74HC4049 Datasheet by NXP USA Inc.

Datasheet Feedback/Errors

1. General description

The 74HC4049 is a hex inverter with over-voltage tolerant inputs. Inputs are overvoltage

tolerant to 15 V. This enables the device to be used in HIGH-to-LOW level shifting

applications.

2. Features and benefits

Low-power dissipation

Complies with JEDEC standard no. 7A

ESD protection:

HBM JESD22-A114F exceeds 2 000 V

MM JESD22-A115-A exceeds 200 V

Multiple package options

Specified from 40 Cto+85C and from 40 Cto+125C

3. Ordering information

74HC4049

Hex inverting HIGH-to-LOW level shifter

Rev. 6 — 8 January 2013 Product data sheet

Table 1. Ordering information

Type number Package

Temperature range Name Description Version

74HC4049N 40 C to +125 C DIP16 plastic dual in-line package; 16 leads (300 mil) SOT38-4

74HC4049D 40 C to +125 C SO16 plastic small outline package; 16 leads; body width

3.9 mm SOT109-1

74HC4049DB 40 C to +125 C SSOP16 plastic shrink small outline package; 16 leads;

body width 5.3 mm SOT338-1

74HC4049PW 40 C to +125 C TSSOP16 plastic thin shrink small outline package; 16 leads;

body width 4.4 mm SOT403-1

jjjjjjjj O :::::::: e jjjjjjjj EEEEEEEE

Product data sheet Rev. 6 — 8 January 2013 2 of 15

NXP Semiconductors 74HC4049

Hex inverting HIGH-to-LOW level shifter

4. Functional diagram

5. Pinning information

5.1 Pinning

Fig 1. Logic symbol Fig 2. IEC logic symbol Fig 3. Logic diagram (one level

shifter)

001aai331

1A 1Y

2A 2Y

3A 3Y

4A 4Y

5A 5Y

6A 6Y

001aan374

14 V1/V2 15

11 V1/V2 12

9V1/V2 10

7V1/V2 6

5V1/V2 4

3V1/V2 2

mna341

Fig 4. Pin configuration DIP16 and SO16 Fig 5. Pin configuration SSOP16 and TSSOP16

74HC4049

VCC n.c.

1Y 6Y

1A 6A

2Y n.c.

2A 5Y

3Y 5A

3A 4Y

GND 4A

001aan372

74HC4049

VCC n.c.

1Y 6Y

1A 6A

2Y n.c.

2A 5Y

3Y 5A

3A 4Y

GND 4A

001aan373

Product data sheet Rev. 6 — 8 January 2013 3 of 15

NXP Semiconductors 74HC4049

Hex inverting HIGH-to-LOW level shifter

5.2 Pin description

6. Functional description

[1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state.

7. Limiting values

[1] For DIP16 package: Ptot derates linearly with 12 mW/K above 70 C.

[2] For SO16 package: Ptot derates linearly with 8 mW/K above 70 C.

For SSOP16 and TSSOP16 packages: Ptot derates linearly with 5.5 mW/K above 60 C.

Table 2. Pin description

Symbol Pin Description

VCC 1 supply voltage

1Y to 6Y 2, 4, 6, 10, 12, 15 output

1A to 6A 3, 5, 7, 9, 11, 14 input

GND 8 ground (0 V)

n.c. 13, 16 not connected

Table 3. Function table [1]

Input Output

nA nY

Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions Min Max Unit

VCC supply voltage 0.5 +7 V

VIK input clamping voltage 0.5 +16 V

IIK input clamping current VI < 0.5 V 20 - mA

IOK output clamping current VO<0.5 V or VO>V

CC +0.5V - 20 mA

IOoutput current VO = 0.5 V to (VCC +0.5V) - 25 mA

ICC supply current - +50 mA

IGND ground current - 50 mA

Tstg storage temperature 65 +150 C

Ptot total power dissipation DIP16 package [1] - 750 mW

SO16, SSOP16 and TSSOP16 packages [2] - 500 mW

Product data sheet Rev. 6 — 8 January 2013 4 of 15

NXP Semiconductors 74HC4049

Hex inverting HIGH-to-LOW level shifter

8. Recommended operating conditions

9. Static characteristics

Fig 6. Input protection for the 74HC4049

001aan375

100 Ω

polysilicon

resistor

to logic

circuit

input

GND

Table 5. Recommended operating conditions

Voltages are referenced to GND (ground = 0 V)

