5%
FEATURES
SILICON RFIC LOW
CURRENT AMPLIFIER
FOR MOBILE COMMUNICATIONS
• HIGH DENSITY SURFACE MOUNTING:
6 Pin Super Minimold Package (2.0 x 1.25 x 0.9 mm)
• SUPPLY VOLTAGE:
VCC = 2.4 to 3.3 V
• HIGH EFFICIENCY:
PO(1dB) = +3.0 dBm TYP at f = 1.0 GHz
PO(1dB) = +1.5 dBm TYP at f = 1.9 GHz
PO(1dB) = +1.0 dBm TYP at f = 2.4 GHz
• POWER GAIN:
GP = 13.5 dB TYP at f = 1.0 GHz
GP = 15.5 dB TYP at f = 1.9 GHz
GP = 15.5 dB TYP at f = 2.4 GHz
• EXCELLENT ISOLATION:
ISL = 44 dB TYP at f = 1.0 GHz
ISL = 42 dB TYP at f = 1.9 GHz
ISL = 41 dB TYP at f = 2.4 GHz
• LOW CURRENT CONSUMPTION:
ICC = 4.0 mA TYP AT VCC = 3.0 V
• OPERATING FREQUENCY:
ICC = 4.0 mA TYP AT VCC = 3.0 V
• LIGHT WEIGHT:
7 mg (standard Value)
UPC8179TB
California Eastern Laboratories
• Buffer amplifiers for 0.1 to 2.4 GHz mobile communications
systems.
APPLICATIOIN
PART NUMBER UPC8179TB
PACKAGE OUTLINE S06
SYMBOLS PARAMETERS AND CONDITIONS UNITS MIN TYP MAX
ICC Circuit Current (no input signal) mA 2.9 4.0 5.4
GP Power Gain, f = 1.0 GHz, PIN = -30 dBm dB 11.0 13.5 15.5
f = 1.9 GHz, PIN = -30 dBm 13.0 15.5 17.5
f = 2.4 GHz, PIN = -30 dBm 13.0 15.5 17.5
ISOL Isolation, f = 1.0 GHz, PIN = -30 dBm dB 39.0 44.0 –
f = 1.9 GHz, PIN = -30 dBm 37.0 42.0 –
f = 2.4 GHz, PIN = -30 dBm 36.0 41.0 –
P1dB Output Power at f = 1.0 GHz dB -0.5 3.0 –
1 dB gain f = 1.9 GHz -2.0 1.5 –
compression, f = 2.4 GHz -3.0 1.0 –
NF Noise Figure, f = 1.0 GHz dB – 5.0 6.5
f = 1.9 GHz – 5.0 6.5
f = 2.4 GHz – 5.0 6.5
RLIN Input Return Loss, f = 1.0 GHz, PIN = -30 dBm dB 4.0 7.0 –
(without matching f = 1.9 GHz, PIN = -30 dBm 4.0 7.0 –
circuit) f = 2.4 GHz, PIN = -30 dBm 6.0 9.0 –
ELECTRICAL CHARACTERISTICS,
(Unless otherwise specified, TA = +25°C, VCC = VOUT = 3.0 V, ZS = ZL = 50Ω, at LC matched Frequency)
+10
0
+20
–10
–40
–20
–30
0.1 0.3 1.0 3.0
V
CC
= 3.0 V
1.0 GHz
2.4 GHz
1.9 GHz
T
A
= -40°C
T
A
= +85°C
T
A
= +25°C
POWER GAIN vs. FREQUENCY
NEC's UPC8179TB is a silicon monolithic integrated circuit
designed as amplifier for mobile communications. This IC can
realize low current consumption with external chip inductor
which can be realized on internal 50Ω wideband matched IC.
This low current amplifier uns on 3.0 V. This IC is manufactured
using NEC's 30 GHz fMAX UHS0 (Ultra High Speed Process)
silicon bipolar process. This process uses direct silicon nitride
passivation film and gold electrodes. These materials can
protect the chip surface from pollution and prevent corrosion/
migration. Thus this IC has exellent performance uniformity
and reliability.
