conditions

Timing

Diagram

Reference

Min Max Min Max Min Max

Table 6 Memory and Peripheral Bus AC Timing Characteristics (Part 2 of 2)

KINP

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Figure 8 Memory and Peripheral Bus AC Timing Waveform - SDRAM Read Access

Figure 9 SYSCLKP - SDCLKINP Relationship

Addr

1111 BE's 1111

NOP READ NOP

11 Chip-Sel 11

11 Buffer Enables 11

Data

Tzd1Tdz1

Tdo6Tdo6

Tdo5Tdo5

Tdo3

Tdo2

Thld1

Tsu1

CLKP

SYSCLKP

MADDR[21:0]

BWEN[3:0]

CMD[2:0]*

SDCSN[1:0]

BDIRN

BOEN[1:0]

MDATA[31:0]

SDCLKINP

SDRAM CAS Latency

Tdo7

Tdelay8

* NOTE: CMD[2:0] = {RASN, CASN, SDWEN}

RC32355

samples

read data

RC32355

SDRAM SRAM,

EPROM,

etc.

external

SYSCLKP

SDCLKINP CLKLP

Memory Bus

Tdelay8

RSTN

COLDRSTN

Vcc

pull-up

buffer

/:/ M;1944:q_

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Figure 10 Memory and Peripheral Bus AC Timing Waveform - SDRAM Write Access

Addr

1111 BE's 1111

NOP WRITE NOP

11 Chip-Sel 11

11 Buff Enable 11

Data

Tdo1

Tdo6

Tdo5

Tdo3

Tdo2

CLKP

SYSCLKP

MADDR[21:0]

BWEN[3:0]

CMD[2:0]*

SDCSN[1:0]

BDIRN

BOEN[1:0]

MDATA[31:0]

Tdo7

* NOTE: CMD[2:0] = {RASN, CASN, SDWEN}

SDRAM

samples

write data

N h t {I

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Figure 11 Memory and Peripheral Bus AC Timing Waveform - Device Read Access

Addr[21:0]

Addr[25:22]

1111

Data

Tdo4Tdo4

Tzd1Tdz1

Tdo5

Tdo6

Tdo3

Tdo2

Thld1

Tsu1

CLKP

MADDR[21:0]

MADDR[25:22]

RWN

CSN[3:0]

BWEN[3:0]

OEN

MDATA[31:0]

BDIRN

BOEN[0]

WAITACKN

RC32355

samples

read data

7 /:’/ ﬂy

24 of 47 May 25, 2004

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Figure 12 Memory AC and Peripheral Bus Timing Waveform - Device Write Access

Addr[21:0]

Addr[25:22]

1111 Byte Enables 1111

Data

Tdo4

Tdo1

Tdo5

Tdo6

Tdo5

Tdo3

Tdo2

CLKP

MADDR[21:0]

MADDR[25:22]

RWN

CSNx

BWEN[3:0]

OEN

MDATA[31:0]

BDIRN

BOEN[0]

WAITACKN

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Signal Symbol Reference

Edge

133MHz 150MHz 180MHz

Unit Conditions

Timing

Diagram

Reference

Min Max Min Max Min Max

Ethernet1,2

MIIRXCLKP, MIITXCLKP Tperiod1 none 399.96 400.04 399.96 400.04 399.96 400.04 ns 10 Mbps Figure 13

Thigh1,Tlow1 140 260 140 260 140 260 ns

Trise1,Tfall1 — 3 — 3 — 3 ns

MIIRXCLKP, MIITXCLKP Tperiod1 none 39.996 40.004 39.996 40.004 39.996 40.004 ns 100 Mbps

Thigh1,Tlow1 14 26 14 26 14 26 ns

Trise1,Tfall1 — 2 — 2 — 2 ns

MIIRXDP[3:0],

MIIRXDVP, MIIRXERP

Tsu2 MIIRXCLKP

rising

5—5—5—ns

Thld2 3 — 3 — 3 — ns

MIITXDP[3:0], MIITXENP,

MIITXERP

Tdo3 MIITXCLKP

rising

713713713ns

MIIMDCP Tperiod4 none 30 — 27 — 27 — ns

Thigh4,Tlow4 14 — 13 — 13 — ns

Trise4 — 11 — 11 — 11 ns

Tfall4 —8—8—8 ns

MIIMDIOP Tsu5 MIIMDCP

rising

6—6—6—ns

Thld5 0.5 — 0.5 — 0.5 — ns

Tdo5 373737ns

1 Ethernet clock (MIIRXCLKP and MIITXCLKP) frequency must be equal to or less than 1/2 CLKP frequency.

2 MIICOLP and MIICRSP are asynchronous signals.

Table 7 Ethernet AC Timing Characteristics

mm H % ”W H L 2 Jr

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Figure 13 Ethernet AC Timing Waveform

