onsemi | 2SD879 - Datasheet PDF & Tech Specs

2SD879

2SD879


Description:

Trans GP BJT NPN 10V 3A 750mW 3-Pin NP

Manufacturer:

onsemi

Introduction date:

Sep 1, 2004

Last Updated Date: +90


See moreGP BJT by onsemi

Online version: https://www.datasheets.com/en/part-details/2sd879-onsemi-44635582

overviewOverview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCycleinfo
EU RoHS
rohs yesYes
RoHS Version
2011/65/EU, 2015/863
ECCNinfo
EAR99
Automotive
noNo
Supplier Cage Codeinfo
5V1P1
HTSUSAinfo
8541210075
Schedule Binfo
8541210080
Taxonomy Path
Semiconductor > Diodes, Transistors and Thyristors > Bipolar Transistors > GP BJT

pdfDatasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

Revision date:

Datasheet Preview


packagePackage

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Basic Package Type
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Package Family Name
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Supplier Package
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Package Description
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Lead Shape
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Pin Count
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PCB
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Tabinfo
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Package Length (mm)info
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Package Width (mm)info
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Package Height (mm)info
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Seated Plane Height (mm)info
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Pin Pitch (mm)info
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Package Diameter (mm)
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Package Material
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Mounting
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Package Outline
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Package Overall Height (mm)
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Package Overall Width (mm)
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Package Overall Length (mm)
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Jedec
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manufacturingManufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

MSLinfo
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Maximum Reflow Temperature (°C)info
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Reflow Solder Time (Sec)info
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Reflow Temp. Source
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Maximum Wave Temperature (°C)info
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Wave Solder Time (Sec)info
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Lead Finish(Plating)info
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Under Plating Materialinfo
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Terminal Base Materialinfo
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parametricParametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line
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Maximum Offset Voltage
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Collector Current for VCE Saturation
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Minimum Transition Frequency
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Typical Transition Frequency
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Process Technology
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Maximum Diode Forward Voltage
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Maximum Pulsed Collector Current
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Maximum Rise Time
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Maximum Turn-On Time
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Maximum Storage Time
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Supplier Temperature Grade
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Maximum Fall Time
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Maximum Turn-Off Time
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Minimum Storage Temperature
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Typical Input Capacitance
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Typical Output Capacitance
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Maximum Collector Cut-Off Current
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Maximum Emitter Cut-Off Current
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Maximum Junction Ambient Thermal Resistance
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Maximum Junction Case Thermal Resistance
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Maximum Collector-Emitter Saturation Voltage
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Maximum Base Emitter Saturation Voltage
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Maximum Base Current
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Operating Junction Temperature
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Maximum Storage Temperature
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Operational Bias Conditions
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Maximum 3rd Order Intercept Point
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Maximum Noise Figure
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Maximum Power 1dB Compression
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Typical Power Gain
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Maximum Delay Time
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Type
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Configuration
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Number of Elements per Chip
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Maximum Collector Base Voltage
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Maximum Emitter Base Voltage
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Maximum Collector-Emitter Voltage
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Maximum DC Collector Current
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Maximum Power Dissipation
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Material
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Minimum DC Current Gain
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Maximum Transition Frequency
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Category
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Output Power
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Minimum Operating Temperature
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Maximum Operating Temperature
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processorCrosses

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