DESCRIPTION
Output match for best performance
at each frequency
DISCONTINUED
UPC8179TB
ABSOLUTE MAXIMUM RATINGS1 (TA = 25°C)
SYMBOLS PARAMETERS UNITS RATINGS
VCC Supply Voltage, Pins 4 & 6 V 3.6
ICC Circuit Current mA 15
PDPower Dissipation2mW 270
TOP Operating Temperature °C -40 to +85
TSTG Storage Temperature °C -55 to +150
PIN Input Power dBm +5
SYMBOLS PARAMETERS UNITS MIN TYP MAX
VCC Supply Voltage V 2.7 3.0 3.3
TAOperating Ambient °C -40 +25 +85
Temperature
RECOMMENDED
OPERATING CONDITIONS
Notes:
1. Operation in excess of any one of these parameters may result
in permanent damage.
2. Mounted on a 50 x 50 x 1.6 mm epoxy glass PWB (TA = +85°C).
Pin No. Symbol Pin Voltage Description Internal Equivalent Circuit
1 INPUT
2 GND through external inductor
3
5
4 OUTPUT Same as VCC voltage
6VCC 2.4 to 3.3
PIN FUNCTIONS
1.09 V Signal Input Pin. A internal
matching circuit, configured with
resistors, enable 50 W connection
over a wide band. This pin must
be coupled to signal source with
capacitor for DC cut.
Ground pin. This pin should be
connected to the system ground with
minimum inductance. Ground pattern
on the board should be formed as
wide as possible. All the ground pins
must be connected together with
wide ground pattern to decrease
impedance difference.
Signal output pin. This pin is
designed as collector output. Due
to the high impedance output, this
pin should be externally equipped
with matching LC matching circuit
to next stage. For L, a size 1005
chip inductor can be chosen.
Power supply pin. This pin should
be externally equipped with bypass
capacitor to minimize its impedance.
5
6
2
4
31
5
4
3
2
1
0
–60
No signals
Vcc = 3.0 V
–40 –20 0 +20 +40 +60 +80 +100
TYPICAL PERFORMANCE CURVES (Unless otherwise specified, TA = 25˚C)
CIRCUIT CURRENT vs. TEMPERATURE
Temperature, TA (°C)
Circuit Current, I
CC
(mA)
CIRCUIT CURRENT vs. VOLTAGE
Circuit Current, I
CC
(mA)
Voltage, VCC (V)
5
4
3
2
1
0
1
0234
No signals
DISCONTINUED
'\
J/
< ux="">+20
+10
0
–20
–10
0.1 0.3 1.0 3.0
TA = –40 ºC
TA = +85ºC
TA = +25 ºC
Vcc = 3.0 V
–30
–40
–
10
–
20
–
30
–
50
–
40
T
A
= –40 ºC
T
A
= +25ºC
V
CC
= 3.0 V
–
60
0.1 0.3 1.0 3.0
–
70
T
A
= +85 ºC
TYPICAL PERFORMANCE CURVES (Unless otherwise specified, TA = 25˚C)
Gain, G
P
(dB)
Frequency, f (GHz)
GAIN vs. FREQUENCY
0.1 0.3 1.0 3.0
–
30
–
25
–
20
–
15
–
10
–5
0
T
A
= +85 ºC
T
A
= +25 ºC
T
A
= –40 ºC
V
cc
= 3.0 V
+5
0
–5
–
10
–
15
–
20
–
25
0.1 0.3 1.0 3.0
V
CC
= 3.0 V
TA = +85ºC
TA = –40ºC
TA = +25ºC
Isolation, ISOL (dB)
Frequency, f (GHz)
ISOLATION vs. FREQUENCY
1.0 GHz Output Port Matching
0
-10
-20
-30
-40
-50
-60
–20 –15 –10 –5 0+5
Vcc = 3.3 V
Vcc = 2.4 V
Vcc = 3.0 V
f1 = 1 000 MHz
f2 = 1 001 MHz
INPUT RETURN LOSS vs. FREQUENCY
+10
–10
0
0–10
+5
+5–5
–5
–15
–15
–20
–20–25–30–35–40
–25
–30
V
CC
= 3.0 V
T
A
= –40ºC
T
A
= +25ºC
T
A
= +85ºC
Input Return Loss, RL
IN
(dB)
Frequency, f (GHz) Frequency, f (GHz)
OUTPUT RETURN LOSS vs. FREQUENCY
Output Return Loss, RL
OUT
(dBm)
Output Power, P
OUT
(dBm)
Input Power, PIN (dBm)
OUTPUT POWER vs. INPUT POWER
Output Power of Each Tone, POUT (dBm)
Thirf Order Intermodulation Distortion,
IM
3
(dBc)
THIRD ORDER INTERMODULATION DISTORTION vs.
