© 2004 California Micro Devices Corp. All rights reserved.
04/21/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 1
CM1425
PRELIMINAR
Y
4 Channel EMI Filter Array with ESD Protection
Features
• Four channels of EMI filtering with ESD protection
• Pin compatible with CMD’s CSPRC032A
• Greater than 30dB attenuation over the 800MHz to
3GHz frequency range
•±15kV ESD protection (IEC 61000-4-2, contact
discharge)
•±30kV ESD protection (HBM)
• 9-bump, 2.470mm x 0.970mm footprint Chip Scale
Package (CSP)
• Available with Optiguard™ coating for improved
reliability
• Lead-free versions available
Applications
• FIltering for antenna and keypad data lines
• I/O port protection for mobile handsets, notebook
computers, PDAs etc.
• EMI filtering for data ports in cell phones, PDAs or
notebook computers.
• EMI filtering for LCD and chip-to-chip data lines in
mobile electronic devices that use flexible PCB
interconnections
Product Description
CAMD's CM1425 is an EMI filter array with ESD pro-
tection, which integrates 4 pi filters (C-R-C). The
CM1425 has component values of 20pF-100Ω-20pF.
The parts include ESD protection diodes on every pin,
which provide a very high level of protection for sensi-
tive electronic components that may be subjected to
electrostatic discharge (ESD). The ESD diodes con-
nected to the filter ports are designed and character-
ized to safely dissipate ESD strikes of ±15kV, beyond
the maximum requirement of the IEC 61000-4-2 inter-
national standard. Using the MIL-STD-883 (Method
3015) specification for Human Body Model (HBM)
ESD, the pins are protected for contact discharges at
greater than ±30kV.
This device is particularly well suited for portable elec-
tronics (e.g. mobile handsets, PDAs, notebook comput-
ers) because of its small package format and easy-to-
use pin assignments. In particular, the CM1425 is
ideal for EMI filtering and protecting data lines from
ESD in wireless handsets.
All CM1425 devices are optionally available with Opti-
Guard™ coating which results in improved reliability at
assembly. These devices are also available with stan-
dard and lead-free finishing. The CM1425 is housed in
a space-saving, low-profile, chip-scale package and is
fabricated with California Micro Devices' Centurion™
processes.
Electrical Schematic
100
Ω
20pF20pF
FILTER+ESD1*FILTER+ESD1*
100
Ω
20pF20pF
FILTER+ESD2*
FILTER+ESD2*
100
Ω
20pF20pF
FILTER+ESD3*
GND
FILTER+ESD3*
(Pin B3)
100
Ω
20pF20pF
FILTER+ESD4*
FILTER+ESD4*
© 2004 California Micro Devices Corp. All rights reserved.
2430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 04/21/04
CM1425
PRELIMINAR
Y
Ordering Information
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
PIN DESCRIPTIONS
PIN(s) NAME DESCRIPTION PIN(s) NAME DESCRIPTION
A1 FILTER+ESD1 Filter Channel 1 B1 FILTER+ESD1 Filter Channel 1
A2 FILTER+ESD2 Filter Channel 2 B2 FILTER+ESD2 Filter Channel 2
A4 FILTER+ESD3 Filter Channel 3 B4 FILTER+ESD3 Filter Channel 3
A5 FILTER+ESD4 Filter Channel 4 B5 FILTER+ESD4 Filter Channel 4
B3 GND Device Ground
B3B4B5
A4A5
B1
A1
B2
A2
B3B4B5
A4A5
B1
A1
B2
A2
N253
32541
B
A
Orientation
Marking
(see note 2)
N251
32541
B
A
Orientation
Marking
(see note 2)
PACKAGE / PINOUT DIAGRAMS
Notes:
CM1425-01
CSP Package (No coating)
BOTTOM VIEW
(Bumps Up View)
TOP VIEW
(Bumps Down View)
1) These drawings are not to scale.
2)
Lead-free devices are specified by using a "+" character for the top side orientation mark.
CM1425-03
CSP Package (OptiGuard
™
coating)
PART NUMBERING INFORMATION
Bumps PKG
Standard Finish Lead-free Finish2
No Coating Optiguard™ Coated No Coating Optiguard™ Coated
Ordering Part
Number1
Part
Marking
Ordering Part
Number1
Part
Marking
Ordering Part
Number1
Part
Marking
Ordering Part
Number1
Part
Marking
9 CSP CM1425-01CS N251 CM1425-03CS N253 CM1425-01CP N251 CM1425-03CP N253
© 2004 California Micro Devices Corp. All rights reserved.
04/21/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 3
CM1425
PRELIMINAR
Y
Specifications
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1,
then clamping voltage is measured at Pin C1.
Note 4: Unused pins are left open
Note 5: These parameters are guaranteed by design and characterization.