Symbol Parameter Conditions Min Typ Max Unit

VCC supply voltage 2.0 5.0 6.0 V

VIinput voltage 0 - 15 V

VOoutput voltage 0 - VCC V

Tamb ambient temperature 40 +25 +125 C

t/V input transition rise and fall rate VCC = 2.0 V; VI= 2.0 V - - 625 ns/V

VCC = 4.5 V; VI= 4.5 V - 1.67 139 ns/V

VCC = 6.0 V; VI= 6.0 V - - 83 ns/V

VCC = 6.0 V; VI= 10.0 V - - 81 ns/V

VCC = 6.0 V; VI= 15.0 V - - 83 ns/V

Table 6. Static characteristics

At recommended operating conditions; voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions Tamb = 25 C Tamb = 40 C to

+85 CTamb = 40 C to

+125 CUnit

Min Typ Max Min Max Min Max

VIH HIGH-level

input voltage VCC = 2.0 V 1.5 1.3 - 1.5 - 1.5 - V

VCC = 4.5 V 3.15 2.4 - 3.15 - 3.15 - V

VCC = 6.0 V 4.2 3.1 - 4.2 - 4.2 - V

VIL LOW-level

input voltage VCC = 2.0 V - 0.7 0.5 - 0.5 - 0.5 V

VCC = 4.5 V - 1.8 1.35 - 1.35 - 1.35 V

VCC = 6.0 V - 2.3 1.8 - 1.8 - 1.8 V

VOH HIGH-level

output voltage VI=V

IH or VIL

IO=20 A; VCC = 2.0 V 1.9 2.0 - 1.9 - 1.9 - V

IO=20 A; VCC = 4.5 V 4.4 4.5 - 4.4 - 4.4 - V

IO=20 A; VCC = 6.0 V 5.9 6.0 - 5.9 - 5.9 - V

IO=4.0 mA; VCC = 4.5 V 3.98 - - 3.84 - 3.7 - V

IO=5.2 mA; VCC = 6.0 V 5.48 - - 5.34 - 5.2 - V

Figure 8 9 Figure 7 7 Figuve 7 7

Product data sheet Rev. 6 — 8 January 2013 5 of 15

NXP Semiconductors 74HC4049

Hex inverting HIGH-to-LOW level shifter

10. Dynamic characteristics

VOL LOW-level

output voltage VI=V

IH or VIL

IO=20A; VCC = 2.0 V - - 0.1 - 0.1 - 0.1 V

IO=20A; VCC = 4.5 V - - 0.1 - 0.1 - 0.1 V

IO=20A; VCC = 6.0 V - - 0.1 - 0.1 - 0.1 V

IO= 4.0 mA; VCC = 4.5 V - - 0.26 - 0.33 - 0.4 V

IO= 5.2 mA; VCC = 6.0 V - - 0.26 - 0.33 - 0.4 V

IIinput leakage

current VI=V

CC or GND;

VCC =6.0V --0.1 - 1.0 - 1.0 A

VI= 15 V; VCC = 2.0 V to

6.0 V --0.5 - 5.0 - 5.0 A

ICC supply current VI= 15 V or GND; IO=0A;

VCC =6.0V --2.0- 20 - 40A

CIinput

capacitance -3.5- - - - -pF

Table 6. Static characteristics …continued

At recommended operating conditions; voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions Tamb = 25 C Tamb = 40 C to

+85 CTamb = 40 C to

+125 CUnit

Min Typ Max Min Max Min Max

Table 7. Dynamic characteristics

Voltages are referenced to GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit see Figure 8.

Symbol Parameter Conditions Tamb = 25 C Tamb = 40 C

to +85 CTamb = 40 C

to +125 CUnit

Min Typ Max Min Max Min Max

tpd propagation

delay nA to nY; see Figure 7 [1]

VCC = 2.0 V - 28 85 - 105 - 130 ns

VCC = 4.5 V - 10 17 - 21 - 26 ns

VCC =5V; C

L=15pF - 8 - - - - - ns

VCC = 6.0 V - 8 14 - 18 - 22 ns

tttransition

time Yn; see Figure 7 [2]

VCC = 2.0 V - 19 75 - 95 - 110 ns

VCC = 4.5 V - 7 15 - 19 - 22 ns

VCC = 6.0 V - 6 13 - 16 - 19 ns

Figure 8

Product data sheet Rev. 6 — 8 January 2013 6 of 15

NXP Semiconductors 74HC4049

Hex inverting HIGH-to-LOW level shifter

[1] tpd is the same as tPLH and tPHL.