OUTPUT POWER OF EACH TONE
DISCONTINUED
6.0
5.5
5.0
4.5
4.0
3.5
3.0
2.0 2.5 3.0
T
A
= +85 ºC
T
A
= +25 ºC
T
A
= –40 ºC
3.5
TYPICAL PERFORMANCE CURVES (Unless otherwise specified, TA = 25˚C)
1.0 GHz Output Port Matching
1.9 GHz Output Port Matching
Noise Figure, NF (dB)
Voltage, VCC (V)
NOISE FIGURE vs. VOLTAGE
+20
+10
0
–10
–20
–30
–40
0.1 0.3 1.0 3.0
Vcc = 3.0 V T
A
= –40ºC
T
A
= +25ºC
T
A
= +85ºC
–
10
–
20
–
30
–
40
–
50
–
60
–
70
3.01.00.3
0.1
Vcc = 3.0 V
T
A
= –40ºC
T
A
= +25ºC
T
A
= +85ºC
Gain, G
P
(dB)
Frequency, f (GHz)
GAIN vs. FREQUENCY
0.1 0.3 1.0 3.0
0
–5
–
10
–
15
–
20
–
25
–
30 Vcc = 3.0 V
TA = +85ºC
TA = +25ºC
TA = –40ºC
+5
0
–5
–
10
–15
–20
–25
0.10.31.03.0
V
CC
= 3.0 V
T
A
= –40ºC
T
A
= +25ºC
T
A
= +85ºC
Isolation, ISOL (dB)
Frequency, f (GHz)
ISOLATION vs. FREQUENCY
INPUT RETURN LOSS vs. FREQUENCY
Input Return Loss, RL
IN
(dB)
Frequency, f (GHz) Frequency, f (GHz)
OUTPUT RETURN LOSS vs. FREQUENCY
Output Return Loss, RL
OUT
(dBm)
DISCONTINUED
Vcc:24y/4V
: .25
: ron‘c
TYPICAL PERFORMANCE CURVES (Unless otherwise specified, TA = 25˚C)
Vcc = 3.3 V
Vcc = 3.0 V
Vcc = 2.4 V
–20 –15 –10 –5 +50
-60
-50
-40
-30
-20
-10
0
f
1
= 1 900 MHz
f
2
= 1 901 MHz
+5
0
–5
–10
–15
–20
–25
T
A
= +85ºC
T
A
= –40ºC
T
A
= +25ºC
–30
+10
–30–35 –20 –15 –10 –5 +50–40 –25
V
CC
= 3.0 V
Output Power, P
OUT
(dBm)
Input Power, PIN (dBm)
OUTPUT POWER vs. INPUT POWER
Output Power of Each Tone, POUT (dBm)
Thirf Order Intermodulation Distortion,
IM
3
(dBc)
5.5
5.0
4.5
4.0
3.5
3.0
2.0 2.5 3.0
T
A
= +85 ºC
T
A
= +25 ºC
T
A
= –40 ºC
3.5
1.9 GHz Output Port Matching
2.4 GHz Output Port Matching
Noise Figure, NF (dB)
Voltage, VCC (V)
NOISE FIGURE vs. VOLTAGE
+10
0
+20
–10
–40
–20
–30
0.1 0.3 1.0 3.0
V
CC
= 3.0 V T
A
= –40ºC
T
A
= +25ºC
T
A
= +85ºC
–
10
–
40
–
20
–
30
–
70
–
50
–
60
0.1 0.3 1.0 3.0
TA = +25ºC
TA = –40ºC
VCC = 3.0 V
TA = +85ºC
Gain, G
P
(dB)
Frequency, f (GHz)
GAIN vs. FREQUENCY
Isolation, ISOL (dB)
Frequency, f (GHz)
ISOLATION vs. FREQUENCY
DISCONTINUED
TYPICAL PERFORMANCE CURVES (Unless otherwise specified, TA = 25˚C)
T
A
= +85ºC
T
A
= –40ºC
T
A
= +25ºC
0.1 0.3 1.0 3.0
–
10
–
25
–5
–
15
–
20
–
30
0
V
CC
= 3.0 V
+5
0
–5
–
10
–
15
–
20
–
25
0.1 0.3 1.0 3.0
V
CC
= 3.0 V
T
A
= +85ºC
T
A
= –40ºC
T
A
= +25ºC
Vcc = 3.3 V
Vcc = 3.0 V
Vcc = 2.4 V
–20 –15 –10 –5 +50
-60
-50
-40
-30
-20
-10
0
f
1
= 2 400 MHz
f
2
= 2 401 MHz
INPUT RETURN LOSS vs. FREQUENCY
+5
0
–5
–10
–15
–20
–25
V
CC
= 3.0 V
T
A
= +85ºC
T
A
= –40ºC
T
A
= +25ºC
–30
+10
–30
–35 –20 –15 –10 –5 +5
0
–40 –25
Input Return Loss, RL