ABSOLUTE MAXIMUM RATINGS
PARAMETER RATING UNITS
Storage Temperature Range -65 to +150 °C
Power Rating per Resistor 100 mW
Package Power Rating 300 mW
STANDARD OPERATING CONDITIONS
PARAMETER RATING UNITS
Operating Temperature Range -40 to +85 °C
ELECTRICAL OPERATING CHARACTERISTICS1
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
R Resistance 80 100 120 Ω
C Capacitance At 2.5V DC, 1MHz, 30mV AC 16 20 24 pF
VDIODE Diode Standoff Voltage IDIODE = 10µA5.5 V
ILEAK Diode Leakage Current (reverse bias) VDIODE = 3.3V 100 nA
VSIG Signal Voltage
Positive Clamp
Negative Clamp
ILOAD = 10mA
ILOAD = -10mA
5.6
-1.5
6.8
-0.8
9.0
-0.4
V
V
VESD In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC 61000-4-
2 Level 4
Notes 2,4 and 5
±30
±15
kV
kV
VCL Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Positive Transients
Negative Transients
Notes 2,3,4 and 5
+12
-7
V
V
fCCut-off Frequency
ZSOURCE=50Ω, ZLOAD=50Ω
R = 100Ω, C = 20pF
86 MHz
© 2004 California Micro Devices Corp. All rights reserved.
4430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 04/21/04
CM1425
PRELIMINAR
Y
Performance Information
.
Figure 1. CM1425 Filter Typical Measured Frequency Response
Figure 2. Filter Capacitance vs. Input Voltage over Temperature
(normalized to capacitance at 2.5VDC and 25°C)
© 2004 California Micro Devices Corp. All rights reserved.
04/21/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 5
CM1425
PRELIMINAR
Y
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages
offered by California Micro Devices.
Figure 3. Recommended Non-Solder Mask Defined Pad Illustration
Figure 4. Eutectic (SnPb) Solder
Ball Reflow Profile
Figure 5. Lead-free (SnAgCu) Solder
Ball Reflow Profile
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER VALUE
Pad Size on PCB 0.275mm
Pad Shape Round
Pad Definition Non-Solder Mask defined pads
Solder Mask Opening 0.325mm Round
Solder Stencil Thickness 0.125 - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.330mm Round
Solder Flux Ratio 50/50 by volume
Solder Paste Type No Clean
Pad Protective Finish OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball +50µm
Solder Ball Side Coplanarity +20µm
Maximum Dwell Time Above Liquidous 60 seconds
Soldering Maximum Temperature 260°C
Solder Mask Opening
0.325mm DIA.
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
200
250
150
100
50
0 1:00.0 2:00.0 3:00.0 4:00.0
Time (minutes)
Temperature (°C)
© 2004 California Micro Devices Corp. All rights reserved.
6430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 04/21/04
CM1425
PRELIMINAR
Y
Mechanical Details
CM1425 devices are packaged in a custom Chip Scale
Packages (CSP) and available with optional Opti-
Guard™ coating.
.
CM1425 9-bump CSP Mechanical Specifications
The CM1425 devices are packaged in a 9-bump cus-
tom Chip Scale Package (CSP). Dimensions are pre-
sented below.
Note 1: Applies to uncoated devices only.
Note 2: Applies to OptiGuard (coated) devices only.
Package Dimensions
CM1425 9-bump Chip Scale Package
PACKAGE DIMENSIONS
Package Custom CSP
Bumps 9
Dim Millimeters Inches
Min Nom Max Min Nom Max
A1 0.925 0.970 1.015 0.0364 0.0382 0.0400
A2 2.425 2.470 2.515 0.0955 0.0972 0.0990
B1 0.495 0.500 0.505 0.0195 0.0197 0.0199
B2 0.495 0.500 0.505 0.0195 0.0197 0.0199
C1 0.185 0.235 0.285 0.0073 0.0093 0.0112
C2 0.185 0.235 0.285 0.0073 0.0093 0.0112
D110.562 0.606 0.650 0.0221 0.0239 0.0256
D210.356 0.381 0.406 0.0140 0.0150 0.0160
D320.600 0.670 0.739 0.0236 0.0264 0.0291
D420.394 0.445 0.495 0.0155 0.0175 0.0195
# per tape
and reel
3500 pieces
Controlling dimension: millimeters
Mechanical Package Diagrams
4
5
B
C1
B1
A1
B2 C2
D1
D2
A2
BOTTOM VIEW
SIDE
VIEW
A
1
2
3
DIMENSIONS IN MILLIMETERS
AB
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
SOLDER BUMPS
95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)
4
5
B
C1
B1
A1
B2 C2
D3
D4
A2
BOTTOM VIEW
SIDE
VIEW
A
1
2
3
AB
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
SOLDER BUMPS
95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)
OptiGuardTM
Coating
Non-coated CSP
OptiGuard™ Coated CSP
© 2004 California Micro Devices Corp. All rights reserved.
04/21/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 7
CM1425
PRELIMINAR
Y
Mechanical Details (cont’d)
CSP Tape and Reel Specifications
Figure 6. Tape and Reel Mechanical Data
PART NUMBER PKG. SIZE (mm)
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIA.
QTY
PER
REEL P0P1
CM1425-01 2.470 X 0.970 X 0.606 2.62 X 1.12 X 0.762 8mm 178mm (7") 3500 4mm 4mm
CM1425-03 2.470 X 0.970 X 0.670 2.62 X 1.12 X 0.762 8mm 178mm (7") 3500 4mm 4mm
Top
For tape feeder reference
Cover
Tape
P
1
only including draft.
Concentric around B.
K
o
Embossment
User Direction of Feed
±
0.2 mm
P
o
Center Lines
of Cavity
W
10 Pitches Cumulative
Tolerance On Tape
A
o
B
o