Tdo5Tdo5

Tdo3

Thld5

Tsu5

Tlow4Tlow4

Thigh4

Tperiod4

Tlow1Tlow1

Thigh1

Tperiod1

Thld2

Tsu2

Tlow1Tlow1

Thigh1

Tperiod1

MIIRXCLKP

MIIRXDVP, MIIRXDP[3:0], MIIRXERP

MIITXCLKP

MIITXENP, MIITXDP[3:0], MMTXERP

MIIMDCP

MIIMDIOP (output)

MIIMDIOP (input)

ence LKP‘ LKP‘

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Signal Symbol Reference

Edge

133MHz 150MHz 180MHz

Unit Conditions

Timing

Diagram

Reference

Min Max Min Max Min Max

ATM Interface, Utopia Mode1, 2

1. ATM Utopia clock (RXCLKP and TXCLKP) frequency must be equal to or less than 1/2 CLKP frequency.

2. All Utopia Mode pins are multiplexed on the ATM interface pins as described in Table 9.

RXCLKP, TXCLKP1Tperiod1 none — 40 — 40 — 40 ns 25 MHz Utopia Figure 14

Thigh1,Tlow1 16 — 16 — 16 — ns

Trise1,Tfall1 — 4 — 4 — 4 ns

RXCLKP, TXCLKP1Tperiod1 none — 30 — 30 — 30 ns 33 MHz Utopia

Thigh1,Tlow1 12 — 12 — 12 — ns

Trise1,Tfall1 — 3 — 3 — 3 ns

RXCLKP, TXCLKP Tperiod1 none — 20 — 20 — 20 ns 50 MHz Utopia

Thigh,Tlow1 8 — 8 — 8 — ns

Trise1,Tfall1 — 2 — 2 — 2 ns

TXFULLN Tsu2 TXCLKP

rising

2—2—2— ns

Thld2 2—2—2— ns

TXDATA[7:0], TXSOC,

TXENBN, TXADDR[1:0]

Tdo3 TXCLKP

rising

484848 ns

RXDATA[7:0], RXEMP-

TYN, RXSOC

Tsu4 RXCLKP

rising

3—3—3— ns

Thld4 2—2—2— ns

RXADDR[1:0], RXENBN Tdo5 RXCLKP

rising

383838 ns

Table 8 ATM AC Timing Characteristics

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Figure 14 ATM AC Timing Waveform

Tdo8

Tdo7

Tdo5

Tdo3

Thld10

Tsu10

Thld9Tsu9

Tperiod6Tperiod6

Thld4Tsu4

Tperiod1Tperiod1

Thld2Tsu2

Tperiod1Tperiod1

TXCLKP

TXFULL

TXDATA,TXSOC,TXENB,TXADDR

RXCLKP

RXDATA, RXEMPTY, RXSOC

RXADDR, RXENB

O0CLKP, O1CLKP

O0DP, O0FRMP

O1DP, O1FRMP

I0CLKP, I1CLKP

I0DP

I1DP

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ATM Pin Name Utopia Level 1 Utopia Level 2

ATMINP[0] RXDATA[0] RXDATA[0]

ATMINP[1] RXDATA[1] RXDATA[1]

ATMINP[2] RXDATA[2] RXDATA[2]

ATMINP[3] RXDATA[3] RXDATA[3]

ATMINP[4] RXDATA[4] RXDATA[4]

ATMINP[5] RXDATA[5] RXDATA[5]

ATMINP[6] RXDATA[6] RXDATA[6]

ATMINP[7] RXDATA[7] RXDATA[7]

ATMINP[8] RXCLKP RXCLKP

ATMINP[9] RXEMPTYN RXEMPTYN

ATMINP[10] RXSOC RXSOC

ATMINP[11] TXFULLN TXFULLN

ATMIOP[0] RXENBN RXENBN

ATMIOP[1] TXCLKP TXCLKP

ATMOUTP[0] TXDATA[0] TXDATA[0]

ATMOUTP[1] TXDATA[1] TXDATA[1]

ATMOUTP[2] TXDATA[2] TXDATA[2]

ATMOUTP[3] TXDATA[3] TXDATA[3]

ATMOUTP[4] TXDATA[4] TXDATA[4]

ATMOUTP[5] TXDATA[5] TXDATA[5]

ATMOUTP[6] TXDATA[6] TXDATA[6]

ATMOUTP[7] TXDATA[7] TXDATA[7]

ATMOUTP[8] TXSOC TXSOC

ATMOUTP[9] TXENBN TXENBN

GPIOP[22] TXADDR[0]

GPIOP[23] TXADDR[1]

GPIOP[24] RXADDR[0]

GPIOP[25] RXADDR[1]

Table 9 ATM I/O Pin Multiplexing

enc DMCLKP‘ ; HT, %_,,_ REL: % 7 ‘ L 2‘ 4 +1 ﬂ 7 ‘ W91 , F m 1L< ‘74lﬂx,="" \_="" _="" _="" r/="">

