Sharp | LH28F016SCHB-L17 - Datasheet PDF & Tech Specs

LH28F016SCHB-L17

LH28F016SCHB-L17


Description:

NOR Flash Parallel 3.3V/5V 16M-bit 2M x 8 170ns to ns 48-Pin FBGA

Manufacturer:

Sharp

Introduction date:

Feb 25, 1997

Last Check Date: +90


See moreFlash by Sharp

Online version: https://www.datasheets.com/en/part-details/lh28f016schb-l17-sharp-17886425

overviewOverview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCycleinfo
EU RoHS
rohs unknownUnknown
RoHS Version
2002/95/EC
ECCNinfo
EAR99
Automotive
noNo
Supplier Cage Codeinfo
J3778
HTSUSAinfo
8542320071
Schedule Binfo
8542320070
RadHardinfo
noNo
Dose Level
N/A
Taxonomy Path
Semiconductor > Memory > Memory Chips > Flash

pdfDatasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

Revision date:

Datasheet Preview


packagePackage

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Basic Package Type
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Package Family Name
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Supplier Package
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Package Description
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Lead Shape
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Pin Count
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PCB
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Tabinfo
info
Package Length (mm)info
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Package Width (mm)info
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Package Height (mm)info
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Package Diameter (mm)
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Package Material
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Mounting
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Package Outline
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manufacturingManufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

MSLinfo
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Maximum Reflow Temperature (°C)info
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Reflow Solder Time (Sec)info
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Reflow Temp. Source
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Maximum Wave Temperature (°C)info
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Wave Solder Time (Sec)info
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Wave Temp. Source
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Lead Finish(Plating)info
info
Under Plating Materialinfo
info
Terminal Base Materialinfo
info

parametricParametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line
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Process Technology
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Maximum Cycle Time
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I/O Mode
info
Maximum Storage Temperature
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Minimum Endurance
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Minimum Storage Temperature
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MMC Version
info
Supplier Temperature Grade
info
Simultaneous Read/Write Support
info
Erase Suspend/Resume Modes Support
info
ECC Support
info
Programmability
info
OE Access Time
info
Page Read Current
info
Program Current
info
Page Size
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Command Compatible
info
Bank Size
info
Number of Banks
info
Support of Page Mode
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Maximum Page Access Time
info
Support of Common Flash Interface
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Density in Bits
info
Sector Size
info
Tradename
info
Density
info
Cell Type
info
Interface Type
info
Timing Type
info
Number of Words
info
Number of Bits per Word
info
Maximum Operating Frequency
info
Maximum Access Time
info
Maximum Erase Time
info
Maximum Programming Time
info
Typical Operating Supply Voltage
info
Minimum Operating Supply Voltage
info
Maximum Operating Supply Voltage
info
Architecture
info
Programming Voltage
info
Boot Block
info
Location of Boot Block
info
Maximum Operating Current
info
Block Organization
info
Address Bus Width
info
Minimum Operating Temperature
info
Maximum Operating Temperature
info

processorCrosses

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