CAT1024RI-42TE13 by Onsemi | Power Management ICs | Partstack
Loading...

CAT1024RI-42TE13

Onsemi

CAT1024RI-42TE13 by Onsemi

POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE; Surface Mount: YES;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 200 parts In-Stock

1+ parts

$0.627

100+ parts

-

1k+ parts

-

10k+ parts

-

200

$0.627

-

-

-

Northwest PG Solutions

USA . 12 parts In-Stock

1+ parts

$0.690

100+ parts

-

1k+ parts

-

10k+ parts

-

12

$0.690

-

-

-

Kulean Microsystems

USA . 8,387 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,387

-

-

-

-

Problanco Electronics

Mexico . 5,323 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,323

-

-

-

-

SupplyDigital Components

Austria . 3,796 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,796

-

-

-

-

TANS Electronics

Latvia . 2,640 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,640

-

-

-

-

UHIMA Technologies

Türkiye . 861 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

861

-

-

-

-

Corphita

USA . 156 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

156

-

-

-

-

Technical Specifications

Power Management ICs CAT1024RI-42TE13 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Package Body Material:

PLASTIC/EPOXY

Width (mm):

3 mm

Maximum Seated Height:

1.1 mm

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Terminal Finish:

TIN LEAD

No. of Terminals:

8

Terminal Position:

DUAL

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Technology:

CMOS

JESD-30 Code:

S-PDSO-G8

Package Shape:

Terminal Form:

GULL WING

Maximum Operating Temperature:

85 Cel

No. of Channels:

1

Package Code:

Nominal Supply Voltage (Vsup):

5 V

Moisture Sensitivity Level (MSL):

1

JESD-609 Code:

e0

Minimum Operating Temperature:

-40 Cel

No. of Functions:

1

Qualification:

Not Qualified

Length:

3 mm

Adjustable Threshold:

NO

Terminal Pitch:

.65 mm

Temperature Grade:

Maximum Supply Voltage (Vsup):

5.5 V

Trade Compliance

CAT1024RI-42TE13 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20