74VHCT257AMTR by STMicroelectronics | Multiplexer & Demultiplexer | Partstack
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74VHCT257AMTR

STMicroelectronics

74VHCT257AMTR by STMicroelectronics

MULTIPLEXER; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,183 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,183

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Anansix

USA . 1,174 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,174

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 157 parts In-Stock

1+ parts

$1.092

100+ parts

-

1k+ parts

-

10k+ parts

-

157

$1.092

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IDEA Electronic Components Group

UK . 1,109 parts In-Stock

1+ parts

$9.572

100+ parts

-

1k+ parts

$8.615

10k+ parts

-

1,109

$9.572

-

$8.615

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MKK Technologies

India . 689 parts In-Stock

1+ parts

$17.999

100+ parts

-

1k+ parts

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10k+ parts

-

689

$17.999

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DigiPath Technology Company

USA . 689 parts In-Stock

1+ parts

$17.999

100+ parts

-

1k+ parts

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10k+ parts

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689

$17.999

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Component Stockers USA

USA . 372 parts In-Stock

1+ parts

$99.990

100+ parts

-

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10k+ parts

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372

$99.990

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Eagle Technology Solutions (Excess)

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

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15,000

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-

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Northwest PG Solutions

USA . 1,945 parts In-Stock

1+ parts

-

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1,945

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Parana Technologies

USA . 1,633 parts In-Stock

1+ parts

-

100+ parts

$11.444

1k+ parts

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10k+ parts

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1,633

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$11.444

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Native Components

USA . 272 parts In-Stock

1+ parts

-

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272

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Technical Specifications

Multiplexer & Demultiplexer 74VHCT257AMTR attributes and parameters. Explore more Multiplexer & Demultiplexer devices from STMicroelectronics

Package Body Material:

PLASTIC/EPOXY

Output Characteristics:

3-STATE

Maximum Seated Height:

1.75 mm

No. of Inputs:

2

Minimum Supply Voltage (Vsup):

4.5 V

Sub-Category:

Multiplexer/Demultiplexers

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

No. of Outputs:

1

No. of Terminals:

16

Maximum I (ol):

8 Amp

Terminal Position:

DUAL

Package Style (Meter):

SMALL OUTLINE

Technology:

CMOS

JESD-30 Code:

R-PDSO-G16

Package Shape:

Terminal Form:

Maximum Operating Temperature:

125 Cel

Package Code:

SOP

Propagation Delay At Nominal Supply:

9 ns

Width:

3.9 mm

Moisture Sensitivity Level (MSL):

1

Output Polarity:

TRUE

Packing Method:

TR

Load Capacitance (CL):

50 pF

Logic IC Type:

JESD-609 Code:

e4

Minimum Operating Temperature:

-55 Cel

No. of Functions:

4

Qualification:

Not Qualified

Package Equivalence Code:

SOP16,.25

Length:

9.9 mm

Propagation Delay (tpd):

9 ns

Nominal Supply Voltage / Vsup (V):

5

Family:

AHCT/VHCT

Terminal Pitch:

1.27 mm

Temperature Grade:

Maximum Supply Voltage (Vsup):

5.5 V

Power Supplies (V):

5

Trade Compliance

74VHCT257AMTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 48,254 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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