IN
(dB)
Frequency, f (GHz) Frequency, f (GHz)
OUTPUT RETURN LOSS vs. FREQUENCY
Output Return Loss, RL
OUT
(dBm)
Output Power, P
OUT
(dBm)
Input Power, PIN (dBm)
OUTPUT POWER vs. INPUT POWER
Output Power of Each Tone, POUT (dBm)
Thirf Order Intermodulation Distortion,
IM
3
(dBc )
THIRD ORDER INTERMODULATION DISTORTION vs.
OUTPUT POWER OF EACH TONE
5.5
5.0
4.5
4.0
3.5
3.0
2.0 2.5 3.0
T
A
= +85ºC
T
A
= +25
T
A
= –40ºC
3.5
2.4 GHz Output Port Matching
Noise Figure, NF (dB)
NOISE FIGURE vs. VOLTAGE
Voltage, VCC (V)
DISCONTINUED
MAG ANG MAG ANG MAG ANG MAG ANG
UPC8179TB
VCC = VOUT = 3.0 V, ICC = 4.0 mA
FREQUENCY S11 S21 S12 S22
GHz MAG ANG MAG ANG MAG ANG MAG ANG
0.1 0.824 -17.1 1.181 -177.7 0.002 108.8 0.996 -2.4
0.2 0.692 -25.9 1.181 -172.4 0.003 64.7 0.986 -4.0
0.3 0.594 -29.2 1.247 -167.4 0.004 51.3 0.980 -5.8
0.4 0.533 -30.7 1.370 -164.1 0.005 55.8 0.965 -7.5
0.5 0.499 -31.1 1.514 -162.4 0.005 60.6 0.958 -8.6
0.6 0.474 -32.0 1.677 -162.9 0.006 46.6 0.950 -10.1
0.7 0.460 -32.7 1.885 -163.8 0.006 42.9 0.941 -11.2
0.8 0.450 -34.0 2.050 -166.3 0.006 45.9 0.935 -12.4
0.9 0.441 -35.6 2.237 -169.2 0.005 42.1 0.929 -13.8
1.0 0.438 -37.7 2.460 -173.1 0.007 34.0 0.918 -14.9
1.1 0.431 -39.8 2.627 -177.3 0.007 46.9 0.914 -16.0
1.2 0.426 -42.0 2.772 178.4 0.005 27.7 0.903 -17.0
1.3 0.427 -44.8 2.965 173.2 0.005 40.2 0.895 -18.3
1.4 0.417 -48.1 3.123 168.0 0.004 24.4 0.891 -19.5
1.5 0.413 -50.6 3.199 161.8 0.006 45.5 0.884 -20.4
1.6 0.408 -54.6 3.351 156.8 0.005 44.6 0.877 -21.1
1.7 0.398 -57.6 3.345 151.2 0.003 42.4 0.867 -22.1
1.8 0.387 -61.6 3.103 145.5 0.005 44.6 0.877 -21.1
1.9 0.380 -64.9 3.361 140.9 0.005 59.5 0.859 -24.4
2.0 0.366 -69.1 3.375 136.3 0.004 45.4 0.852 -25.1
2.1 0.352 -72.1 3.350 132.3 0.003 58.3 0.846 -25.9
2.2 0.341 -75.6 3.304 127.9 0.003 73.9 0.847 -26.4
2.3 0.330 -79.4 3.347 124.8 0.006 81.1 0.839 -27.4
2.4 0.320 -82.4 3.325 121.2 0.006 98.3 0.839 -28.2
2.5 0.304 -85.6 3.275 117.3 0.006 100.5 0.838 -29.1
2.6 0.296 -88.2 3.284 113.7 0.004 114.6 0.834 -29.7
2.7 0.285 -91.7 3.283 111.0 0.005 104.8 0.830 -30.6
2.8 0.272 -94.3 3.224 106.5 0.005 114.1 0.831 -31.4
2.9 0.267 -96.9 3.333 104.3 0.008 127.8 0.837 -32.0
3.0 0.256 -99.5 3.251 101.1 0.009 126.3 0.831 -33.4
3.1 0.248 -101.9 3.381 96.0 0.008 134.1 0.833 -34.0
TYPICAL SCATTERING PARAMETERS (TA = 25˚C)
Coordinates in Ohms
Frequency in GHz
VCC = VOUT = 3.0 V, ICC = 4.0 mA
0.1 G
1.0 G
2.0 G
3.0 G
0.1 G
1.0 G
2.0 G
3.0 G
S11 S22
DISCONTINUED
fl
LILHJ
UPC8179TB
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