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Figure 15 TDM AC Timing Waveform, Master Mode

Signal Symbol Reference

Edge

133MHz 150MHz 180MHz

Unit Conditions

Timing

Diagram

Reference

Min Max Min Max Min Max

TDM

TDMCLKP1Tperiod1 none — 125 — 62.5 — 62.5 ns Figure 15

Figure 16

Thigh1 62.5 — 31.2 — 31.2 — ns

Tlow1 62.5 — 31.2 — 31.2 — ns

Trise1 —3—3—3 ns

Tfall1 —3—3—3 ns

TDMFP Tsu2 TDMCLKP

rising or falling

4—4—4—ns

Thld2 1—1—1—ns

Tdo2 292929ns

TDMDIP Tsu3 TDMCLKP

rising or falling

4—4—4—ns

Thld3 1—1—1—ns

TDMDOP Tdo4 TDMCLKP

rising or falling

292929ns

Tdz4 —12—12—12 ns

Tzd4 3—3—3—ns

TDMTEN Tdo5 TDMCLKP

rising or falling

292929ns

1The rising or falling edge of TDMCLKP is used as the reference clock edge for the timing depending on the TDM bus mode and protocol selection.

Table 10 TDM AC Timing Characteristics

Tdo5

Tdo4

Tdo2Tdo2

Thld3Tsu3

TDMCLKP

TDMFP

TDMDOP

TDMDIP

TDMTEN

Tperiod1 Tlow1

Thigh1 Trise1

Tfall1

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Figure 16 TDM AC Timing Waveform, Slave Mode

Tdo5Tdo5

Tdo4Tdo4

Thld3

Tsu3

Thld2

Tsu2

TDMCLKP

TDMFP

TDMDOP

TDMDIP

TDMTEN

ence mBm

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Signal Symbol Reference

Edge

133MHz 150MHz 180MHz

Unit Conditions

Timing

Diagram

Reference

Min Max Min Max Min Max

USB

USBCLKP1Tperiod1 none 19.79 21.87 19.79 21.87 19.79 21.87 ns Figure 17

Thigh1,Tlow1 8.3 — 8.3 — 8.3 — ns

Trise1,Tfall1 — 3 — 3 — 3 ns

Tjitter1 — 0.8 — 0.8 — 0.8 ns 1/4th of the mini-

mum Source data

jitter

USBDN, USBDP Trise2 4 20 4 20 4 20 ns Universal Serial Bus

Specification

(USBS) Revision

1.1: Figures 7.6 and

7.7.

Tfall2 4 20 4 20 4 20 ns USBS Revision 1.1:

Figures 7.6 and 7.7.

USBDN and USBDP

Rise and Fall Time

Matching

90 111.11 90 111.11 90 111.11 % USBS Revision 1.1:

Note 10, Section

7.1.2.

Data valid period Tstate 60 — 60 — 60 — ns

Skew between USBDN

and USBDP

— 0.4 — 0.4 — 0.4 ns USBS Revision 1.1:

Section 7.1.3

Source data jitter — 3.5 — 3.5 — 3.5 ns USBS Revision 1.1:

Table 7-6

Receive data jitter — 12 — 12 — 12 ns

Source EOP length Tseop 160 175 160 175 160 175 ns

Receive EOP length Treop 82 — 82 — 82 — ns

EOP jitter -25-25-25 ns

Full-speed Data Rate Tfdrate 11.97 12.03 11.97 12.03 11.97 12.03 MHz Average bit rate,

USBS Section

7.1.11.

Frame Interval 0.9995 1.0005 0.9995 1.0005 0.9995 1.0005 ms USBS Section

7.1.12.

Consecutive Frame

Interval Jitter

— 42 — 42 — 42 ns Without frame

adjustment.

— 126 — 126 — 126 ns With frame adjust-

ment.

1 USB clock (USBCLKP) frequency must be less than CLKP frequency.

Table 11 USB AC Timing Characteristics

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Figure 17 USB AC Timing Waveform

