Findchips: Compare X24C01PMG-3.5 vs X24C01PM-3.5

X24C01PMG-3.5 vs X24C01PM-3.5 feature comparison

X24C01PMG-3.5 IC Microsystems Sdn Bhd

Buy Now Datasheet

X24C01PM-3.5 Xicor Inc

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer IC MICROSYSTEMS SDN BHD XICOR INC
Part Package Code DIP
Package Description DIP, PLASTIC, DIP-8
Pin Count 8
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.51
Clock Frequency-Max (fCLK) 0.1 MHz 0.1 MHz
JESD-30 Code R-PDIP-T8 R-PDIP-T8
Length 10.03 mm 10.03 mm
Memory Density 1024 bit 1024 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 128 words 128 words
Number of Words Code 128 128
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 128X8 128X8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.07 mm 4.32 mm
Serial Bus Type I2C I2C
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 3.5 V 3.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 7.62 mm
Write Cycle Time-Max (tWC) 10 ms 10 ms
Base Number Matches 1 2
Additional Feature 100K ENDURANCE CYCLES; DATA RETENTION = 100 YEARS
Data Retention Time-Min 100
Endurance 100000 Write/Erase Cycles
JESD-609 Code e0
Package Equivalence Code DIP8,.3
Power Supplies 3.5/5.5 V
Standby Current-Max 0.0001 A
Supply Current-Max 0.002 mA
Terminal Finish TIN LEAD