NXP Semiconductors | 74ABT126PWDH - Datasheet PDF & Tech Specs
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74ABT126PWDH

74ABT126PWDHNXP Semiconductors


Description:

Buffer/Line Driver 4-CH Non-Inverting 3-ST BiCMOS 14-Pin TSSOP

Country of Origin:

China

Introduction date:

Feb 26, 1996

Updated: 06-FEB-2024


See moreBuffers and Line Drivers by NXP Semiconductors

Online version: https://www.datasheets.com/part-details/74abt126pwdh-nxp-semiconductors-18798304

overviewOverview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCycleinfo
EU RoHS
rohs yesYes
RoHS Version
2011/65/EU, 2015/863
ECCNinfo
EAR99
Automotive
noNo
Supplier Cage Codeinfo
H2J65
HTSUSAinfo
8542390001
Schedule Binfo
8542390060
PPAP
noNo
AEC Qualified
noNo
Category Path
Semiconductor > Standard and Specialty Logic > Specialty Logic > Buffers and Line Drivers

pdfDatasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

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packagePackage

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Basic Package Type
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Package Family Name
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Supplier Package
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Package Description
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Lead Shape
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Pin Count
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PCB
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Tabinfo
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Package Length (mm)info
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Package Width (mm)info
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Package Height (mm)info
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Seated Plane Height (mm)info
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Pin Pitch (mm)info
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Package Diameter (mm)
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Package Weight (g)
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Package Material
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Mounting
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Package Outline
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Package Overall Height (mm)
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Package Overall Width (mm)
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Package Overall Length (mm)
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Jedec
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Jedec info (PKG outline)
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manufacturingManufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

MSLinfo
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Maximum Reflow Temperature (°C)info
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Reflow Solder Time (Sec)info
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Maximum Wave Temperature (°C)info
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Wave Solder Time (Sec)info
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Lead Finish(Plating)info
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Under Plating Materialinfo
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Terminal Base Materialinfo
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parametricParametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line
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Maximum Storage Temperature
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Typical Quiescent Current
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Maximum Quiescent Current
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Supplier Temperature Grade
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Minimum Test Temperature
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Maximum Test Temperature
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Maximum Supply Current
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Typical Supply Current
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Maximum High Level Output Current
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Number of Channels per Chip
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Bus Hold
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Maximum Propagation Delay Time @ Maximum CL
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Maximum Power Dissipation
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Number of Input Enables per Chip
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Number of Output Enables per Chip
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Minimum Storage Temperature
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Input Signal Type
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Propagation Delay Test Condition
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Absolute Propagation Delay Time
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Logic Family
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Logic Function
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Number of Elements per Chip
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Number of Inputs per Chip
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Number of Outputs per Chip
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Polarity
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Output Type
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Maximum Low Level Output Current
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Minimum Operating Supply Voltage
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Typical Operating Supply Voltage
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Maximum Operating Supply Voltage
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Tolerant I/Os
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Minimum Operating Temperature
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Maximum Operating Temperature
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Process Technology
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74ABT126PWDH

74ABT126PWDHBy NXP Semiconductors