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Features
- 33 V Supply Range
- 130 Ω on Resistance
- Fully Specified at ±15 V/+12 V
- 3 V Logic-compatible Inputs
- Rail-to-rail Operation
- Break-before-make Switching Action
- 16-lead TSSOP and 16-lead SOIC_N
- Upgrade for the ADG508A/ADG509A
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The ADG1308 and ADG1309 are monolithic analog multiplexers consisting of eight single channels and four differential channels, respectively. The ADG1308 switches one of eight inputs to a common output as determined by the 3-bit binary address lines A0, A1, and A2. The ADG1309 switches one of four differential inputs to a common differential output as determined by the 2-bit binary address lines A0 and A1. An EN input on both devices is used to enable or disable the device. When disabled, all channels are switched off.
When the switches are on, each switch conducts equally well in both directions and has an input signal range that extends to the power supplies. In the off condition, signal levels up to the supplies are blocked. All switches exhibit break-before-make switching action for use in multiplexer applications. Inherent in the design is the low charge injection for minimum transients when switching the digital inputs.
Fast switching speed coupled with high signal bandwidth makes the parts suitable for video signal switching. CMOS construction ensures ultra low power dissipation, making the parts ideally suited for portable and battery-powered instruments.
APPLICATIONS
- Audio and Video Routing
- Test Equipment
- Data Acquisition Systems
- Battery-powered Systems
- Communication Systems
- Signal Routing
Ask a Question
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Analog Devices Support Portal is a one-stop shop to answer all your ADI questions.
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ADG1309
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ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| ADG1309BRUZ |
16-Lead TSSOP
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| ADG1309BRUZ-REEL7 |
16-Lead TSSOP
|
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| ADG1309BRZ-REEL7 |
16-Lead SOIC
|
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- ADG1309BRUZ
- Pin/Package Drawing
- 16-Lead TSSOP
- Documentation
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HTML
Material Declaration
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HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
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Ultra Librarian
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SamacSys
- ADG1309BRUZ-REEL7
- Pin/Package Drawing
- 16-Lead TSSOP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- ADG1309BRZ-REEL7
- Pin/Package Drawing
- 16-Lead SOIC
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
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Ultra Librarian
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SamacSys
Filter by Model
Part Models
Product Lifecycle
PCN
Apr 5, 2021
- 21_0035
Amkor Philippines as an Alternate Site for TSSOP_4.4
ADG1309BRUZ
PRODUCTION
ADG1309BRUZ-REEL7
PRODUCTION
Jan 20, 2012
- 11_0218
Halogen Free Material Change for Certain TSSOP Products at Carsem
ADG1309BRUZ
PRODUCTION
ADG1309BRUZ-REEL7
PRODUCTION
Jan 27, 2009
- 09_0013
Changes to Idd Specifications on ADG12xx, ADG14xx and ADG13xx datasheets
ADG1309BRUZ
PRODUCTION
ADG1309BRUZ-REEL7
PRODUCTION
ADG1309BRZ-REEL7
PRODUCTION
Oct 13, 2008
- 06_0084
Qualification of the 8" H Wafer Fab process at Analog Devices, Limerick, Ireland.
ADG1309BRUZ
PRODUCTION
ADG1309BRUZ-REEL7
PRODUCTION
Mar 25, 2021
- 21_0080
Amkor Philippines as an Alternate Site for SOICN
ADG1309BRZ-REEL7
PRODUCTION
Feb 6, 2014
- 13_0234
Qualification of ASE Chungli, as an Alternate Assembly Site for Select 16L SOICN Packages
ADG1309BRZ-REEL7
PRODUCTION
Oct 5, 2010
- 10_0146
Halogen Free Material Change for 14/16L SOIC_N Products
ADG1309BRZ-REEL7
PRODUCTION
Filter by Model
Part Models
Product Lifecycle
PCN
Apr 5, 2021
- 21_0035
Amkor Philippines as an Alternate Site for TSSOP_4.4
ADG1309BRUZ
PRODUCTION
ADG1309BRUZ-REEL7
PRODUCTION
Jan 20, 2012
- 11_0218
Halogen Free Material Change for Certain TSSOP Products at Carsem
ADG1309BRUZ
PRODUCTION
ADG1309BRUZ-REEL7
PRODUCTION
Jan 27, 2009
- 09_0013
Changes to Idd Specifications on ADG12xx, ADG14xx and ADG13xx datasheets
ADG1309BRUZ
PRODUCTION
ADG1309BRUZ-REEL7
PRODUCTION
ADG1309BRZ-REEL7
PRODUCTION
Oct 13, 2008
- 06_0084
Qualification of the 8" H Wafer Fab process at Analog Devices, Limerick, Ireland.
Mar 25, 2021
- 21_0080
Amkor Philippines as an Alternate Site for SOICN
ADG1309BRZ-REEL7
PRODUCTION
Feb 6, 2014
- 13_0234
Qualification of ASE Chungli, as an Alternate Assembly Site for Select 16L SOICN Packages
ADG1309BRZ-REEL7
PRODUCTION
Oct 5, 2010
- 10_0146
Halogen Free Material Change for 14/16L SOIC_N Products
ADG1309BRZ-REEL7
PRODUCTION
Software & Part Ecosystem
Evaluation Kits 1
EVAL-16TSSOP
Evaluation Board for 16 lead TSSOP Devices in the Switch/Mux Portfolio
Product Detail
The EVAL-16TSSOPEBZ evaluation board evaluates 16-lead TSSOP devices in the Switches and Multiplexers Portfolio that are purchased separately. A clamp is supplied with the EVAL-16TSSOPEBZ to secure a 16-lead TSSOP device to the evaluation board without the need for soldering, making the board reusable for multiple devices.
A 16-lead TSSOP device can be clamped or soldered to the center of the evaluation board. Each pin of the device has a corresponding link from K1 to K16 that can be set to either VDD or GND. A wire screw terminal supplies VDD and GND. SMB connectors on the board allow additional external signals to be supplied to the device. In addition, there is space available at the top of the board for prototyping.
Full specifications of the device under test (DUT) are available in the corresponding product data sheet, which should be consulted in conjunction with this user guide when using the evaluation board.