Signal Symbol Reference

Edge

133MHz 150MHz 180MHz

Unit Conditions

Timing

Diagram

Reference

Min Max Min Max Min Max

UART

U0SINP, U0RIN, U0DCDN,

U0DSRN, U0CTSN, U1SINP,

U1DSRN, U1CTSN

Tsu1CLKP rising5—5—5— ns

Thld13—3—3— ns

U0SOUTP, U0DTRN, U0RTSN,

U1SOUTP, U1DTRN, U1RTSN

Tdo1CLKP rising112112112 ns

1 These are asynchronous signals and the values are provided for ATE (test) only.

Table 12 UART AC Timing Characteristics

Tperiod1 Thigh1 Tr i s e 1 Tlow1

Tfall1

Tseop

Tr e o p

90%

10%

90%

10%

Tstate

USBCLKP

Tjitter1

Tr i s e 2 Tfall2

Tfdrate

USBDN

USBDP

USBDN

USBDP

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Signal Symbol Reference

Edge

133MHz 150MHz 180MHz

Unit Conditions

Timing

Diagram

Reference

Min Max Min Max Min Max

I2C1

1. For more information see the I2C-Bus specification by Philips Semiconductor

SCLP Frequency none 0 100 0 100 0 100 kHz 100 KHz Figure 18

Thigh1 4.0 — 4.0 — 4.0 — µs

Tlow1 4.7 — 4.7 — 4.7 — µs

Trise1 — 1000 — 1000 — 1000 ns

Tfall1 — 300 — 300 — 300 ns

SDAP Tsu2 SCLP rising 250 — 250 — 250 — ns

Thld2 03.4503.4503.45 µs

Trise2 — 1000 — 1000 — 1000 ns

Tfall2 — 300 — 300 — 300 ns

Start or repeated start condition Tsu3 SDAP falling 4.7 — 4.7 — 4.7 — µs

Thld3 4.0 — 4.0 — 4.0 — µs

Stop condition Tsu4 SDAP rising 4.0 — 4.0 — 4.0 — µs

Bus free time between a stop and

start condition

Tdelay5 4.7 — 4.7 — 4.7 — µs

SCLP Frequency none 0 400 0 400 0 400 kHz 400 KHz

Thigh1 0.6 — 0.6 — 0.6 — µs

Tlow1 1.3 — 1.3 — 1.3 — µs

Trise1 — 300 — 300 — 300 ns

Tfall1 — 300 — 300 — 300 ns

SDAP Tsu2 SCLP rising 100 — 100 — 100 — ns

Thld2 00.900.900.9 µs

Trise2 — 300 — 300 — 300 ns

Tfall2 — 300 — 300 — 300 ns

Start or repeated start condition Tsu3 SDAP falling 0.6 — 0.6 — 0.6 — µs

Thld3 0.6 — 0.6 — 0.6 — µs

Stop condition Tsu4 SDAP rising 0.6 — 0.6 — 0.6 — µs

Bus free time between a stop and

start condition

Tdelay5 1.3 — 1.3 — 1.3 — µs

Table 13 I2C AC Timing Characteristics

H H94 // y._. // \// ,/ // // // ,1- 14

35 of 47 May 25, 2004

IDT 79RC32355

Figure 18 I2C AC Timing Waveform

Table 14 GPIOP AC Timing Characteristics

Figure 19 GPIOP AC Timing Waveform

Signal Symbol Reference

Edge

133MHz 150MHz 180MHz

Unit Conditions

Timing

Diagram

Reference

Min Max Min Max Min Max

GPIOP

GPIOP[31:0]1Tsu1 CLKP rising 4 — 4 — 4 — ns Figure 19

Thld1 1.4 — 1.4 — 1.4 — ns

Tdo1 282828 ns

GPIOP[35:32]2Tsu1 3—3—3— ns

Thld1 1 — 1 — 1 — ns

Tdo1 383838 ns

1 GPIOP[31:0] are controlled through the GPIO interface. GPIO[31:0] are asynchronous signals, the values are provided for ATE (test) only.

2 GPIOP[35:32] are controlled through the TDM interface.

Tsu4

Thld3

Tsu3

Tsu2

Thld2

Thigh1

Tlow1

Thld3

Tlow1

Tdelay5Tdelay5

SDAP

SCLP

GPIOP (input)

GPIOP (output)

CLKP

Tsu1

Thld1

Tdo1 Tdo1

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Table 15 JTAG AC Timing Characteristics

