M27C1001-12XN1XTR by STMicroelectronics | OTP ROM | Partstack
Loading...

M27C1001-12XN1XTR

STMicroelectronics

M27C1001-12XN1XTR by STMicroelectronics

OTP ROMs; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: TSSOP; Package Shape: RECTANGULAR; Power Supplies (V): 5;

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,070 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,070

-

-

-

-

Anansix

USA . 507 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

507

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 563 parts In-Stock

1+ parts

$3.972

100+ parts

-

1k+ parts

$3.574

10k+ parts

-

563

$3.972

-

$3.574

-

MKK Technologies

India . 2,276 parts In-Stock

1+ parts

$7.468

100+ parts

-

1k+ parts

-

10k+ parts

-

2,276

$7.468

-

-

-

DigiPath Technology Company

USA . 2,276 parts In-Stock

1+ parts

$7.468

100+ parts

-

1k+ parts

-

10k+ parts

-

2,276

$7.468

-

-

-

Andel Nordic

Denmark . 2,916 parts In-Stock

1+ parts

$63.259

100+ parts

$54.222

1k+ parts

-

10k+ parts

-

2,916

$63.259

$54.222

-

-

Parana Technologies

USA . 1,241 parts In-Stock

1+ parts

-

100+ parts

$4.749

1k+ parts

-

10k+ parts

-

1,241

-

$4.749

-

-

Technical Specifications

OTP ROM M27C1001-12XN1XTR attributes and parameters. Explore more OTP ROM devices from STMicroelectronics

Package Body Material:

PLASTIC/EPOXY

Maximum Standby Current:

.0001 Amp

Organization:

128KX8

Output Characteristics:

3-STATE

Sub-Category:

OTP ROMs

Surface Mount:

YES

Maximum Supply Current:

30 mA

Terminal Finish:

Tin/Lead (Sn/Pb)

No. of Terminals:

32

No. of Words:

131072 words

Terminal Position:

DUAL

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Technology:

CMOS

JESD-30 Code:

R-PDSO-G32

Package Shape:

Terminal Form:

GULL WING

Maximum Operating Temperature:

70 Cel

Package Code:

Input/Output Type:

COMMON

Memory Density:

1048576 bit

JESD-609 Code:

e0

Minimum Operating Temperature:

0 Cel

Memory Width:

8

Package Equivalence Code:

TSSOP32,.8,20

Maximum Access Time:

120 ns

No. of Words Code:

128K

Nominal Supply Voltage / Vsup (V):

5

Terminal Pitch:

.5 mm

Temperature Grade:

Power Supplies (V):

5

Trade Compliance

M27C1001-12XN1XTR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20