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Product Guide
Product Guide
Product Guide
■ Electro-Optical Characteristics
Part No.
Water
Clear
TYP. IF
Wavelength
Spectral Line
Half Width
Forward
Voltage VF
TYP. MAX. IF
Reverse
Current IR
MAX. VR
Viewing
Angle
(2 θ1/2)
Green
Bluish-Green
Blue
140
140
70
70
70
35
10
10
10
522
502
467
525
505
470
30
30
26
10
10
10
3.3
3.3
3.3
3.8
3.8
3.8
10
10
10
100
100
100
5
5
5
InGaN/SiC
InGaN/SiC
InGaN/SiC
HDG1105W
HDC1105W
HDB1105W
Units mcd mA nm mA mA µA V Deg.V
MIN. ∆λλ
TYP.
Peak
λλp
TYP.
Dominant
λλd
TYP. IF
Luminous
Intensity IV
Lens
Color
Emitted
Color
40°
■ Outline Dimensions
■ Features
• High brightness (InGaN/SiC) die material
• Available in green (525nm), bluish-green (505nm)
•and blue (470nm) colors
• Reflow and dip soldering compatible
• Available for both standard and reverse mounting
• 1000V minimum ESD protection
■ Applications
• Automotive indicator display
• Various other backlight uses
Anode
Polarity Mark
PCB
Cathode
Cathode Mark
0.5
3.2
0.6 0.6
1.6
0.5
1.55
R0.8
0.3
1.6
(1.6)
(2)
(4.6)
2.3+0.05
1.6
HOLE
1.5
2.1 + 0.05
1.5
HD_1105W Series, Dome Lens Type InGaN/SiC SMT LED
HD_1105W Series, Dome Lens Type InGaN/SiC SMT LED
Material
Unit: mm
Tolerance + 0.1
(Ta=25°C)
■ Recommended Solder Pad
on a Surface Mount ■ Recommended Solder Pad
on a reverse mount
HM
Ea
AMB‘ENT TEMP vs FORWARD CURRENT
Forward Cnvrem u (MN
o
oiozoaowsoaomwsowo
Ambmnl Temp. Ta rcp
‘ Sam-1mg m
‘ mg sub-mg
‘ W Said-7mg
Green
HDG
76
20
48
5
Bluish-Green
HDC
76
20
48
5
■Absolute Maximum Ratings
Power Dissipation
Forward Current
Peak Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Derating*
Symbol
Pd
IF
IFM
VR
Topr
Tstg
∆IF
Blue
HDB
76
20
48
5
mW
mA
mA
V
°C
°C
mA/°C
* Ta=25°C, IFM applies for the pulse width ≤1msec. and duty cycle ≤1/20.
0.28 (DC) 0.69 (Pulse)
Units
Item
-40 to +85
-40 to +100
■Precautions
Please follow these handling precautions to prevent damage to the chip and
ensure its reliability.
1. Soldering conditions:
• Soldering iron: Temperature at tip of iron: 280°C max. (30W max.)
Soldering time: 3 sec. max.
• Dip soldering: Preheating: 120 ~ 150°C max. (resin surface temp.)
60 ~ 120 sec. max. Bath temperature: 260°C max. Dipping Time: 5 sec. max.
• Reflow Soldering:
2. Cleaning:
• If cleaning is required, use the following solutions for less than 1 minute,
at less than 40°C.
• Appropriate chemicals: Ethyl alcohol and isopropyl alcohol.
• Effect of ultrasonic cleaning on the LED resin body differs depending on such
factors as the oscillator output, size of PCB and LED mounting method. The
use of ultrasonic cleaning should be enforced at proper output after confirming
there is no problem.
Product specifications subject to change without notice. PGHD1105W-0301
Stanley Electric Sales of America,Inc.
2660 Barranca Parkway, Irvine, CA 92606 •
• Tel: 800-LED-LCD1 (533-5231) •
• Fax: 949-222-0555
Website: www.stanley-electric.com
Operation Heating
Pre-heating
LED Surface Temperature
Temperature
rise: 5°C/sec.
Cooling:
—5°C/sec.
60 to 120 sec. 5 sec. max
0
120
150
240
°C
~
(Ta=25°C)
■Operation Current Derating Chart (DC)
DG, DC, DB,
■Spatial Distribution
■Taping Specifications
(3.45)
(0.25)
(2.1)
Center
Hole
Center
Hole
(1.85)
4+0.1
φ 1.5
+0.1
0
8+0.2
2+0.05
4+0.1
3.5+0.05
1.75+0.1
φ 1.1)
(
Quantity on tape:
2000 pieces
per reel
φ 21+0.8
9+0.3
11.4+1
φ 13+0.2
φ 180+0
3
φ 60 +1
-0
φ 13+0.2
2+0.5
■Taping Specifications
φ 1.5 (1.8) (0.25)
(0.5)
(2.2)
(3.5)
+0.1
0
4+0.1
4+0.1
2+0.05
1.75 + 0.1
3.5+0.05
8+0.2
Center
Hole
φ 1.1)
(
Quantity on tape:
2000 pieces
per reel
Cathode
RR
Direction to pull Cathode
TR
Direction to pull
for Reverse
Mount Type
for Standard
Mount Type
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