Samsung Electronics | K7D161874B-GC37 - Datasheet PDF & Tech Specs
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K7D161874B-GC37

K7D161874B-GC37

Description:

SRAM Chip Sync Single 2.5V 18M-bit 1M x 18 37ns 153-Pin BGA

Manufacturer:

Samsung Electronics

Introduction date:

Nov 12, 2003

Last Check Date: +90

See moreSRAM Chip by Samsung Electronics

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Online version: https://www.datasheets.com/en/part-details/k7d161874b-gc37-samsung-electronics-20087691

overviewOverview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCycleinfo
Premium
EU RoHS
rohs yesYes
RoHS Version
2002/95/EC
ECCNinfo
3A991.b.2.a
Automotive
noNo
Supplier Cage Codeinfo
1542F
HTSUSAinfo
8542320041
Schedule Binfo
8542320040
Taxonomy Path
Semiconductor > Memory > Memory Chips > SRAM Chip

pdfDatasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

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packagePackage

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Basic Package Type
info
Package Family Name
info
Supplier Package
info
Package Description
info
Lead Shape
info
Pin Count
info
PCB
info
Tabinfo
info
Package Length (mm)info
info
Package Width (mm)info
info
Package Height (mm)info
info
Package Diameter (mm)
info
Package Material
info
Mounting
info
Package Outline
info
Jedec
info
Jedec info (PKG outline)
info

manufacturingManufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

MSLinfo
info
Maximum Reflow Temperature (°C)info
info
Reflow Solder Time (Sec)info
info
Number of Reflow Cycleinfo
info
Reflow Temp. Source
info
Maximum Wave Temperature (°C)info
info
Wave Solder Time (Sec)info
info
Lead Finish(Plating)info
info
Under Plating Materialinfo
info
Terminal Base Materialinfo
info

parametricParametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line
info
Maximum Cycle Time
info
I/O Mode
info
Process Technology
info
Number of I/O Lines
info
Function
info
Read Latency
info
Burst Length
info
Maximum Storage Temperature
info
Supplier Temperature Grade
info
Minimum Storage Temperature
info
Density
info
Timing Type
info
Architecture
info
Data Rate Architecture
info
Maximum Clock Rate
info
Maximum Access Time
info
Number of Ports
info
Number of Words
info
Number of Bits per Word
info
Typical Operating Supply Voltage
info
Minimum Operating Supply Voltage
info
Maximum Operating Supply Voltage
info
Maximum Operating Current
info
Address Bus Width
info
Density in Bits
info
Minimum Operating Temperature
info
Maximum Operating Temperature
info

processorCrosses

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