L1
C3
C2
AMP-4
IN
OUT
C1
L
2
L
1
C
4
C
5
C
3
C
2
C
6
AMP-4
IN
OUT
C
1
L
2
L
1
C
3
C
4
C
2
C
5
AMP-4
IN
OUT
C
1
1.0 GHz Output Port Matching
C11000 pF
C20.75 pF
C310 pF
L112 nH
1.9GHz Output Port Matching
C1, C3, C5, C61000 pF
C20.75 pF
C410 pF
L13.3 nH
2.4 GHz Output Port Matching
C1, C2, C4, C51000 pF
C310 pF
L11.8 nH
L22.7 nH
COMPONENT LIST
C3C
Top View
Mounting Direction
COMPONENT LIST
COMPONENT LIST
DISCONTINUED
TEST CIRCUITS
UPC8179TB
<1> f = 1.0 GHz
<2> f = 1.9 GHz
<3> f = 2.4 GHz
C
3
Vcc
2, 3, 5
Output port matching circuit
C
1
C
2
1
6
4
50 Ω50 Ω
L
1
IN OUT
C
4
C
5
Vcc
2, 3, 5
Output port matching circuit
C
1
C
2
C
3
1
6
4
50 Ω50 Ω
L
1
IN OUT
C
6
C
3
C
4
Vcc
2, 3, 5
Output port matching circuit
C
1
C
2
1
6
4
50 Ω50 Ω
L
1
IN OUT
C
5
L
2
TEST CIRCUITS
DISCONTINUED
SYSTEM APPLICATION EXAMPLE
OUTLINE DIMENSIONS (Unils m mm)
PACKAGE OUTLINE 506
p I< tag»="" 4="" i="" l="" 2u:‘izi—i—izi:="" "2th="" a="" i="" recommended="" p.c.b.="" layout="" (units="" in="" mm)="" nola.="" aii="" mmensians="" are="" iypicai="" unless="" oiherwise="" specified="" lead="" conn="" (tod="" r~‘|="" c3c="" |_i|_ilj="" i_|i_||_|="" lililj="" i.="" input="" 2.="" gnd="" 3,="" gnd="" 4,="" output="" 5,="" gnd="" 6,="" vcc="" ordering="" part="" numee="" upcewqtbvesva="" nola.="" embossed="" tape,="" a="" m="" direcmn.="" exclusive="" north="" american="" agent="" for="" nec="" re="" microwave="" &="" optoelecthon="" .mmmn="" mm="" momma.="" mw;="" .="" a59n="" pm="" hem="" we="" .="" sam="" mm.="" m="" 950mg="" -(="" data="" sueject="" to="" change="" without="" notice="" 5710="">5-10
UPC8179TB
OUTLINE DIMENSIONS (Units in mm)
PACKAGE OUTLINE S06
1. INPUT
2. GND
3. GND
4. OUTPUT
5. GND
6. VCC
(Bottom View)(Top View)
LEAD CONNECTIONS
PART NUMBER QTY
UPC8179TB-E3-A 3K/Reel
ORDERING INFORMATION
3
2
1
4
5
6
3
2
1
4
5
6
C3C
+0.1
-0
DOT ON
BOTTOM SIDE
+0.1
-0.5
0 ~0.1
0.2
0.15
3
2
16
5
4
0.65
1.3
2.0±0.2
0.65
2.1±0.1
1.25±0.1
0.9 ± 0.1
0.7
EXCLUSIVE NORTH AMERICAN AGENT FOR NEC RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS
CALIFORNIA EASTERN LABORATORIES • Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054-1817 • (408) 919-2500 • Telex 34-6393 • FAX (408) 988-0279
Internet: http://WWW.CEL.COM
05/03/2006
DATA SUBJECT TO CHANGE WITHOUT NOTICE
Note:
Embossed tape, 8 mm wide. Pins 1, 2, 3 are in tape pull-out
direction.
RECOMMENDED P.C.B. LAYOUT (Units in mm)
Note:
All dimensions are typical unless otherwise specified.
RX
SW
Low Noise Tr.
N PLL
.
.
PA
PLL
TX
I
Q
Q
I
DEMOD
φ
0°
90°