Figure 20 JTAG AC Timing Waveform

Signal Symbol Reference

Edge

133MHz 150MHz 180MHz

Unit Conditions

Timing

Diagram

Reference

Min Max Min Max Min Max

EJTAG and JTAG

JTAG_TCK Tperiod1 none 100 — 100 — 100 — ns Figure 20

Thigh1, Tlow1 40 — 40 — 40 — ns

Trise1, Tfall1 — 5 — 5 — 5 ns

EJTAG_DCLK1

1. EJTAG_DCLK is equal to the internal CPU pipeline clock.

Tperiod2 none 7.5 10.0 6.7 10.0 5.6 10.0 ns

Thigh2, Tlow2 2.5 — 2.5 — 2.5 — ns

Trise2, Tfall2 — 3.5 — 3.5 — 3.5 ns

JTAG_TMS, JTAG_TDI,

JTAG_TRST_N

Tsu3 JTAG_TCK rising 3.0 — 3.0 — 3.0 — ns

Thld3 1.0 — 1.0 — 1.0 — ns

JTAG_TDO Tdo4 JTAG_TCK falling 2.0 12.0 2 12.0 2 12.0 ns

Tdo5 EJTAG_DCLK rising -0.72

2. A negative delay denotes the amount of time before the reference clock edge.

1.0 -0.721.0 -0.721.0 ns

JTAG_TRST_N Tpw6 none 100 — 100 — 100 — ns

Tsu6 JTAG_TCK rising 2 — 2 — 2 — ns

EJTAG_PCST[2:0] Tdo7 EJTAG_DCLK rising -0.323.3 -0.323.3 -0.323.3 ns

Tperiod1

Tfall1

Tlow1 Thigh1

Trise2 Tfall2

Thigh2

Tlow2

Tsu3 Thld3

Tdo4

Tperiod2

Trise1

Tdo5

Tdo7

Tsu6

Tpw6

JTAG_TCK

EJTAG_DCLK

JTAG_TMS,

JTAG_TDI

JTAG_TDO

EJTAG_PCST

JTAG_TRST_N

TPC

TDOTDO

PCST

EJTAG TPC, TCST capture

EJTAG_TRST_N

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Table 16 shows the pin numbering for the Standard EJTAG connector. All the even numbered pins are connected to ground. Multiplexing of pin

functions should be considered when connecting EJTAG_TRST_N and EJTAG_PCST.

For details on using the JTAG connector, see the JTAG chapters in the RC32355 user reference manual.

AC Test Conditions

Figure 21 Output Loading for AC Timing

PIN SIGNAL RC32355 I/O TERMINATION1

1. The value of the series resistor may depend on the actual printed circuit board layout situation.

1 EJTAG_TRST_N Input 10 kΩ pull-down resistor. A pull-down resistor will hold the EJTAG controller in reset when not in use

if the EJTAG_TRST_N function is selected with the boot configuration vector. Refer to the User Man-

ual.

3 JTAG_TDI Input 10 kΩ pull-up resistor

5 JTAG_TDO Output 33 Ω series resistor

7 JTAG_TMS Input 10 kΩ pull-up resistor

9 JTAG_TCK Input 10 kΩ pull-up resistor2

2. JTAG_TCK pull-up resistor is not required according to the JTAG (IEEE1149) standard. It is indicated here to prevent a floating CMOS input when the EJTAG connector is

unconnected.

11 System Reset Input 10 kΩ pull-up resistor is used if it is combined with the system cold reset control, COLDRSTN.

13 EJTAG_PCST[0] Output 33 Ω series resistor

15 EJTAG_PCST[1] Output 33 Ω series resistor

17 EJTAG_PCST[2] Output 33 Ω series resistor

19 EJTAG_DCLK Output 33 Ω series resistor

21 Debug Boot Input This can be connected to the boot configuration vector to control debug boot mode if desired. Refer

to Table 2 on page 12 and the RC32355 user reference manual.

23 VCCI/O Output Used to sense the circuit board power. Must be connected to the VCC I/O supply of the circuit board.

Table 16 Pin Numbering of the JTAG and EJTAG Target Connector

1.5V

Parameter Value Units

Input pulse levels 0 to 3.0 V

Input rise/fall 3.5 ns

Input reference level 1.5 V

Output reference levels 1.5 V

AC test load 25 pF

RC32355

Output .50 Ω

50 Ω

Test

Point

RCSZBSS IBIS Model

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Phase-Locked Loop (PLL)

The processor aligns the pipeline clock, PClock, to the master input clock (CLKP) by using an internal phase-locked loop (PLL) circuit that gener-

ates aligned clocks. Inherently, PLL circuits are only capable of generating aligned clocks for master input clock (CLKP) frequencies within a limited

range.

PLL Analog Filter

The storage capacitor required for the Phase-Locked Loop circuit is contained in the RC32355. However, it is recommended that the system

designer provide a filter network of passive components for the PLL power supply.

VCCP (PLL circuit power) and VSSP (PLL circuit ground) should be isolated from VCC Core (core power) and VSS (common ground) with a filter

circuit such as the one shown in Figure 22.

Because the optimum values for the filter components depend upon the application and the system noise environment, these values should be

considered as starting points for further experimentation within your specific application.

Figure 22 PLL Filter Circuit for Noisy Environments

Recommended Operating Temperature and Supply Voltage

Capacitive Load Deration

Refer to the RC32355 IBIS Model which can be found at the IDT web site (www.idt.com).

Grade Temperature Vss1

VssP5VccI/O2VccCore3

VccP4

Commercial 0°C to +70°C Ambient 0V 3.3V±5% 2.5V±5%

Industrial -40°C+ 85°C Ambient 0V 3.3V±5% 2.5V±5%

1 Vss supplies a common ground.

2 VccI/O is the I/O power.

3 VccCore is the internal logic power.

4 VccP is the phase lock loop power.

5VssP is the phase lock loop ground.

Table 17 Temperature and Voltage

10 µF0.1 µF100 pF

Vcc

Vss

VccP

VssP

10 ohm1

1.This resistor may be required in noisy circuit environments.