[2] tt is the same as tTHL and tTLH.

[3] CPD is used to determine the dynamic power dissipation (PD in W).

PD=C

PD VCC2fiN+(CLVCC2fo) where:

fi = input frequency in MHz;

fo= output frequency in MHz;

CL= output load capacitance in pF;

VCC = supply voltage in V;

N = number of inputs switching;

(CLVCC2fo) = sum of outputs.

11. Waveforms

CPD power

dissipation

capacitance

CL=50pF;f=1 MHz;

VI=GNDtoV

[3] -14- - - - -pF

Table 7. Dynamic characteristics …continued

Voltages are referenced to GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit see Figure 8.

Symbol Parameter Conditions Tamb = 25 C Tamb = 40 C

to +85 CTamb = 40 C

to +125 CUnit

Min Typ Max Min Max Min Max

Measurement points are given in Table 8.

VOL and VOH are typical voltage output levels that occur with the output load.

Fig 7. The input (nA) to output (nY) propagation delays

mna722

PLH

PHL

90 %

10 %

nY output

nA input

GND

TLH

THL

Table 8. Measurement points

Type Input Output

VMVM

74HC4049 0.5VCC 0.5VCC

E | MI

Product data sheet Rev. 6 — 8 January 2013 7 of 15

NXP Semiconductors 74HC4049

Hex inverting HIGH-to-LOW level shifter

Test data is given in Table 9.

Definitions test circuit:

RT = Termination resistance should be equal to output impedance Zo of the pulse generator.

CL = Load capacitance including jig and probe capacitance.

RL = Load resistance.

S1 = Test selection switch.

Fig 8. Test circuit for measuring switching times

001aah768

negative

pulse

GND

positive

pulse

GND

10 %

90 %

10 %

VMVM

VCC

DUT

VIVO

Table 9. Test data

Type Input Load Test

VItr, tfCL

74HC4049 VCC 6.0 ns 15 pF, 50 pF tPLH, tPHL

T l3 \ f N1 ‘ DH" 3 LlU ‘ “ + »D« +7 mﬁﬁmﬂhﬂhl ,y ,,,,,, + ,,,,,,, H \ mmmwwmwu

Product data sheet Rev. 6 — 8 January 2013 8 of 15

NXP Semiconductors 74HC4049

Hex inverting HIGH-to-LOW level shifter

12. Package outline

Fig 9. Package outline SOT38-4 (DIP16)

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

SOT38-4 95-01-14

03-02-13

(e )

seating plane

pin 1 index

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

UNIT A

max. 12 b1(1) (1) (1)

b2cD E e M Z

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

min. A

max. bmax.

1.73

1.30 0.53

0.38 0.36

0.23 19.50

18.55 6.48

6.20 3.60

3.05 0.2542.54 7.62 8.25

7.80 10.0

8.3 0.764.2 0.51 3.2

inches 0.068

0.051 0.021

0.015 0.014

0.009

1.25

0.85

0.049

0.033 0.77

0.73 0.26

0.24 0.14

0.12 0.010.1 0.3 0.32

0.31 0.39

0.33 0.030.17 0.02 0.13

DIP16: plastic dual in-line package; 16 leads (300 mil) SOT38-4

W FEHHHHHHH 7/ HHEPDEJH H HJH iﬁ

Product data sheet Rev. 6 — 8 January 2013 9 of 15

NXP Semiconductors 74HC4049

Hex inverting HIGH-to-LOW level shifter

Fig 10. Package outline SOT109-1 (SO16)

detail X

vMA

(A )

pin 1 index

UNIT A

max. A1A2A3bpcD

(1) E(1) (1)

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

inches

1.75 0.25

0.10 1.45

1.25 0.25 0.49

0.36 0.25

0.19 10.0

9.8 4.0

3.8 1.27 6.2

5.8 0.7

0.6 0.7

0.3 8

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

1.0

0.4

SOT109-1 99-12-27

03-02-19

076E07 MS-012

0.069 0.010

0.004 0.057

0.049 0.01 0.019

0.014

0.0100

0.0075 0.39

0.38 0.16

0.15 0.05

1.05

0.041

0.244

0.228 0.028

0.020 0.028

0.012

0.01

0.25

0.01 0.004

0.039

0.016

0 2.5 5 mm

scale

SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1

\, l )& H \\ // 4—] E-I EQW

Product data sheet Rev. 6 — 8 January 2013 10 of 15

NXP Semiconductors 74HC4049

Hex inverting HIGH-to-LOW level shifter

Fig 11. Package outline SOT338-1 (SSOP16)