SYSTEM APPLICATION EXAMPLE
Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably
be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify CEL for all damages resulting from such improper use or sale.
0.4
0.65 0.65
0.8
1.9
DISCONTINUED
5-11
4590 Patrick Henry Drive
Santa Clara, CA 95054-1817
Telephone: (408) 919-2500
Facsimile:
(
408
)
988-0279
Subject: Compliance with EU Directives
CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant
with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous
Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive
2003/11/EC Restriction on Penta and Octa BDE.
CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates
that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are
exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals.
All devices with these suffixes meet the requirements of the RoHS directive.
This status is based on CEL’s understanding of the EU Directives and knowledge of the materials that
go into its products as of the date of disclosure of this information.
Restricted Substance
per RoHS
Concentration Limit per RoHS
(values are not yet fixed)
Concentration contained
in CEL devices
-A -AZ
Lead (Pb) < 1000 PPM Not Detected (*)
Mercury < 1000 PPM Not Detected
Cadmium < 100 PPM Not Detected
Hexavalent Chromium < 1000 PPM Not Detected
PBB < 1000 PPM Not Detected
PBDE < 1000 PPM Not Detected
If you should have any additional questions regarding our devices and compliance to environmental
standards, please do not hesitate to contact your local representative.
Important Information and Disclaimer: Information provided by CEL on its website or in other communications concerting the substance
content of its products represents knowledge and belief as of the date that it is provided. CEL bases its knowledge and belief on information
provided by third parties and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better
integrate information from third parties. CEL has taken and continues to take reasonable steps to provide representative and accurate
information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. CEL and CEL
suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for
release.
In no event shall CEL’s liability arising out of such information exceed the total purchase price of the CEL part(s) at issue sold by CEL to
customer on an annual basis.
See CEL Terms and Conditions for additional clarification of warranties and liability.
DISCONTINUED
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