RC32355

39 of 47 May 25, 2004

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Power-on RampUp

The 2.5V core supply (and 2.5V VccPLL supply) can be fully powered without the 3.3V I/O supply. However, the 3.3V I/O supply cannot exceed the

2.5V core supply by more than 1 volt during power up. A sustained large power difference could potentially damage the part. Inputs should not be

driven until the part is fully powered. Specifically, the input high voltages should not be applied until the 3.3V I/O supply is powered.

There is no special requirement for how fast Vcc I/O ramps up to 3.3V. However, all timing references are based on a stable Vcc I/O.

DC Electrical Characteristics

(Tambient = 0°C to +70°C Commercial, Tambient = -40°C to +85°C Industrial, Vcc I/O = +3.3V±5%, Vcc Core and Vcc P = +2.5V±5%)

Para-

meter Min Max Unit Pin Numbers Conditions

LOW Drive

Output with

Schmitt Trigger

Input (STI)

IOL 7.3 — mA 1-4,6-8,10-16,18,20-25,27-29,32,33,35-37,

39-42,44,46-48,50,52,53,56,58-60,62-69,

71-77,82-85,87-94,96-99,101-105,167,

205-208

VOL = 0.4V

IOH -8.0 — mA VOH = (Vcc I/O - 0.4)

VIL —0.8V —

VIH 2.0 (VccI/O

+ 0.5)

V—

VOH Vcc - 0.4 —V—

HIGH Drive

Output with

Standard Input

IOL 9.4 — mA 49,51,54,55,106-108,110,112-117,119,

121,123-128,130,132-137,139,141,143,

150,152,154-159,161,163-166,168-170,

172,174-179,181,185-190,192,194-200,

202,204

VOL = 0.4V

IOH -15 — mA VOH = (Vcc I/O - 0.4)

VIL —0.8V —

VIH 2.0 (VccI/O

+ 0.5)

V—

VOH Vcc - 0.4 —V—

Clock Drive

Output

IOL 39 — mA 183 VOL = 0.4V

IOH -24 — mA VOH = (Vcc I/O - 0.4)

Capacitance CIN — 10 pF All pins —

Leakage I/OLEAK —20µA All pins —

Table 18 DC Electrical Characteristics

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USB Electrical Characteristics

Power Consumption

Note: This table is based on a 2:1 CPU pipeline to system (PClock to CLKP) clock ratio.

Table 20 RC32355 Power Consumption

Parameter Min Max Unit Conditions

USB Interface

Vdi Differential Input Sensitivity -0.2 V I(D+)-(D-)I

Vcm Differential Input Common Mode

Range

0.8 2.5 V

Vse Single ended Receiver Threshold 0.8 2.0 V

Cin Transceiver Capacitance 20 pF

Ili Hi-Z State Data Line Leakage -10 10 µA0V < V

in < 3.3V

USB Upstream/Downstream Port

Voh Static Output High 2.8 3.6 V 15km + 5% to Gnd

Vol Static Output Low 0.3 V

ZoUSB Driver Output Impedance 28 44 ΩIncluding Rext = 20 Ω

Table 19 USB Interface Characteristics

Parameter 133MHz 150MHz 180MHz Unit Conditions

Typical Max. Typical Max. Typical Max.

ICC I/O 80 130 100 150 120 170 mA

ICC core Normal mode 400 450 450 500 500 550 mA CL = 25pF (affects I/O)

Ta = 25oC

VccP = 2.625V (for max. values)

Vcc core = 2.625V (for max. values)

Vcc I/O = 3.46V (for max. values)

VccP = 2.5V (for typical values)

Vcc core = 2.5V (for typical values)

Vcc I/O = 3.3V (for typical values)

Standby mode1

1. RISCore 32300 CPU core enters Standby mode by executing WAIT instructions; however, other logic continues to function. Standby mode reduces power consumption by 0.6

mA per MHz of the CPU pipeline clock, PClock.

320 370 360 410 400 450 mA

Power

Dissipation

Normal mode 1.26 1.63 1.46 1.86 1.73 2.03 W

Standby mode11.06 1.42 1.22 1.59 1.47 1.77 W

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IDT 79RC32355

Power Curve

The following graph contains a power curve that shows power consumption at various bus frequencies.

Note: The system clock (CLKP) can be multiplied by 2, 3, or 4 to obtain the CPU pipeline clock (PClock) speed.

Figure 23 Typical Power Usage

Absolute Maximum Ratings

Symbol Parameter Min1

1. Functional and tested operating conditions are given in Table 17. Absolute maximum ratings are stress ratings only,

and functional operation at the maximums is not guaranteed. Stresses beyond those listed may affect device reliability

or cause permanent damage to the device.