UNIT A1A2A3bpcD

(1) E(1) eH

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 0.21

0.05 1.80

1.65 0.25 0.38

0.25 0.20

0.09 6.4

6.0 5.4

5.2 0.65 1.25

7.9

7.6 1.03

0.63 0.9

0.7 1.00

0.55 8

0.130.2 0.1

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

SOT338-1 99-12-27

03-02-19

(1)

vMA

16 9

detail X

(A )

MO-150

pin 1 index

0 2.5 5 mm

scale

SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm SOT338-1

max.

‘ ii. F 7 :J ; x71 .m ‘ “‘7 \ /‘/E-l T a HHHyHHHF + ‘ 7“ _ ‘ 5 i I ’64?” L%%\E*;j i WSW H H} Ea EQW

Product data sheet Rev. 6 — 8 January 2013 11 of 15

NXP Semiconductors 74HC4049

Hex inverting HIGH-to-LOW level shifter

Fig 12. Package outline SOT403-1 (TSSOP16)

UNIT A1A2A3bpcD

(1) E(2) (1)

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 0.15

0.05 0.95

0.80 0.30

0.19 0.2

0.1 5.1

4.9 4.5

4.3 0.65 6.6

6.2 0.4

0.3 0.40

0.06 8

0.13 0.10.21

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

0.75

0.50

SOT403-1 MO-153 99-12-27

03-02-18

0.25

16 9

detail X

(A )

vMA

0 2.5 5 mm

scale

TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1

max.

1.1

pin 1 index

Product data sheet Rev. 6 — 8 January 2013 12 of 15

NXP Semiconductors 74HC4049

Hex inverting HIGH-to-LOW level shifter

13. Abbreviations

14. Revision history

Table 10. Abbreviations

Acronym Description

CMOS Complementary Metal Oxide Semiconductor

DUT Device Under Test

ESD ElectroStatic Discharge

HBM Human Body Model

MM Machine Model

Table 11. Revision history

Document ID Release date Data sheet status Change notice Supersedes

74HC4049 v.6 20130108 Product data sheet - 74HC4049 v.5

Modifications: •New general description.

74HC4049 v.5 20120803 Product data sheet - 74HC4049 v.4

Modifications: •Measurement points added to figure 7 (errata).

74HC4049 v.4 20111212 Product data sheet - 74HC4049 v.3

74HC4049 v.3 20101230 Product data sheet - 74HC4049_CNV v.2

74HC4049_CNV v.2 19970827 Product specification - -

Product data sheet Rev. 6 — 8 January 2013 13 of 15

NXP Semiconductors 74HC4049

Hex inverting HIGH-to-LOW level shifter

15. Legal information

15.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

15.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall prevail.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to offer functions and qualities beyond those described in the

Product data sheet.

15.3 Disclaimers

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Semiconductors takes no

responsibility for the content in this document if provided by an information

source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequential damages (including - without limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at the customer’s own

risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and operation of their applications

and products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications and

products planned, as well as for the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing in this document may be interpreted or

construed as an offer to sell products that is open for acceptance or the grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product development.

Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.

Product [short] data sheet Production This document contains the product specification.

: hitE:I/www.nxg.com salesaddresses®nx9£0m

Product data sheet Rev. 6 — 8 January 2013 14 of 15

NXP Semiconductors 74HC4049

Hex inverting HIGH-to-LOW level shifter

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It is neither qualified nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automotive specifications and standards, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

15.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

16. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors 74HC4049

Hex inverting HIGH-to-LOW level shifter

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 8 January 2013

Document identifier: 74HC4049

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

17. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 1

4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2

5 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

6 Functional description . . . . . . . . . . . . . . . . . . . 3

7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3

8 Recommended operating conditions. . . . . . . . 4

9 Static characteristics. . . . . . . . . . . . . . . . . . . . . 4

10 Dynamic characteristics . . . . . . . . . . . . . . . . . . 5

11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8

13 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 12

14 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 12

15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 13

15.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13

15.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

15.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

15.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14

16 Contact information. . . . . . . . . . . . . . . . . . . . . 14

17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

74HC4049 Datasheet by NXP USA Inc.

INFORMATION

HELP

CONTACT US

FOLLOW US