Diodes Incorporated | FMMT558TA - Datasheet PDF & Tech Specs
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FMMT558TA

Description:

Trans GP BJT PNP 400V 0.15A 500mW 3-Pin SOT-23 T/R

Country of Origin:

China

Introduction date:

Oct 27, 1997

Updated: 09-MAR-2024


See moreGP BJT by Diodes Incorporated

Online version: https://www.datasheets.com/part-details/fmmt558ta-diodes-incorporated-34948148

overviewOverview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCycleinfo
EU RoHS
rohs yesYes
RoHS Version
2011/65/EU, 2015/863
ECCNinfo
EAR99
Automotive
noNo
Supplier Cage Codeinfo
12060
HTSUSAinfo
8541210095
Schedule Binfo
8541210080
PPAP
noNo
AEC Qualified
noNo
Category Path
Semiconductor > Diodes, Transistors and Thyristors > Bipolar Transistors > GP BJT

pdfDatasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

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buy onlineBuy now

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packagePackage

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Basic Package Type
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Package Family Name
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Supplier Package
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Package Description
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Lead Shape
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Pin Count
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PCB
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Tabinfo
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Package Length (mm)info
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Package Width (mm)info
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Package Height (mm)info
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Seated Plane Height (mm)info
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Pin Pitch (mm)info
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Package Diameter (mm)
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Package Weight (g)
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Package Material
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Mounting
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Package Outline
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Package Overall Height (mm)
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Package Overall Width (mm)
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Package Overall Length (mm)
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Jedec
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Jedec info (PKG outline)
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manufacturingManufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

MSLinfo
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Maximum Reflow Temperature (°C)info
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Reflow Solder Time (Sec)info
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Number of Reflow Cycleinfo
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Standardinfo
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Reflow Temp. Source
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Maximum Wave Temperature (°C)info
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Wave Solder Time (Sec)info
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Lead Finish(Plating)info
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Under Plating Materialinfo
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Terminal Base Materialinfo
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parametricParametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line
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Typical Input Capacitance
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Typical Output Capacitance
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Maximum Collector Cut-Off Current
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Maximum Emitter Cut-Off Current
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Maximum Junction Ambient Thermal Resistance
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Maximum Junction Case Thermal Resistance
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Minimum Storage Temperature
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Maximum Storage Temperature
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Maximum Noise Figure
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Maximum Delay Time
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Maximum Rise Time
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Maximum Turn-On Time
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Maximum Storage Time
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Maximum Fall Time
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Maximum Turn-Off Time
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Maximum Base Current
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Operating Junction Temperature
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Output Power
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Maximum Collector-Emitter Saturation Voltage
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Maximum Base Emitter Saturation Voltage
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Supplier Temperature Grade
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Maximum Diode Forward Voltage
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Maximum Pulsed Collector Current
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Process Technology
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Minimum Transition Frequency
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Typical Transition Frequency
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Collector Current for VCE Saturation
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Maximum Offset Voltage
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Type
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Configuration
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Number of Elements per Chip
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Maximum Collector Base Voltage
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Maximum Emitter Base Voltage
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Maximum Collector-Emitter Voltage
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Maximum DC Collector Current
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Maximum Power Dissipation
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Material
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Minimum DC Current Gain
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Maximum Transition Frequency
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Category
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Minimum Operating Temperature
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Maximum Operating Temperature
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FMMT558TA