Max1Unit

VCCI/O I/O Supply Voltage -0.3 3.465 V

VCCCore Core Supply Voltage -0.3 3.0 V

VCCP PLL Supply Voltage -0.3 3.0 V

Vimin Input Voltage - undershoot -0.6 — V

Vi I/O Input Voltage Gnd VCCI/O+0.6 V

Ta,

Industrial

Ambient Operating

Temperature

-40 85 degrees C

Tstg Storage Temperature -40 125 degrees C

Table 21 Absolute Maximum Ratings

Typical Power Curve

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

2.2

40 45 50 55 60 65 70 75 80 85 90

System Bus Speed (MHz)

Power (W @ 3.3v IO & 2.5v core)

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Package Pin-out — 208-Pin PQFP

The following table lists the pin numbers and signal names for the RC32355.

Pin Function Alt Pin Function Alt Pin Function Alt Pin Function Alt

1 ATMOUTP[0] 53 JTAG_TDO 105 BGN 157 MDATA[28]

2 ATMOUTP[1] 54 GPIOP[16] 1 106 CSN[0] 158 MDATA[13]

3 ATMINP[02] 55 GPIOP[17] 1 107 CSN[1] 159 MDATA[29]

4 ATMOUTP[2] 56 GPIOP[18] 1 108 CSN[2] 160 Vcc I/O

5 Vss 57 Vss 109 Vcc I/O 161 MDATA[14]

6 ATMOUTP[3] 58 JTAG_TCK 110 CSN[3] 162 Vss

7 ATMINP[03] 59 GPIOP[19] 1 111 Vss 163 MDATA[30]

8 ATMOUTP[4] 60 GPIOP[20] 1 112 OEN 164 MDATA[15]

9 Vcc I/O 61 Vcc I/O 113 RWN 165 MDATA[31]

10 ATMOUTP[5] 62 GPIOP[21] 1 114 BDIRN 166 CLKP

11 ATMINP[04] 63 JTAG_TDI 115 BOEN[0] 167 WAITACKN

12 ATMOUTP[6] 64 GPIOP[22] 1 116 BOEN[1] 168 MADDR[00]

13 ATMOUTP[7] 65 GPIOP[23] 2 117 BWEN[0] 169 MADDR[11]

14 ATMINP[05] 66 GPIOP[24] 1 118 Vcc I/O 170 MADDR[01]

15 ATMOUTP[8] 67 JTAG_TMS 119 BWEN[1] 171 Vcc I/O

16 ATMOUTP[9] 68 GPIOP[25] 2 120 Vss 172 MADDR[12]

17 Vss 69 GPIOP[26] 1 121 BWEN[2] 173 Vss

18 ATMINP[06] 70 Vss 122 Vcc Core 174 MADDR[02]

19 Vcc Core 71 GPIOP[27] 1 123 BWEN[3] 175 MADDR[13]

20 GPIOP[00] 1 72 COLDRSTN 124 MDATA[00] 176 MADDR[03]

21 GPIOP[01] 1 73 GPIOP[28] 1 125 MDATA[16] 177 MADDR[14]

22 ATMINP[07] 74 GPIOP[29] 1 126 MDATA[01] 178 MADDR[04]

23 GPIOP[02] 2 75 GPIOP[30] 1 127 MDATA[17] 179 MADDR[15]

24 GPIOP[03] 1 76 GPIOP[31] 2 128 MDATA[02] 180 Vcc I/O

25 ATMINP[08] 77 USBCLKP 129 Vcc I/O 181 MADDR[05]

26 Vcc I/O 78 Vcc I/O 130 MDATA[18] 182 Vcc Core

27 GPIOP[04] 2 79 USBDN 131 Vss 183 SYSCLKP

28 GPIOP[05] 1 80 USBDP 132 MDATA[03] 184 Vss

29 ATMINP[09] 81 Vss 133 MDATA[19] 185 MADDR[16]

30 VccP182 MIICRSP 134 MDATA[04] 186 MADDR[06]

31 VssP183 MIICOLP 135 MDATA[20] 187 MADDR[17]

32 ATMINP[10] 84 MIITXDP[0] 136 MDATA[05] 188 MADDR[07]

33 GPIOP[06] 1 85 MIITXDP[1] 137 MDATA[21] 189 MADDR[18]

34 Vss 86 Vcc Core 138 Vcc Core 190 MADDR[08]

Table 22: 208-pin QFP Package Pin-Out (Part 1 of 2)

