PMBZ5244B-T by NXP Semiconductors | Zener Diodes | Partstack
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PMBZ5244B-T

NXP Semiconductors

PMBZ5244B-T by NXP Semiconductors

ZENER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

1

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 667 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

667

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 3,457 parts In-Stock

1+ parts

-

100+ parts

$4.980

1k+ parts

-

10k+ parts

-

3,457

-

$4.980

-

-

UNI Independent Distributors

Spain . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Technical Specifications

Zener Diodes PMBZ5244B-T attributes and parameters. Explore more Zener Diodes devices from NXP Semiconductors

Package Body Material:

PLASTIC/EPOXY

Working Test Current:

9 mA

Config:

SINGLE

Diode Type:

JEDEC-95 Code:

TO-236AB

Maximum Voltage Temperature Coefficient:

9.38 mV/Cel

Surface Mount:

YES

Maximum Reverse Current:

.1 uA

Maximum Voltage Tolerance:

5 %

Diode Element Material:

SILICON

No. of Terminals:

3

Qualification:

Not Qualified

Terminal Position:

Package Style (Meter):

SMALL OUTLINE

Technology:

ZENER

JESD-30 Code:

R-PDSO-G3

Nominal Reference Voltage:

14 V

No. of Elements:

1

Package Shape:

Maximum Power Dissipation:

.25 W

Terminal Form:

Additional Features:

TEMPERATURE COEFFICIENT IS TYPICAL

Polarity:

UNIDIRECTIONAL

Maximum Operating Temperature:

150 Cel

Trade Compliance

PMBZ5244B-T Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Sales

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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