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IDT 79RC32355

35 GPIOP[07] 1 87 MIITXDP[2] 139 MDATA[06] 191 Vcc I/O

36 ATMINP [11] 88 MIITXDP[3] 140 Vcc I/O 192 MADDR[19]

37 GPIOP[08] 2 89 MIITXENP 141 MDATA[22] 193 Vss

38 Vcc Core 90 MIITXCLKP 142 Vss 194 MADDR[09]

39 GPIOP[09] 2 91 MIITXERP 143 MDATA[07] 195 MADDR[20]

40 GPIOP[10] 2 92 MIIRXERP 144 MDATA[23] 196 MADDR[10]

41 GPIOP[11] 2 93 MIIRXCLKP 145 SDCLKINP 197 MADDR[21]

42 GPIOP[12] 2 94 MIIRXDVP 146 MDATA[08] 198 CASN

43 Vcc I/O 95 Vcc I/O 147 MDATA[24] 199 RASN

44 GPIOP[13] 2 96 MIIRXDP[0] 148 MDATA[09] 200 SDWEN

45 Vss 97 MIIRXDP[1] 149 MDATA[25] 201 Vcc I/O

46 GPIOP[14] 1 98 MIIRXDP[2] 150 MDATA[10] 202 SDCSN[0]

47 GPIOP[15] 1 99 MIIRXDP[3] 151 Vcc I/O 203 Vss

48 GPIOP[35] 1 100 Vss 152 MDATA[26] 204 SDCSN[1]

49 GPIOP[34] 1 101 MIIDCP 153 Vss 205 ATMINP[00]

50 GPIOP[33] 1 102 MIIDIOP 154 MDATA[11] 206 ATMIOP[0]

51 GPIOP[32] 1 103 RSTN 155 MDATA[27] 207 ATMIOP[1]

52 INSTP 104 BRN 156 MDATA[12] 208 ATMINP[01]

1 VccP and VssP are the Phase Lock Loop (PLL) power and ground. PLL power and ground should be supplied through a special filter circuit.

Pin Function Alt Pin Function Alt Pin Function Alt Pin Function Alt

Table 22: 208-pin QFP Package Pin-Out (Part 2 of 2)

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IDT 79RC32355

Alternate Pin Functions

Table 23 Alternate Pin Functions

Pin Primary Alt #1 Alt #2 Pin Primary Alt #1 Alt #2

20 GPIOP[00] U0SOUTP 51 GPIOP[32] TDMDOP

21 GPIOP[01] U0SINP 54 GPIOP[16] CSN[4]

23 GPIOP[02] U0RIN JTAG_TRST_N 55 GPIOP[17] CSN[5]

24 GPIOP[03] U0DCRN 56 GPIOP[18] DMAREQN

27 GPIOP[04] U0DTRN CPUP 59 GPIOP[19] DMADONEN

28 GPIOP[05] U0DSRN 60 GPIOP[20] USBSOF

33 GPIOP[06] U0RTSN 62 GPIOP[21] CKENP

35 GPIOP[07] U0CTSN 64 GPIOP[22] TXADDR[0]

37 GPIOP[08] U1SOUTP DMAP[3] 65 GPIOP[23] TXADDR[1] DMAP[0]

39 GPIOP[09] U1SINP DMAP[2] 66 GPIOP[24] RXADDR[0]

40 GPIOP[10] U1DTRN EJTAG_PCST[0] 68 GPIOP[25] RXADDR[1] DMAP[1]

41 GPIOP[11] U1DSRN EJTAG_PCST[1] 69 GPIOP[26] TDMTEN

42 GPIOP[12] U1RTSN EJTAG_PCST[2] 71 GPIOP[27] MADDR[22]

44 GPIOP[13] U1CTSN EJTAG_DCLK 73 GPIOP[28] MADDR[23]

46 GPIOP[14] SDAP 74 GPIOP[29] MADDR[24]

47 GPIOP[15] SCLP 75 GPIOP[30] MADDR[25]

48 GPIOP[35] TDMCLKP 76 GPIOP[31] DMAFIN EJTAG_TRST_N

49 GPIOP[34] TDMFP

50 GPIOP[33] TDMDIP

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IDT 79RC32355

Package Drawing - 208-pin QFP

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IDT 79RC32355

Package Drawing - page two

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IDT 79RC32355

CORPORATE HEADQUARTERS

6024 Silver Creek Valley Road

San Jose, CA 95138

for SALES:

800-345-7015 or 408-284-8200

fax: 408-284-2775

www.idt.com

for Tech Support:

email: rischelp@idt.com

phone: 408-284-8208

Ordering Information

Valid Combinations

79RC32T355 -133DH, 150DH, 180DH 208-pin QFP package, Commercial Temperature

79RC32T355 -133DHI, 150DHI 208-pin QFP package, Industrial Temperature

79RCXX YY XXXX 999 A A

Operating

Voltage

Device

Type

Speed Package Temp range/

Process

133

Blank Commercial Temperature

(0°C to +70°C Ambient)

133 MHz Pipeline Clk

2.5V +/-5% Core Voltage

Integrated Core Processor

Product

Type

79RC32 32-bit Embedded

Microprocessor

208-pin QFP

150 150 MHz Pipeline Clk

355

I Industrial Temperature

(-40° C to +85° C Ambient)

180 180 MHz Pipeline Clk

79RC32355 Datasheet by Renesas Electronics Corporation

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